Type (Layers)
1-Layer
2-Layer Plated through
4-Layer Multilayer
6-Layer Multilayer
8-Layer Multilayer
10-Layer Multilayer
12-Layer Multilayer
14-Layer Multilayer
16-Layer Multilayer
18-Layer Multilayer
20-Layer Multilayer
22-Layer Multilayer
24-Layer Multilayer
26-Layer Multilayer
28-Layer Multilayer
PCB Name
Size
x
mm
Quantity
Working Days
8 WD (Standard)
6 WD (Surcharge 50%)
5 WD (Surcharge 70%)
4 WD (Surcharge 90%)
3 WD (Surcharge 110%)
2 WD (Surcharge 125%)
Surface
HAL leadfree
HAL PbSn (NOT ROHS compliant)
Chemical tinn
Chemical silver
Chemical gold
Copper blank
Trackwidth /-space,
150 µm and larger
125 µm and larger
100 µm and larger
75 µm and larger *
50 µm and larger *
Drills
0.3 mm and bigger
0.2 mm and bigger
0.1 mm and bigger *
Material
FR4 3.2 mm
FR4 2.4 mm
FR4 2.0 mm
FR4
1.55 mm
FR4
1.2 mm
FR4
1.0 mm
FR4
0.8 mm
FR4 0.5 mm (only with chem. Surface)
FR4 0.3 mm (only with chem. Surface) *
G200 1.55 mm ¹ (HTG 185)
P97 1.55 mm ¹ (HTG 260)
Rogers 4350 0,8 mm ¹
Rogers 4350 1,55 mm ¹
Cu Final Thickness
35
µm
70 µm
105 µm
140 µm * (only with chem. Surface)
210 µm * (only with chem. Surface)
400 µm * (only with chem. Surface)
Solderstop
Both Sides
One Sided TOP
One Sided BOT
Without
Green
Black
Blue
White
Red
Peelable Solderstop
Without (Standard)
One Sided TOP
One Sided BOT
Both Sides
Marking Print
Both Sides
One Sided TOP
One Sided BOT
Without
White
Yellow
Black
Scoring
No
Yes
Milling
E-Test
Yes (included in 2+ layers)
No
UL-Marking
Without (Standard)
Yes (In marking print TOP)
Yes (In marking print BOT)
Yes (In solderstop TOP)
Yes (In solderstop BOT)
Yes (In copper TOP)
Yes (In copper BOT)
Leadfree-Marking
Without (Standard)
Yes (In marking print TOP)
Yes (In marking print BOT)
Yes (In solderstop TOP)
Yes (In solderstop BOT)
Yes (In copper TOP)
Yes (In copper BOT)
Sideplating
No
Yes
Plated Through Slits
No
Yes
Gold fingers
- Chamfered border
No
Yes (20°)
Yes (45°)
Z-Axis Milling
Pressfit
No
Yes