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1031. Ball Grid Array - TOP-Side solder-stop

TOP-Side solder-stop Solder-stop bridge: 51µm Solder-stop clearance: 19µm

TOP-Side Detail Drill: 0.15mm Annular ring: 84.5µm Via-Pad: 319µm Copper to copper: 81µm

BGA 0.4mm Pitch The PCB design for BGA with 0.4mm pitch is special production and requires the use of HDI-Technology and Via-in-Pad. Please always consult our technical department.

1034. Thermal management - Thermal comparison of PCB types (Osram)

Thermal comparison of PCB types (Osram) Based on data from the OSRAM OSTAR Compact high-performance LED (company Osram) and a predefined heat sink, an exemplary thermal comparison of specific…

1035. Thermal management

You can find all metal core capabilites here: Metal core (IMS) circuit boards

1036. Data sheets

Design-Aid for: Solder-stop and Peelable solder-stop.

1037. Data sheets - Material for High-frequency PCBs

Material for High-frequency PCBs Data sheet Notes Rogers 4350B HF material ISOLA IS620 E-fibre glas Taconic RF-35 Ceramic Taconic TLX PTFE Taconic TLC PTFE Rogers RO3001 Bonding Film for…

1038. Data sheets - Material for Metal core boards

Material for Metal core boards Data sheet Notes TC-Lam 2.0 1 layer W/mK 2.0 HA50 (3) 1 layer W/mK 2.2 AL-200 1 layer W/mK 2.0 AL-300 1 layer W/mK 3.0 Ventek VT-4B1 1 layer flexible W/mK…

1039. Data sheets

An overview of the various material parameters can be found here:r: PCB Materials - flexible circuit boards

1040. Data sheets - Material for flexible PCBs

Material for flexible PCBs Data sheet Notes Shengyi SF305 Polyimide + Adhesive DuPont Pyralux AP Polyimide Panasonic RF775 Polyimide Thinflex W-05050 Polyimide Shengyi SF305C PI Coverlay DuPont…