Skip to main content


Vias are plated through holes in a printed circuit board. They connect multiple copper layers, but they are too small for THT components.

On multilayer boards with high-density circuits you may use special vias. A connection between one outer layer and inner layers is called Blind Via. A Buried Via connects at least two inner layers. Because such vias do not drill all layers you achieve more functionality in less board space.

Back to list