Various requirements for printed circuit boards make the use of different circuit board substrates necessary.
Whereas for many standard applications the classical FR4 material is sufficient, possibly in high Tg version (for improved thermo-mechanical properties), for other areas (such as high frequencies) alternate materials are absolutely required.
The following information is intended as a abstract summary of all available material types and their fundamental properties, to make it easier for you to make a selection according to the required field of application.
The standard values of the processed materials can be found in following PDFs:
Material samples of the company Rogers can directly be requested here:
http://rogerscorp.force.com/samples/samples_public
On request, you can order circuit boards with EN 45545-2: 2013 certified material (fire protection requirements for rail vehicles) eg.g. from Isola: EN45545-2: 2013 Information.
Please note: The selected materials may be replaced by technically equivalent or similar products, according to available stocks on hand.
Material for Rigid Circuit boards
| Material for rigid PCBs | Tg | CTE-z (T<Tg) | εr, Dk- Permittivity | Dk Loss Tangent | Electric Strength | Surface Resistivity | Tracking resistance CTI | Td value | Peel strength |
|---|---|---|---|---|---|---|---|---|---|
| °C | ppm/°C | @1GHz | @1GHz | KV/mm | MO | PLC | °C | N/mm | |
| ISOLA Duraver DE104 Standard FR4 | 135° | 70 | 4,4 | 0,020 | 54 | 1,0 x 10^6 | 2 | 315° | 1,6 |
| Shengyi S1141 FR4 alternative | 140° | 65 | 4,6* | 0,015* | 60 | 5,4 x 10^7 | 3 | 310° | 1,8 |
| ISOLA Duraver DE104 KF FR4 tracking resistant | 135° | 45 | 4,6 - 4,9 | 0,020* | 39 | 1,0 x 10^6 | 1 | 315° | 1,6 |
| ISOLA DE156 FR4 halogen-free | 155° | 45 | 4,0 | 0,016 | 36 | 4,0 x 10^6 | - | 390° | 1,4 |
| ISOLA IS400 FR4 MidTg | 150° | 50 | 4,0** | 0,020 | 48 | 3,0 x 10^6 | 3 | 330° | 1,4 |
| ITEQ IT-158 FR4 MidTg alternative | 155° | 60 | 4,3 | 0,016 | 60 | 1,0 x 10^10 | - | 345° | 1,7 |
| ITEQ IT-180A FR4 HTg | 175° | 45 | 4,4 | 0,015 | 45 | 3,0 x 10^10 | - | 345° | 1,4 |
| Shengyi S1000-2 FR4 HTg alternative | 180° | 45 | 4,8* | 0,013* | 63 | 7,9 x 10^7 | 3 | 345° | 1,4 |
| ISOLA IS410 FR4 HTg, CAF-Enhanced | 180° | 55 | 4,0 | 0,019 | 44 | 8,0 x 10^6 | 3 | 350° | 1,2 |
| ISOLA IS420 FR4 HTg, CAF-Enhanced alt. | 170° | 45 | 4,0 | 0,016 | 54 | 3,0 x 10^6 | 3 | 350° | 1,3 |
Unless otherwise noted, the CTI (Comparative Tracking Index) which indicates the tracking resistance, is PLC3 (175V - 250V) for rigid PCBs. On request, we are also able to produce PCBs with PLC 2 (> 250V), PLC 1 (> 400V) or PLC 0 (> 600V). See Overview of CTI / PLC.
Materials for flexible circuit boards
| Material for flexible PCBs | Recommended max. operating temperature | Copper type | Tg | εr, Dk- Permittivity | CTE-z (T<Tg) | Electric Strenght | Surface Resistivity | Peel strength |
|---|---|---|---|---|---|---|---|---|
| °C | * | °C | @1MHz | ppm/°C | KV/mm | MΩ | N/mm | |
| Polyimide + Adhesive | ||||||||
| Shengyi SF305 | 105° | RA | - | 3,6 | - | 21 | 1 x 10^5 | 1,1 |
| Polyimide Adhesiveless | ||||||||
| DuPont Pyralux AP | 180° | RA | 220 | 3,4 | 25 | 256 | 1 x 10^10 | 1,8 |
| Panasonic RF775 | 130° | ED | 343 | 3,2 | - | 276 | 1 x 10^8 | 1,7 |
| Thinflex W-05050 | 105° | ED | 350 | 3,3 | 24 | 216 | 1 x 10^5 | 0,6 |
| PI Coverlay | ||||||||
| Shengyi SF305C | 105° | - | - | - | - | - | 3 x 10^6 | - |
| DuPont Pyralux FR | 180° | - | - | 3,5 | - | 138 | 1 x 10^7 | - |
| Adhesive tape | ||||||||
| 3M 9077 | 150° | - | - | - | - | - | - | - |
* RA = Rolled copper, suitable for dynamic, flexible applications; ED = Electrolytically deposited copper , only suited for stable and semi-dynamic applications (see Design-Aid Flex boards)
Materials for metal core boards
1 layer
| Material for metal core boards 1 Layer | Thermal conductivity | Thermal resistance | Surface Resistivity | Dielectric glass transition (Tg) | Dielectric Breakdown (AC)* | Tracking resistance CTI |
|---|---|---|---|---|---|---|
| W/mK | K/W | MΩ | °C | kV | PLC | |
| TC-Lam 2.0 | 2.0 | 0.50 | 10^7 | 100 | 5.0 | 0 |
| HA50 (3) | 2.2 | 0.41 | 10^6 | 120 | 4.3 | 0 |
| AL-200 | 2.0 | 0.35 | 10^8 | - | 3.5 | 0 |
| AL-300 | 3.0 | 0.30 | 10^8 | - | 3.5 | 0 |
| Ventec VT-4B3 Ceramic Filled | 3.0 | - | 5 x 10^8 | 130 | 8.0 | 0 |
| Ventec VT-4B4 Ceramic Filled | 4.2 | - | 2 x 10^7 | 120 | 8.0 | 0 |
| Ventec VT-4B7 Ceramic Filled | 7.0 | - | 2 x 10^7 | 100 | 8.0 | 0 |
2 layers (plated-through)
| Material for metal core boards 2 Layers (plated-through) | Thermal conductivity | Thermal resistance | Surface Resistivity | Dielectric glass transition (Tg) | Dielectric Breakdown (AC)* | Tracking resistance CTI |
|---|---|---|---|---|---|---|
| W/mK | K/W | MΩ | °C | kV | PLC | |
| Ventec VT-4A2 | 2.2 | - | 2 x 10^7 | 130 | 7.5 | 0 |
| Ventec VT-4B3 Ceramic Filled | 3.0 | - | 5 x 10^8 | 130 | 8.0 | 0 |
Material for high frequency boards
| Material for high frequency boards | Order Share | εr, Dk- Permittivity | Dk Loss Tangent | Tg | Td Value | Thermal Conductivity | CTE-z (T<TG) | Electric Strength | Surface Resistivity | Peel Strength |
|---|---|---|---|---|---|---|---|---|---|---|
| @10GHz | @10GHz | °C | °C | W/m*K | ppm/°C | KV/mm | MΩ | N/mm | ||
| Rogers 4350B HF Material | +++ | 3,5 | 0,0037 | 280° | 390° | 0,69 | 32 | 31 | 5,7 x 10^9 | 0,9 |
| Rogers 4003C PTFE HF Material | ++ | 3,4 | 0,0027 | 280° | 425° | 0,71 | 46 | 31 | 4,2 x 10^9 | 1,1 |
| Panasonic Megtron6 HF Material | + | 3,6 | 0,004 | 185° | 410° | - | 45 | - | 1 x 10^8 | 0,8 |
| Rogers RO3003 PTFE ceramic-filled | + | 3,0 | 0,0013 | - | 500° | 0,50 | 25 | - | 1 x 10^7 | 2,2 |
| Rogers RO3006 PTFE ceramic-filled | o | 6,2 | 0,002 | - | 500° | 0,79 | 24 | - | 1 x 10^5 | 1,2 |
| Rogers RO3010 PTFE ceramic-filled | o | 10 | 0,0022 | - | 500° | 0,95 | 16 | - | 1 x 10^5 | 1,6 |
| Taconic RF-35 Ceramic | o | 3,5** | 0,0018* | 315° | - | 0,24 | 64 | - | 1,5 x 10^8 | 1,8 |
| Taconic TLX PTFE | o | 2,5 | 0,0019 | - | - | 0,19 | 135 | - | 1 x 10^7 | 2,1 |
| Rogers RO3001 Bonding Film for PTFE | - | 2,3 | 0,003 | 160° | - | 0,22 | - | 98 | 1 x 10^9 | 2,1 |
| Taconic TLC PTFE | - | 3,2 | - | - | - | 0,24 | 70 | - | 1 x 10^7 | 2,1 |
Material for high-Tg circuit boards (selection)
| Material for High-Tg boards | Tg | CTE-z (T<Tg) | εr, Dk- Permittivity | Electric Strenght | Surface Resistivity | Tracking Resistance CTI | Thermal Conductivity | Td value | Peel Strength |
|---|---|---|---|---|---|---|---|---|---|
| °C | ppm/°C | @1GHz | KV/mm | MO | PLC | W/m*K | °C | N/mm | |
| ISOLA IS410 FR4 HTg, CAF-Enhanced | 180° | 55 | 4,0 | 44 | 8,0 x 10^6 | 3 | 0,5 | 350° | 1,2 |
| ISOLA IS420 FR4 HTg, CAF-Enhanced | 170° | 45 | 4,0 | 54 | 3,0 x 10^6 | 3 | 0,4 | 350° | 1,3 |
| ITEQ IT-180A FR4 HTg | 175° | 45 | 4,4 | 45 | 3,0 x 10^10 | - | - | 345° | 1,4 |
| Shengyi S1000-2 FR4 HTg | 180° | 45 | 4,8* | 63 | 7,9 x 10^7 | 3 | - | 345° | 1,4 |
| ARLON 85N Polyimid HTg | 250° | 55 | 4,20* | 57 | 1,6 x 10^9 | - | 0,2 | 387° | 1,2 |
CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board
Additional information
- Download data sheets (materials, solder-stop, marking prints, etc.)
- Circuit board surfaces
- Overview of technical options