SMD-Stencils are precision tools which have to comply with high requirements, as they take a key role in the SMT (surface mount technology) process. We offer following SMD-Stencils:
Solder paste stencils are used to apply solder depots on printed circuit boards with a screen printing technique. SMD components (SMD = surface mounted device) are placed within these depots subsequently and soldered with a following reflow- or vapor phase process.
Stencils for adhesives are primarily used for mixed assembly, as substitution for a dispenser, and are necessary before component mounting and wave soldering.
Our lasered SMD-Stencils (made of stainless steel) allow a precise placement and strenght-of-shape of the solder- / adhesive- depots on the PCB and therefore accomodate the small track-widths and spacings as well as the hightech multipin components. Our SMD-Stencils are perfectly suited for finepitch and BGA assembly.
Terms in this Design-Aid:
top side = squeegee side, top view
bot side = opposite side of squeegee, bottom view
aperture = hole in the stencil, stencil pad
