The standard layer buildups for metal core circuit boards are as follows. Please also observe the technical options for metal core circuit boards.
Layer buildup Metal Core 1 layer 35µm Cu
Layer buildup Metal Core 1 layer 140µm Cu
Layer buildup Metal Core 2 layers plated-through
Additional information:
- Design-Rules for layer buildups
- Technical options for Metal Core boards
- Available prepregs, cores, and foils
- Series, Prototypes, Flex, Rigid-Flex, Metal Core standard layer buildup
- Metal Core boards available technology