The use of Via-in-Pad technology is increasingly influenced through the necessity of high-density BGAs (ball grid arrays) and the miniaturization of SMD chips.
With a reliable Via Filling / Capping process, without enclosures of chemicals, it is possible to produce high-density PCB designs with Via-in-Pad technology, avoiding soldering errors (see Filled & Capped Vias).
Amongst other things, this faciliates additional conductor traces for BGAs (marked red in the picture).
We use this technology for years now and know how to ensure a reliable and safe production process.
Additional advantages:
- Improved thermal dissipation
- Increased voltage capability of the via
- Provides a flat, coplanar surface
- Lower inductance due to no dog-bone pads with traces
Most economical are via-in-pad solutions with Ø ≥ 200 microns!
Via-in-Pad Parameters
| Standard | Special production | Special production | |
|---|---|---|---|
| Filling | IPC 4761 Type VII | IPC 4761 Type VII | none |
| Min. Drill-Ø | 200µm | 150µm | 100µm |
| Min. Pad-Ø | 400µm | 350µm | 300µm |
| Max. Drill-Ø | 500µm | 400µm | - |
| Max. Pad-Ø | 700µm | 600µm | - |
| Min. Pitch | 600µm | 550µm | 500µm |
| Aspect Ratio: Via | 1:12 | 1:12 | 1:10 |
| Aspect Ratio: Blind Via | 1:1 | 1:1 | 1:1 |
Pitch
The minimum pitch for Via-in-Pad solutions is 600µm (standard technology).
This results of:
- 200µm min. drill diameter
- 400µm min. pad size
- 50µm min. solder-stop clearance
- 100µm min. solder-stop bridge
A via diameter of 100µm is possible, and results in a pitch of 500μm. Please contact our cam department in advance.
Workflow
