Layer buildups for Metal Core

The standard layer buildups for metal core circuit boards are as follows. Please also observe the technical options for metal core circuit boards.

Layer buildup Metal Core 1 layer 35µm Cu

Layer buildup Metal Core 1 layer 140µm Cu

Layer buildup Metal Core 2 layers plated-through

Additional information:

Design-Rules for layer buildups
Technical options for Metal Core boards
Available prepregs, cores, and foils
Standard layer buildup: Series, Prototypes, Flex, Rigid-Flex, Metal Core
Available technology: Metal Core boards

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Pricing Examples

Printed Circuit Boards always include:

- E-Test
- Solder-stop 2x
- Marking print 1x
- Gerber-Import
- Scoring (series)
- Design-Rule-Check

- Tooling costs
- Photoplot
- Conductors 150μm
- Drill holes 0,3mm
- Unlimited drilling
- HAL, FR4 1,6, 35μm Cu

Prototypes

2 layers - 6 WD	41,- €
1 Printed circuit board 100x100mm
4 layers - 8 WD	118,- €
1 Printed circuit board 160x100mm
6 layers - 8 WD	148,- €
1 Printed circuit board 160x100mm

Series

e.g. 100 pcs. Eurocard 100x160mm

2 layers - each	4,92 €

4 layers - each	7,05 €

6 layers - each	10,67 €

8 layers - each	16,99 €

SMD Stencils

max. 200x300mm - 3WD	47,50 €
1 Stencil, including 1000 pads
max. 600x600mm - 3WD	90,44 €
1 Stencil, including 2500 pads

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