Metal core circuit boards

Alu core IMS PCB white

Metal core or IMS (Insulated Metallic Substrate) circuit boards are an excellent alternative to standard circuit boards, if the circuit boards are exposed to large mechanical loads, or a high level of dimensional stability is required, or high temperatures must be conducted away from power components or LEDs. Benefit from our many years of experience with Insulated Metal Substrate (IMS) PCBs.

Metal core PCB

The thermal conductivity assisted by the aluminium core in the circuit boards enables higher packing density, more stable operating parameters, higher operational safety and a reduced failure rate. Ideal e.g. for laser diodes!

The integration of the cooling unit in the printed circuit board also results in space savings.

 

 

PCB Aluminium core microsection

Additional application areas for this technology include: high current application, power LED's, SMD and power circuit boards. The high thermal conductivity and small insulation thickness (standard: 100µm) permits a quick and effective transfer of the heat produced.

In addition, Multi-CB is also at your side for further aspects of thermal management:

  • Design / construction of the heat-critical circuit board
  • Thermal via array
  • Thick-Copper PCBs

Always included

  • Alu core 1.5mm, 35µm Cu
  • 2.0 W/mK Thermal conductivity 
  • 100µm Insulation thickness
  • Surface HAL lead-free
  • 1x solder-stop white
  • Milling inner / outer
  • V-Scoring (clean & simple)
  • E-Test, Design Rule Check

Available types

1 layer IMS PCB

1 layer IMS PCB

You can order single sided, double sided and double sided pth aluminium core circuit boards from Multi-CB (see: layer buildup). Depending on the design, the thermal conductivity ranges from 1.0 to 7.0 W/mK (the value for FR4 is approx. 0.3 W/mK).

The option Z-axis milling of the insulation also allows a direct connection of the components to the aluminum core by means of thermal paste (or similar). Bendable metal core printed circuit boards with ceramic-based insulation can also be produced.


Technical options for Metal core circuit boards

 OptionsInklusiveNotes
 MaterialOptionsAluminium coreInklusive-NotesData sheets
 Max. sizeOptions420mm x 570mmInklusive-Notes 
 DesignOptions1 layer, 2 layers plated-throughInklusive Notes 
 Aluminium thicknessOptions0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mmInklusive1.5mmNotes 
 CopperOptions35µm, 70µm, 105µm, 140µmInklusive35µmNotes 
 Insulation thicknessOptions75µm, 100µm, 125µm, 150µmInklusive100µmNotes 
 Thermal conductivityOptions2.0W/mK - 7.0W/mKInklusive2.0W/mKNotes 
 Conductor width min.Options150µmInklusive150µmNotes 
 Annular ring min.Options125µmInklusive150µmNotes 
 Drill (NPTH) min. ØOptions0.5mmInklusive0.9mmNotesDesign-Aid
 Via min. ØOptions0.2mmInklusive0.2mmNotes 
 SurfaceOptionsHAL lead-free, chemical goldInklusiveHAL lead-freeNotesSurfaces
 Solder-stopOptionswhite, black, green, red, blueInklusivewhite, blackNotes 
 Legend printOptionsblack, whiteInklusive-Notes 
 MillingOptionsyesInklusiveyesNotes 
 V-ScoringOptionsyesInklusiveyesNotesclean & simple
 Z-Axis millingOptionsyesInklusive-Notes 
 RoHS compliantOptionsyesInklusiveyesNotes 
 UL-certifiedOptionsyesInklusiveyesNotesUL certificate

1 Lage Metal core

Design Parameters

 35µm Cu70µm Cu
 Min. conductor width35µm Cu150µm70µm Cu200µm
 Min conductor spacing35µm Cu150µm70µm Cu200µm
 Min. annular ring35µm Cu125µm70µm Cu200µm
 Min. drill (NPTH)35µm Cu0.7mm70µm Cu0.7mm
 Min. drill spacing35µm Cu250µm70µm Cu250µm

1 layer Metal core - Material

Material for metal core boards 1 LayerIMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 1 Layer IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 1 LayerTC-Lam 2.0IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.50PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*5.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerHA50 (3)IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.41PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*4.3PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-200IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.35PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-300IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance0.30PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B3
Ceramic Filled
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity5 x 10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B4
Ceramic Filled
IMS Thermal conductivityThermal conductivity4.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B7
Ceramic Filled
IMS Thermal conductivityThermal conductivity7.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material

2 layers Metal core (PTH) - Design Parameters

Design Parameters

 35µm Cu70µm Cu
 Min. conductor width35µm Cu150µm70µm Cu200µm
 Min conductor spacing35µm Cu150µm70µm Cu200µm
 Min. annular ring35µm Cu125µm70µm Cu200µm
 Min. drill(NPTH)35µm Cu0.7mm70µm Cu0.7mm
 Min. via (PTH)35µm Cu0.3mm70µm Cu0.3mm
 Min. drill spacing35µm Cu250µm70µm Cu250µm
 Min. via spacing35µm Cu300µm70µm Cu300µm
 Aspect ratio35µm Cu10:170µm Cu10:1

2 layers Metal core (PTH) - Material

Material for metal core boards 2 Layers (plated-through)IMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 2 Layers (plated-through) IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 2 Layers (plated-through)Ventec VT-4A2IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventec VT-4B3
Ceramic Filled
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity5 x 10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material


Overview of technical options for special production circuit boards.

For optimal preparation, we recommend that you contact our CAM-Station engineers early on. We would be very happy to advise you during the development process.

UL certification for Metal core circuit boards

At Multi-CB, you also get Metal core circuit boards with UL certification.