Metal core circuit boards

Metal core or IMS (Insulated Metallic Substrate) circuit boards are an excellent alternative to standard circuit boards, if the circuit boards are exposed to large mechanical loads, or a high level of dimensional stability is required, or high temperatures must be conducted away from power components or LED's.

Metal core PCB

The thermal conductivity assisted by the aluminium core in the circuit boards makes higher packing densities, longer operating times, and improved security against failure possible, such as for LED technology and for high power transistors.

The integration of the cooling unit in the printed circuit board also results in space savings.

Aluminium core microsection

Additional application areas for this technology include: high current application, power LED's, SMD and power circuit boards. The high thermal conductivity permits a quick and effective transfer of the heat produced.

Available types

You can order single sided and double sided pth aluminium core circuit boards from Multi-CB (see: layer buildup). Depending on the design, the thermal conductivity ranges from 0.67 to 2.2 W/m*K! (The value for FR4 is approx. 0.3 W/m*K).


Technical options for Metal core circuit boards

1 layer Metal core

Options   Notes
OptionsMaterial Aluminium core, FR4 prepregNotes Data sheets
OptionsMax. size 230mm x 380mm Notes 
OptionsAluminium thickness 1.5mm, 2.0mm Notes 
OptionsInitial copper 35µm (for 1.5mm), 140µm (for 2.0mm) Notes 
OptionsSurface HAL lead-free, chemical gold, immersion tin NotesSurfaces
OptionsRoHS compliant yes Notes 

Design Parameters

Options 35µm Cu 70µm Cu
OptionsMin. conductor width35µm Cu150µm70µm Cu200µm
OptionsMin conductor spacing35µm Cu150µm70µm Cu200µm
OptionsMin. annular ring35µm Cu125µm70µm Cu200µm
OptionsMin. drill (NPTH)35µm Cu0.7mm70µm Cu0.7mm
OptionsMin. drill spacing35µm Cu250µm70µm Cu250µm

Material - 1 layer Metal core

Technical properties Unit KL HA50 (type2) TC-Lam 1.3 KL (type3) Test method
Technical propertiesData sheetUnit-KL HA50 (type2)KL HA50TC-Lam 1.3TC-Lam 1.3KL (type3)KL HA50Test method-
Technical propertiesArea of applicationUnit-KL HA50 (type2)StandardTC-Lam 1.3StandardKL (type3)ExtendedTest method-
Technical propertiesThermal conductivity factorUnitW / m*kKL HA50 (type2)1.6TC-Lam 1.31.3KL (type3)2.2Test methodASTM-D 5470
Technical propertiesDielectric constant εrUnit(bei 1 MHz)KL HA50 (type2)5.3TC-Lam 1.3-KL (type3)5.5Test methodIEC-61189
Technical propertiesSurface resistanceUnitKL HA50 (type2)1.0 * 10^6TC-Lam 1.31.0 * 10^7KL (type3)1.0 * 10^6Test methodIEC-61189
Technical propertiesThermal durabilityUnitK / WKL HA50 (type2)-TC-Lam 1.30.77KL (type3)-Test methodASTM-E 1225
Technical propertiesGlass transition dielectric (Tg)Unit°CKL HA50 (type2)122TC-Lam 1.3100KL (type3)122Test methodIPC-TM150
Technical propertiesDielectric breakdown (AC)*UnitkVKL HA50 (type2)4.0 - 6.0TC-Lam 1.35.0KL (type3)4.0 - 6.0Test methodIPC-TM-650
Technical propertiesCTIUnitVKL HA50 (type2)600TC-Lam 1.3600KL (type3)600Test methodUL746A

* Depending on dielectric thickness, in this example 100µm.

2 layers Metal core (plated-through)

Options   Notes
OptionsMaterial Aluminium core, FR4 prepregNotesData sheets
OptionsMax. size 800mm x 800mmNotes 
OptionsAluminium thickness 0.8mm, 1.0mm, 1.5mmNotesin stock
Options  1.2mm, 2.0mmNotesOn request
OptionsBasis copper 18µm, 35µm, 70µmNotes 
OptionsSurface HAL lead-free, Chemical gold, immersion tinNotesSurfaces
OptionsRoHS compliant yesNotes 

Design Parameters

Options 35µm Cu 70µm Cu
OptionsMin. conductor width35µm Cu150µm70µm Cu200µm
OptionsMin conductor spacing35µm Cu150µm70µm Cu200µm
OptionsMin. annular ring35µm Cu125µm70µm Cu200µm
OptionsMin. drill(NPTH)35µm Cu0.7mm70µm Cu0.7mm
OptionsMin. via (PTH)35µm Cu0.3mm70µm Cu0.3mm
OptionsMin. drill spacing35µm Cu250µm70µm Cu250µm
OptionsMin. via spacing35µm Cu300µm70µm Cu300µm
OptionsAspect ratio35µm Cu10:170µm Cu10:1

Material - 2 layers Metal core (plated-through)

Technical properties Unit CCAF-04 CCAF-05 Test method
Technical propertiesData sheetUnit-CCAF-04CCAF-04CCAF-05CCAF-05Test method-
Technical propertiesArea of applicationUnit-CCAF-04StandardCCAF-05ExtendedTest method-
Technical propertiesThermal conductivity factorUnitW / m*kCCAF-041.5CCAF-052.2Test methodASTM-D 5470
Technical propertiesDielectric constant εrUnit(bei 1 MHz)CCAF-044.2CCAF-054.24Test methodIEC-61189
Technical propertiesSurface resistanceUnitCCAF-045.0 * 10^7CCAF-053.68 * 10^7Test methodIEC-61189
Technical propertiesThermal durabilityUnitK / WCCAF-040.65CCAF-050.45Test methodASTM-E 1225
Technical propertiesGlass transition dielectric (Tg)Unit°CCCAF-04-CCAF-05-Test methodIPC-TM150
Technical propertiesDielectric breakdown (AC)*UnitkVCCAF-044.0CCAF-056.0Test methodIPC-TM-650
Technical propertiesCTIUnitVCCAF-04600CCAF-05600Test methodUL746A

* Depending on dielectric thickness, in this example 100µm.


Overview of technical options for special production circuit boards.

For optimal preparation, we recommend that you contact our CAM-Station engineers early on. We would be very happy to advise you during the development process.