We prepare and optimise your data for the production process:
a) We crop the copper at the PCB edges (shaving):
- 200µm spacing to milling edges
- 500µm spacing to scoring edges
- 200µm circular for npth drills
Note: Short-circuits are avoided if the PCBs are to be inserted into conductive housings, avoidance of injuries and better durability of the boards.
b) Scale-up of the solder-stop mask:
When solder-stop is applied, a certain production tolerance and thus a small offset to the conductive pattern is possible. To prevent your pads from being overprinted by solderstop, we scale-up the pad`s clearance (if necessary) 50-125µm, depending on the design.
c) Optimisation of the marking print in relation to the pads (clipp-off):
The marking print is cropped for 100µm from the solder-stop mask. This is necessary, as overprinted solder-pads give solderability problems.
d) Font width of the marking print:
The font width of the marking print will be scaled up to a minimum of 150-180µm (design related), otherwise the marking print is to small, blurry or non-existent.