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In printed circuit board technology, X-Ray is used for the analysis of BGA components and in the manufacture of multilayer boards.

For the grouting of multilayer boards, X-Ray is used to control the position offset of the different layers. Also the drilling of holes in multilayers is optimized by X-Ray. Any differing geometries of the circuit board images to the geometry of drill hole coordinates are detected. Through change of a correction factor, the optimum reference point for drilling all layers is determinded.

see also Multi-CB - Quality Control: X-Ray

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