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Via-in-Pad

The use of Via-in-Pad technology is increasingly influenced through the necessity of high-density BGAs (ball grid arrays) and the miniaturization of SMD chips.

With a reliable Via Filling / Capping process, without enclosures of chemicals, it is possible to produce high-density PCB designs with Via-in-Pad technology, avoiding soldering errors (see Filled & Capped Vias).

Amongst other things, this faciliates additional conductor traces for BGAs (marked red in the picture).

We use this technology for years now and know how to ensure a reliable and safe production process.

Additional advantages:

  • Improved thermal dissipation
  • Increased voltage capability of the via
  • Provides a flat, coplanar surface
  • Lower inductance due to no dog-bone pads with traces

Most economical are via-in-pad solutions with Ø ≥ 200 microns!

Via-in-Pad Parameters

StandardSpecial productionSpecial production
FillingIPC 4761 Type VIIIPC 4761 Type VIInone
Min. Drill-Ø200µm150µm100µm
Min. Pad-Ø400µm350µm300µm
Max. Drill-Ø500µm400µm-
Max. Pad-Ø700µm600µm-
Min. Pitch600µm550µm500µm
Aspect Ratio: Via1:121:121:10
Aspect Ratio: Blind Via1:11:11:1

Pitch

The minimum pitch for Via-in-Pad solutions is 600µm (standard technology).

This results of:

  • 200µm min. drill diameter
  • 400µm min. pad size
  •  50µm min. solder-stop clearance
  • 100µm min. solder-stop bridge

 

A via diameter of 100µm is possible, and results in a pitch of 500μm. Please contact our cam department in advance.

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