Drills & Throughplating
A unique differentiation in your data between plated-through holes (PTH) and non plated- through holes (npth) is of fundamental importance! This means that you must output a separate drilling program for pth- and npth drill holes, for example, for Excellon or Sieb&Meyer data. For multilayers, this also applies for blind and buried vias. ODB++ data contain the necessary information automatically!
Attention: The hole diameter indicated by the customer represent the final diameter!
Aspect ratioThe aspect ratio indicates the relationship between the technically producible final diameter depending on the material thickness. Multi PCB can produce aspect ratios up to a maximum of 1:10 (for blind vias 1:1). Sample aspect ratios
* Final diameter after through-plating |
Component holesFor technical manufacturing reasons, plated-through holes are drilled approx. 150µm larger than the final diameter you have specified (the final diameter is achieved by the plating). For component holes, you may need to make the annular rings larger. Please note: Circuit boards with drill holes sized 0.6mm or smaller that are intended as component holes must be manufactured with a chemical surface, otherwise these holes will be filled with tin during the HAL process! It is normally advisable to select a hole diameter in the upper tolerance region of the corresponding part. |
Customer Sign inSMD StencilsPricing ExamplesPrinted Circuit Boards always include:
e.g. 100 pcs. Eurocard 100x160mm
Directly from your data News14.05.2013
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