Special production circuit boards

The economical solution for circuit boards with high-tech options (for example, 1 to 48 layers, laser Vias, via plugging) and special circuit boards (for example, flexible or metal core circuit boards).

Our circuit board calculator will show you the most economical price at any time. Special board types can be quoted through the request form.

High-tech options

PCB special production
  • Circuit boards up to 48 layers
  • Flexible boards up to 8 layers
  • Rigid-Flex up to 14 layers
  • Aluminium core, with plated contacts
  • Ultra-fine conductor widths from 50µm
  • Film-free laser direct imaging
  • Micro vias starting at 75µm
  • Blind and buried vias
  • Laser vias
  • Via plugging / stacking
  • Plated half-holes
  • Thin laminates starting at 50µm core
  • Custom layer buildup
  • Sandwich buildup
  • Plated slots
  • Thick copper
  • Circuit board thicknesses up to 7mm
  • Depth milling (Z axis)
  • Impedance control
  • Special colours and coatings
  • Removable solder-stop
 

Special board types

The following special circuit board types are available from Multi CB:
- Flexible circuit boards
- Rigid-Flex circuit boards
- High frequency circuit boards
- High Tg circuit boards (high temperature resistance)
- Metal core circuit boards (with plated contacts)
- Thick copper circuit boards

Technical options for flexible circuit boards

    Notes
Design 1 to 8 layers, plated contacts Layer buildup
Conductor width min. 75µm  
Annular rings min. 125µm  
Vias min. Ø 200µm  
Surfaces Immersion gold (recommended), immersion tin, Lead-free HAL Available prepregs
Materials Polyimide, high Tg polyimide Available materials
Material thickness starting at 44µm incl. Copper (1 layer)  
Max. size 250mm x 450mm  
Solder-stop coating Coverlay or flexible solder-stop  

Technical options for Rigid-Flex circuit boards

    Notes
Design 2 to 24 layers, incl. "Flying tails" Layer buildup
Conductor width min. 75µm  
Annular rings min. 125µm  
Vias min. Ø 200µm  
Surfaces Immersion gold (recommended), immersion tin, Lead-free HAL  
Materials Polyimide, high Tg polyimide, FR4, FR4 high Tg  
Material thickness Polyimide starting at 62µm dual-sided, FR4 starting at 100µm  
Max. size 250mm x 450mm  
Solder-stop coating Coverlay or flexible solder-stop  

Technical options for high Tg circuit boards

Material CTE-z ppm/°C Tg Td260 Td288 Td Value Data sheet
Isola Duraver (FR4) 53 135°C 60 min. - 350°C Isola E-Cu 104i
Isola IS410 (CAF* enhanced) 55 170°C 60 min. 30 min. 360°C Isola IS410
Isola IS420 40 165°C 60 min. 15 min. 340°C Isola IS420
Isola P97 60 260°C - 18 min. - Isola P97
Isola G200 140 185°C 20 min 8 min. - Isola G200
Rogers 4350B 50 280°C -   390°C Rogers 4350B

*Conductive Anodic Filament, an undesirable conducting filament in the substrate of a circuit board

Technical options for metal core circuit boards

1 layer   Notes
Material Aluminium core, FR4 covering Data sheet 1 layer
Max. size 230mm x 380mm  
Aluminium thickness 1.5mm, 2.0mm  
Initial copper 35µm (for 1.5mm), 140µm (for 2.0mm)  
Surface Lead-free HAL, immersion gold, immersion tin  
RoHS compliant yes  
2 layers plated through   Notes
Material Aluminium core, FR4 covering Data sheet 2 layers
Max. size 600mm x 600mm  
Aluminium thickness 1.2mm, 1.5mm, 1.6mm In stock
  0.8mm, 1.0mm, 2.0mm On request
Basis copper 18µm, 35µm, 70µm, 105µm, 140µm  
Surface Lead-free HAL, immersion gold, immersion tin  
RoHS compliant yes  
Design parameters   Notes
Min. conductor width 200µm  
Min. conductor spacing 200µm  
Min. annular ring 150µm  
Min. via (pth) 0.3mm Aspect ratio 1:5
Min. Via spacing 1.0mm  
Min. drilling (npth) 1.0mm  
Technical properties Unit 1 layer 2L- CCAF -01 2L- CCAF -04 2L- CCAF -05 Test method
Thermal conductivity factor W / m*k 0.67 1 1.5 2.2 ASTM-D 5470
Dielectric constant εr(permittivity) (for 1 MHz) 4.7 4.2 4.2 4.24 IEC-61189
Loss factor (for 1 MHz) 0.018 0.02 0.02 0.033 IEC-61189
Surface resistance MΩ 1.1 *10^6 5*10^7 5*10^7 3.68 *10^7 IEC-61189
Thermal durability °C / W - 1 0.65 0.45 ASTM-E 1225
Glass transition dielectric °C 130 - - - IPC-TM150

Technical options for thick copper circuit boards

Inner layer    
Copper foil thickness Min. conductor width Min. conductor spacing
140µm 300µm 300µm
210µm 500µm 500µm
400µm** 900µm 900µm
Outer layer      
Copper foil thickness   Min. conductor width Min. conductor spacing
Basis copper Final thickness*    
140µm 175µm 350µm 350µm
210µm 245µm 500µm 500µm
400µm** 435µm** 900µm 900µm

* after electroplating
** only on request

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Pricing Examples

Printed Circuit Boards always include:

- E-Test
- Solder-stop 2x
- Marking print 1x
- Gerber-Import
- Scoring (series)
- Design-Rule-Check

- Tooling costs
- Photoplot
- Conductors 150μm
- Drill holes 0,3mm
- Unlimited drilling
- HAL, FR4 1,6, 35μm Cu
Prototypes
2 layers - 6 WD
41,- €
1 Printed circuit board 100x100mm
4 layers - 6 WD
118,- €
1 Printed circuit board 160x100mm
6 layers - 8 WD
148,- €
1 Printed circuit board 160x100mm
Series
e.g. 100 pcs. Eurocard 100x160mm
2 layers - each
4,76 €
 
4 layers - each
7,41 €
 
6 layers - each
11,20 €
 
8 layers - each
16,05 €
 
SMD Stencils
max. 200x300mm - 3WD
47,50 €
1 Stencil, including 1000 pads
max. 600x600mm - 3WD
90,44 €
1 Stencil, including 2500 pads

We solely sell to entrepreneurs.
Prices plus VAT and delivery costs.

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News

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17.04.2013
Better prices, shorter production times

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01.12.2012
4 layer prototypes even faster!

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