For cost-saving or technical reasons (such as improved assembly), multiple circuit boards may be combined to form one large board, a “panel”. This panel is then produced just as a single large circuit board. A separation of the panel does not occur!
Always consult with your assembly partner about the panel design; take note of (for example) fiducial marks and capture holes! A damaged circuit board (according to E-test) will not be removed from the panel, but rather marked. This must be observed during assembly.
Panel types:
Mechanical processing
Prices for panel creation
The Multi-CB technology hotline will assist you: +44 (0)1425 489 111.
 | spacing of conductor / Cu to contour | Spacing between PCBs | Line thickness of PCB contour | Recommended surounding frame | |||||
|---|---|---|---|---|---|---|---|---|---|
| Scored | spacing of conductor / Cu to contour | 500µm | Spacing between PCBs | 0,00mm | Line thickness of PCB contour | 1 mil (0,01mm) | Recommended surounding frame | 5-10mm |
| Milled | spacing of conductor / Cu to contour | 200µm | Spacing between PCBs | 2,4mm | Line thickness of PCB contour | - | Recommended surounding frame | 5-10mm |
 | spacing of conductor / Cu to contour | Spacing between PCBs | Line thickness of PCB contour | Recommended surounding frame | |||||
|---|---|---|---|---|---|---|---|---|---|
| Scored | spacing of conductor / Cu to contour | 500µm | Spacing between PCBs | 0,00mm | Line thickness of PCB contour | 1 mil (0,01mm) | Recommended surounding frame | 5-10mm |
| Milled | spacing of conductor / Cu to contour | 200µm | Spacing between PCBs | 10mm | Line thickness of PCB contour | - | Recommended surounding frame | 5-10mm |
Multiple identical circuit board layouts are composed to form one panel. The completed panel is scored, or partially milled-out to provided the contained PCBs with bridges for breaking out.
When designing the panel, please observe that a spacing of 0.0mm is left between the circuit boards.
The contour line thickness should be 0.01mm / 1 mil.
Because of the tolerances when breaking out the single circuit boards, all conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge (see scoring).
We recommend using scoring technology only for panels with a circuit board thickness of at least 1mm (stability).
When designing the panel, please observe that a spacing of 2.4mm is left between the circuit boards.
All conductor traces and copper areas should have a spacing of at least 200µm from the milling edge.
If no bridges are defined by the customer, these will be inserted by Multi CB! Optimum width for the bridges: 1 to 1.5mm.
When designing the panel, please observe that a spacing of 0.0mm is left between the circuit boards.
The contour line thickness should be 0.01mm / 1 mil.
Because of the tolerances when breaking out the individual circuit boards, all conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge (see scoring).
We recommend using scoring technology only for panels with a circuit board thickness of at least 1mm (stability).
When designing the panel, please observe that a spacing of 10mm (394 mil) is left between the circuit boards.
All conductor traces and copper areas should have a spacing of at least 200µm from the milling edge.
If no bridges are defined by the customer, these will be inserted by Multi CB Optimum width for the bridges: 1 to 1.5mm.
When designing the panel, please observe that a spacing of 0.0mm is calculated between scored parts, and preferably 2.4mm between milled parts.
All conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge, and at least 200µm from the milling edge!
