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Polyimide tape method Polyimide tape cost factor Rough parameters Tape cut and taped by hand Higher than peelable mask, but most cost-effective method Medium parameters Tape cut by laser, taped…

1032. Drying / tempering - Storage of Printed Circuit Boards

Storage of Printed Circuit Boards Printed Circuit Boards should be stored in an airtight condition in a dry place of relative humidity less than 50%, at a temperature of 18 - 22 degrees…

1033. Drying / tempering

1- / 2- layer PCBs Multilayer Flex / Rigid-Flex Drying in convection oven 100°-120° 2h - 4h 100°-120° 2h - 4h 130°-150° 2h - 4h Drying in vacuum oven 80°-100° 2h - 3h 80°-100° 2h - 3h 130°-150°…

1034. Press-Fit technology for Printed Circuits - Press-fit Parameters

Press-fit Parameters Tolerance on Request min. distance to SMD Final diameter Ø ≤ 6.0mm (drilled) ±0.05 +0.1mm/-0mm 2mm Final diameter Ø > 6.0mm (milled) ±0.075 ±0.05 2mm

1035. Plated Half-holes

Ø Bohrung Ø Pad Pad / Pad Freistellung Lötstopp-Steg Pitch min. 600µm 900µm 250µm 50µm-75µm 100µm 1150µm

1036. PCB Series

Thickness Copper thickness 100µm 35µm/35µm 150µm 35µm/35µm 200µm 35µm/35µm 300µm 35µm/35µm 350µm 35µm/35µm 500µm 35µm/35µm 700µm 35µm/35µm 1000µm 35µm/35µm 1200µm 35µm/35µm

1037. PCB Series

Type Typical thickness 1080 78µm 2116 120µm 7628 180µm

1038. PCB Prototypes

In the following you can see the defined layer buildups for PCB prototypes with 4, 6 and 8 layers. These can be selected free of charge in our PCB calculator. If you wish to have different layer…

1039. Prepregs, cores, foils - We have copper foil in the following thicknesses in stock:

We have copper foil in the following thicknesses in stock: 12µm 18µm 35µm 70µm 105µm 210µm

1040. Prepregs, cores, foils - The following FR4 prepregs are partially in stock, or are available for order:

The following FR4 prepregs are partially in stock, or are available for order: Type Typical thickness After pressing* 106 60µm approx. 55µm 2125 105µm approx. 100µm 2165 160µm approx. 150µm