Printed circuit board surfaces
The circuit board surface is responsible for raising the wetting ability of the contact areas for soldering; non-chemical surfaces serve simultaneously as protection against oxidation of the covered copper and improve shelf life characteristics.
The circuit board surfaces vary in shelf life, typical application field and price, but are normally specified by the process, product or desired location for the application.
HAL lead-freeHAL (Hot Air Levelling) is a well-proven method to apply tin as circuit board surface. Every assembler should be able to process circuit boards with HAL surfaces without any problem. HAL is suitable for standard SMD, but exhibits some weaknesses for fine-pitch applications, for which a chemical surface should be preferred (see also HAL vs. immersion gold). |
Immersion tinThis is a very popular circuit board surface, which competent assembly companies have no trouble in processing, because its properties are very close to those of HAL. Due to the quick oxidation of the copper, the storability depends on temperature and packaging. It is imperative to avoid fingerprints on the surface. |
Customer Sign inSMD StencilsPricing ExamplesPrinted Circuit Boards always include:
e.g. 100 pcs. Eurocard 100x160mm
Directly from your data News14.05.2013
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