Metal core circuit boards

Alu core IMS PCB white

Metal core or IMS (Insulated Metallic Substrate) circuit boards are an excellent alternative to standard circuit boards, if the circuit boards are exposed to large mechanical loads, or a high level of dimensional stability is required, or high temperatures must be conducted away from power components or LEDs. Benefit from our many years of experience with Insulated Metal Substrate (IMS) PCBs.

Metal core PCB

The thermal conductivity assisted by the aluminium core in the circuit boards enables higher packing density, more stable operating parameters, higher operational safety and a reduced failure rate. Ideal e.g. for laser diodes!

The integration of the cooling unit in the printed circuit board also results in space savings.

 

 

Aluminium core microsection

Additional application areas for this technology include: high current application, power LED's, SMD and power circuit boards. The high thermal conductivity and small insulation thickness (standard: 100µm) permits a quick and effective transfer of the heat produced.

In addition, Multi-CB is also at your side for further aspects of thermal management:

  • Design / construction of the heat-critical circuit board
  • Thermal via array
  • Thick-Copper PCBs

Always included

  • Alu core 1.5mm, 35µm Cu
  • 2.0 W/mK Thermal conductivity 
  • 100µm Insulation thickness
  • Surface HAL lead-free
  • 1x solder-stop white
  • Milling inner / outer
  • V-Scoring (clean & simple)
  • E-Test, Design Rule Check

Available types

1 layer IMS PCB

1 layer IMS PCB

You can order single sided, double sided and double sided pth aluminium core circuit boards from Multi-CB (see: layer buildup). Depending on the design, the thermal conductivity ranges from 1.0 to 8.0 W/mK (the value for FR4 is approx. 0.3 W/mK).

The option Z-axis milling of the insulation also allows a direct connection of the components to the aluminum core by means of thermal paste (or similar). Bendable metal core printed circuit boards with ceramic-based insulation can also be produced.


Technical options for Metal core circuit boards

Options Notes
OptionsMaterial Aluminium coreNotes Data sheets
OptionsMax. size 420mm x 570mmNotes 
OptionsAluminium thickness 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mmNotesStandard: 1.5mm
OptionsCopper 35µm, 70µm, 105µm only2.0mm)NotesStandard: 35µm
OptionsInsulation thickness 75µm, 100µm, 125µm, 150µmNotesStandard: 100µm
OptionsThermal conductivity 1.0W/mK - 8.0W/mKNotesStandard: 2.0W/mK
OptionsSurface HAL lead-free, chemical goldNotesSurfaces
OptionsSolder-stop white, black, green, red, blueNotesStandard: white
OptionsLegend print black, whiteNotes 
OptionsMilling yesNotes 
OptionsV-Scoring yesNotesclean & simple
OptionsZ-Axis milling yesNotes 
OptionsRoHS compliant yesNotes 
OptionsUL-certified yesNotes 

1 layer Metal core - Design Parameters

Options35µm Cu70µm Cu
OptionsMin. conductor width35µm Cu150µm70µm Cu200µm
OptionsMin conductor spacing35µm Cu150µm70µm Cu200µm
OptionsMin. annular ring35µm Cu150µm70µm Cu200µm
OptionsMin. drill (NPTH)35µm Cu0.7mm70µm Cu0.7mm
OptionsMin. drill spacing35µm Cu250µm70µm Cu250µm

1 layer Metal core - Material

Material for metal core boards 1 LayerIMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 1 Layer IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 1 LayerTC-Lam 2.0IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.50PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*5.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerHA50 (3)IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.41PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*4.3PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-200IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.35PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-300IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance0.30PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentek VT-4B1
flexible
IMS Thermal conductivityThermal conductivity1.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentek VT-4B3
limited flexible
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*9.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material

2 layers Metal core (PTH) - Design Parameters

Options35µm Cu70µm Cu
OptionsMin. conductor width35µm Cu150µm70µm Cu200µm
OptionsMin conductor spacing35µm Cu150µm70µm Cu200µm
OptionsMin. annular ring35µm Cu125µm70µm Cu200µm
OptionsMin. drill(NPTH)35µm Cu0.7mm70µm Cu0.7mm
OptionsMin. via (PTH)35µm Cu0.3mm70µm Cu0.3mm
OptionsMin. drill spacing35µm Cu250µm70µm Cu250µm
OptionsMin. via spacing35µm Cu300µm70µm Cu300µm
OptionsAspect ratio35µm Cu10:170µm Cu10:1

2 layers Metal core (PTH) - Material

Material for metal core boards 2 Layers (plated-through)IMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 2 Layers (plated-through) IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 2 Layers (plated-through)CCAF-05IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.45PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*6.0PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventek VT-4A2IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventek VT-4B1
flexible
IMS Thermal conductivityThermal conductivity1.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventek VT-4B3
limited flexible
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*9.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material