Design Parameters

A, B, C

via, buried via

aspect ratio
final diameter
via pad
annular ring

1:10
100µm
300µm
100µm (enclosing)

E

blind via, laser

aspect ratio
final diameter
via pad
annular ring

1:1
75µm
225µm
75µm* (enclosing)

F

stacked via

Should be avoided, due to it`s disproportionately high use of time and effort. Please contact always our CAM department for alternatives.

aspect ratio
final diameter
via pad
annular ring

1:1 - 1:12 **
100µm
300µm
100µm

G

staggered via

aspect ratio
final diameter
via pad
annular ring

1:1 - 1:12 **
100µm
300µm
100µm

J

conductor / pad to milling edge

spacing

200µm

L

solder-stop coating

spacing
bridge width

50µm (enclosing)
100µm

* Annular ring depends on copper thickness! Please ask for critical designs.
** Aspekt ratio depends on Ø. 100µm 1:1, >100µm 1:4, >150µm 1:10, >200µm 1:12