Panel Creation

For cost-saving or technical reasons (such as improved assembly),multiple circuit boards may be combined to form a “panel. This panel is then produced just as a single large circuit board. A separation of the panel does not occur!

Always clarify the panel design with your assembly partner; pay attention to fiducials marks or mounting  holes!

Use our panel configurator during online order: With just a few inputs, you can configure your multiplier panel. In addition, a full-scale preview of your pcb panel is displayed within the order process. No additional panel -drawing / -release is necessary.

Panel types:

PCB multiplier panel - exemplary

Multiplier panel

Identical PCBs within panel

PCB mixed multiplier panel - exemplary

Mixed multiplier panel

Different PCBs within panel

Mechanical processing

  • Scoring
  • Milling with bridges / with bridges and mousebites
  • Milling / scoring combination
  • without mech. processing

Already included: panel creation

  • Panel data provided by the customer
  • Panel composed by Multi-CB
  • Customer approval / panel-release required, better: user panel configurator in the PCB calculator

X-out

  • Standard: A damaged printed circuit board (according to E-test) is not removed from the panel, but marked (X-out). This must be taken into account for assembly.
  • Special production: If you do not want an X-out, select "No X-out" in the PCB calculator.

 

The Multi-CB technology hotline will assist you: +49 (0) 8104 628 210

Mechanical processing / Panel separation

ScoredMilled with bridgesMilled with bridges & mousebites
ScoredLeiterplatte geritztMilled with bridgesLeiterplatte gefräst mit BrückenMilled with bridges & mousebitesLeiterplatte mit perforierten Brücken
Scored-Milled with bridgesBridges are placed by Multi-CB Milled with bridges & mousebites Bridges and mousebites are placed by Multi-CB

Design Parameters

 Min. spacing of conductor / Cu to contourMin. Spacing between PCBsLine thickness of PCB contourRecommended surounding frame
 Scored panelMin. spacing of conductor / Cu to contour500µm (0,5mm)Min. Spacing between PCBs0,0mm / ≥ 5,5mmLine thickness of PCB contour1 mil (0.01mm)Recommended surounding frame5-10mm
 Milled panelMin. spacing of conductor / Cu to contour200µm (0,2mm)Min. Spacing between PCBs2,0mmLine thickness of PCB contour-Recommended surounding frame5-10mm

Multiplier panel

Multiple identical circuit board layouts are composed to form one panel. The completed panel is scored, or partially milled-out to provided the contained PCBs with bridges for breaking out.

Multiplier scored

PCB multiplier panel scored

When designing the panel, please observe that a spacing of 0,0mm is left between the circuit boards. If a spacing between the (scored) PCBs is required, please leave a gap of min. 5,0mm.

The contour line thickness should be 0,01mm / 1 mil.

Because of the tolerances when breaking out the single circuit boards, all conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge (see scoring).

We recommend using scoring technology only for panels with a circuit board thickness of at least 1mm (stability).

Multiplier panel scored – design advice as PDF.

Multiplier milled

PCB multiplier panel milled

When designing the panel, please observe that a spacing of 2,0mm is left between the circuit boards.

All conductor traces and copper areas should have a spacing of at least 200µm from the milling edge.

If no bridges are defined by the customer, these will be inserted by Multi CB! Optimum width for the bridges: 1,0 - 1,5mm.

Multiplier panel milled – design advice as PDF.

Mixed multiplier panels

For complex panels, multiple different circuit board layouts can be composed onto one panel. The completed panel is scored, or partially milled, to provided the contained PCBs  with bridges for breaking out.

Mixed multiplier scored

PCB mixed multiplier panel scored

When designing the panel, please observe that a spacing of 0,0mm is left between the circuit boards.  If a spacing between the (scored) PCBs is required, please leave a gap of min. 5,0mm. For jump scoring a distance of 15mm is required.

The contour line thickness should be 0.01mm / 1 mil.

Because of the tolerances when breaking out the individual circuit boards, all conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge (see scoring).

We recommend using scoring technology only for panels with a circuit board thickness of at least 1,0mm (stability).

Mixed multiplier panel scored – design advice as PDF.

Mixed multiplier milled

PCB mixed multiplier panel milled

When designing the panel, please observe that a spacing of 2,0mm is left between the circuit boards. For reasons of stability, a distance of 10mm is usually recommended.

All conductor traces and copper areas should have a spacing of at least 200µm from the milling edge.

If no bridges are defined by the customer, these will be inserted by Multi CB Optimum width for the bridges: 1,0 to 1,5mm.

Mixed multiplier panel milled – design advice as PDF.

Example for milling/scoring combination

PCB multiplier panel scoring and milling

When designing the panel, please observe that a spacing of 0,0mm is calculated between scored parts, and preferably 2,0mm between milled parts.

All conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge, and at least 200µm from the milling edge!

Example for milling - scoring combination as PDF.

Milling/scoring combination hassle-free

If the outer edge of the milling lies on the scoring line, the milling tool moves along the scored base material. This increases the risk of forming of chips.

Advice: Do not mill directly aligned with scribe lines.

We manufacture PCBs with milling and scoring on the same line. Should this result in  shaving (chip) formation, a reclamation in this regard would be rejected.

Printed circuit board milling and scoring - avoid problems 1

Milling meets scoring line at the panel frame (grid)

Printed circuit board milling and scoring - avoid problems 2

Milling and scoring on one line leads to chip formation