The use of Via-in-Pad technology is increasingly influenced through the necessity of high-density BGAs (ball grid arrays) and the miniaturization of SMD chips.
With a reliable Via Filling / Capping process, without enclosures of chemicals, it is possible to produce high-density PCB designs with Via-in-Pad technology, avoiding soldering errors (see Filled & Capped Vias).
Amongst other things, this faciliates additional conductor traces for BGAs (marked red in the picture).
We use this technology for years now and know how to ensure a reliable and safe production process.
- Improved thermal dissipation
- Increased voltage capability of the via
- Provides a flat, coplanar surface
- Lower inductance due to no dog-bone pads with traces
Most economical are via-in-pad solutions with Ø ≥ 200 microns!