Via Covering

Several technical or production-related demands require the covering / sealing of vias. In the following, you will find a comparsion of the technical capabilities. The reference is the IPC document IPC 4761, which can be purchased here: https://portal.ipc.org/Association/Index.htm.

Via Covering

Several technical or production-related demands require the covering / sealing of vias. In the following, you will find a comparsion of the technical capabilities.

Via Tenting

IPC 4761 Type I: Tented Via

The via is completely covered with dryfilm solder-stop.

One-sided: Type I-a
Double-sided:Typ I-b

IPC 4761 Type II: Tented & Covered Via

The via is completely covered with dryfilm solder-stop and overprinted with normal solder-stop, afterwards.

One-sided: Type II-a
Double-sided:Type II-b

Application

Protection of solder floating up to the component side
Enables vacuum-adaption for production
Covering of critical vias, e.g. beneath BGA

Alternatives

You can apply Via Filling, alternatively.

Through cutting the solder-stop clearance, you can ensure a sufficient solder-stop bridge for BGAs. Using this method, the via annular rings will be partly covered with solder-stop.

Parameters

	Max. Drill-Ø
Via Tenting	300µm

Designation

It is sufficient to cover the vias within the solder-stop layer.

Via Plugging

IPC 4761 Type III: Plugged Via

The via is partially filled with non-conductive paste.

One-sided: Type III-a
Double-Sided: Typ III-b

IPC 4761 Type IV: Plugged & Covered Via

The via is partially filled with non-conductive paste and overprinted with normal solder-stop, afterwards.

One-sided: Type IV-a
Double-Sided: Type IV-b

Multi CB recommends one-sided plugging (Type III-a / Type IV-a) as there is a chance of cracks through encapsulated gas while soldering double-sided plugged vias.

Application

Protection of solder floating up to the component side
Enables vacuum-adaption for production

Parameters

	Min. Drill-Ø	Max. Drill-Ø
Via Filling	250µm	500µm

Designation

Copy the vias to be filled into an additional layer and define that layer with your order.

Via Filling

IPC 4761 Type V: Filled Via

The via is filled completely with non-conductive paste.

IPC 4761 Type VI: Filled & Covered Via

The via is filled completely with non-conductive paste and overprinted with normal solder-stop, afterwards.

One-sided: Type VI-a
Double-sided: Type VI-b

IPC 4761 Typ VII: Filled & Capped Via

The via is plated-through and cleaned - afterwards a non-conductive paste is forced in and hardened - the ends are planarized, metallized and plated-over. Hence, the surface is planar and solderable.

This technology is mostly used for Via-in-Pad solutions and is also applied for stacked und staggered (Micro-)vias. Via Plugging faciliates routing of additional conductor traces between BGA vias amongst other things.

: Filled Via

: Filled & Capped Via

Application

Space saving
Protection of solder floating up to the component side
Faciliates stacked und staggered Microvias for sequential build up multilayers (SBU)
Facilates Via-in-Pad Technology, e.g. for BGAs

Parameters

	Min. Drill-Ø	>> Pad-Ø		Max. Drill-Ø	>> Pad-Ø
Via Plugging	100µm	300µm		500µm	700µm

Designation

Copy the vias to be plugged into an additional layer and define that layer with your order.

Via-in-Pad

: without Via-in-Pad

: with Via-in-Pad

The use of Via-in-Pad technology is increasingly influenced through the necessity of high-density BGAs (ball grid arrays) and the miniaturization of SMD chips.

With a reliable Via Plugging process, without enclosures of chemicals, it is possible to produce high-density PCB designs with Via-in-Pad technology, avoiding soldering errors.

Amongst other things, this faciliates additional conductor traces for BGAs (marked red in the picture).

We use this technology for years now and know how to ensure a reliable and safe production process.

Additional advantages:

Improved thermal dissipation
Increased voltage capability of the via
Provides a flat, coplanar surface
Lower inductance due to no dog-bone pads with traces

Pitch

The minimum pitch for Via-in-Pad solutions is 600µm.

This results of:

200µm min. drill diameter
400µm min. pad size
50µm min. solder-stop clearance
100µm min. solder-stop bridge

Workflow

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Pricing Examples

Printed Circuit Boards always include:

- E-Test
- Solder-stop 2x
- Marking print 1x
- Gerber-Import
- Scoring (series)
- Design-Rule-Check

- Tooling costs
- Photoplot
- Conductors 150μm
- Drill holes 0,3mm
- Unlimited drilling
- HAL, FR4 1,6, 35μm Cu

Prototypes

2 layers - 6 WD	41,- €
1 Printed circuit board 100x100mm
4 layers - 8 WD	118,- €
1 Printed circuit board 160x100mm
6 layers - 8 WD	148,- €
1 Printed circuit board 160x100mm

Series

e.g. 100 pcs. Eurocard 100x160mm

2 layers - each	4,92 €

4 layers - each	7,05 €

6 layers - each	10,67 €

8 layers - each	16,99 €

SMD Stencils

max. 200x300mm - 3WD	47,50 €
1 Stencil, including 1000 pads
max. 600x600mm - 3WD	90,44 €
1 Stencil, including 2500 pads

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