For cost-saving or technical reasons (such as improved assembly),multiple circuit boards may be combined to form a “panel”. This panel is then produced just as a single large circuit board. A separation of the panel does not occur!
Always clarify the panel design with your assembly partner; pay attention to fiducials marks or mounting holes!
Use our panel configurator during online order: With just a few inputs, you can configure your multiplier panel. In addition, a full-scale preview of your pcb panel is displayed within the order process. No additional panel -drawing / -release is necessary.
Panel types
Multiplier panel
Identical PCBs within panel
Mixed multiplier panel
Different PCBs within panel
Already included: panel creation
- Panel configurator in the PCB calculator
- Panel data provided by the customer
- Panel composed by Multi-CB (attention: customer approval required)
Mechanical processing
- Scoring
- Milling with bridges / with bridges and mousebites
- Milling / scoring combination
- without mech. processing
X-out
- Standard: A damaged printed circuit board (according to E-test) is not removed from the panel, but marked (X-out). This must be taken into account for assembly.
- Special production: If you do not want an X-out, select "No X-out" in the PCB calculator.
The Multi-CB technology hotline will assist you: +49 (0) 8104 628 210
Mechanical processing / Panel separation
| Scored | Milled with bridges | Milled with bridges & mousebites |
|---|---|---|
 |  |  |
| - | Bridges are placed by Multi-CB | Bridges and mousebites are placed by Multi-CB |
Design Parameters
| Min. spacing of conductor / Cu to contour | Min. Spacing between PCBs | Line thickness of PCB contour | Recommended surounding frame | |
|---|---|---|---|---|
| Scored panel | 500µm (0,5mm) | 0.0mm / ≥ 5.5mm | 1 mil (0.01mm) | 5-10mm |
| Milled panel | 200µm (0,2mm) | 2.0mm | - | 5-10mm |
Multiplier panel
Multiple identical circuit board layouts are composed to form one panel. The completed panel is scored, or partially milled-out to provided the contained PCBs with bridges for breaking out.
Multiplier scored
When designing the panel, please observe that a spacing of 0,0mm is left between the circuit boards. If a spacing between the (scored) PCBs is required, please leave a gap of min. 5,0mm.
The contour line thickness should be 0,01mm / 1 mil.
Because of the tolerances when breaking out the single circuit boards, all conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge (see scoring).
We recommend using scoring technology only for panels with a circuit board thickness of at least 1mm (stability).
Multiplier milled
When designing the panel, please observe that a spacing of 2,0mm is left between the circuit boards.
All conductor traces and copper areas should have a spacing of at least 200µm from the milling edge.
If no bridges are defined by the customer, these will be inserted by Multi CB! Optimum width for the bridges: 1,0 - 1,5mm.
Mixed multiplier scored
When designing the panel, please observe that a spacing of 0,0mm is left between the circuit boards. If a spacing between the (scored) PCBs is required, please leave a gap of min. 5,0mm. For jump scoring a distance of 15mm is required.
The contour line thickness should be 0.01mm / 1 mil.
Because of the tolerances when breaking out the individual circuit boards, all conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge (see scoring).
We recommend using scoring technology only for panels with a circuit board thickness of at least 1,0mm (stability).
Mixed multiplier milled
When designing the panel, please observe that a spacing of 2,0mm is left between the circuit boards. For reasons of stability, a distance of 10mm is usually recommended.
All conductor traces and copper areas should have a spacing of at least 200µm from the milling edge.
If no bridges are defined by the customer, these will be inserted by Multi CB Optimum width for the bridges: 1,0 to 1,5mm.
Example for milling/scoring combination
When designing the panel, please observe that a spacing of 0,0mm is calculated between scored parts, and preferably 2,0mm between milled parts.
All conductor traces and copper areas should have a spacing of at least 500µm from the scoring edge, and at least 200µm from the milling edge!
Milling/scoring combination hassle-free
If the outer edge of the milling lies on the scoring line, the milling tool moves along the scored base material. This increases the risk of forming of chips.
Advice: Do not mill directly aligned with scribe lines.
We manufacture PCBs with milling and scoring on the same line. Should this result in shaving (chip) formation, a reclamation in this regard would be rejected.