HDI printed circuit boards (High Density Interconnect) offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).
Pressing of additional layers through SBU (Sequential Build-Up) or SSBU (Semi Sequential Build-Up) technology enables routing on the inner layers, with space left on the outer layers for components with high pin density.
IPC-6012D defines HDI-Printed Circuit Boards et al. with drills ≤ 0.15mm (6mil) and track width/ -space ≤ 0.1mm (4mil).
State-of-the-art production equipment and over 25 years of experience in printed circuit board technology enable Multi-CB to offer process-reliable, cost-effective solutions for HDI circuit boards! 0.1mm tracks as well as 0.2mm drills are already standard technology with Multi-CB (without surcharge).