High-Tg circuit boards (HTg)

High-Tg PCB with Taconic TLX

For printed circuit boards exposed to high thermal loads, the necessary long-term operating temperature must be determined early on, in order to select an appropriate material.

The Tg value of the base material can be used for this purpose as a reference. Below we have summarized the details for you.

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Typical application areas

  • Multilayer boards with many layers
  • Industrial electronics
  • Automobile electronics
  • Fineline trace structures
  • High temperature electronics 

Tg Value

The glass transition temperature (Tg) is an important normative dimension for the base material that determines the temperature at which the resin matrix converts from a glassy, brittle condition into a soft, elastic one.

The Tg value of the base material sets here an upper boundary, at which the resin matrix decomposes and a subsequent delamination occurs. The Tg is thus not the value of the maximum operational temperature, but rather that which the material can endure for only a very short time.

A guideline for a continuous thermal load is an operating temperature approximately 25°C below the Tg.

When the glass transition temperature (Tg) is over 170°C, it is referred to as a high Tg material.

High Tg materials have the following properties:

  • High glass flow temperature value (Tg)
  • High temperature durability
  • Long delamination durability
  • Low Z axis expansion (CTE)

Technical options for High-Tg circuit boards

Material for High-Tg boards PCB TgTg PCB CTE-zCTE-z PCB dielectric constantεr PCB electric strenghtElectric strenght PCB surface resistivitySurface resistivity PCB tracing resistanceCTI PCB Td260Td260 PCB Td288Td288 PCB Td valueTd value PCB peel strengthPeel strength
Material for High-Tg boards PCB TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantεr@1GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityPCB tracing resistanceCTIVPCB Td260Td260minPCB Td288Td288minPCB Td valueTd value°CPCB peel strengthPeel strengthN/mm
Material for High-Tg boardsISOLA IS410
High-Tg, CAF-Enhanced
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constantεr3,90PCB electric strenghtElectric strenght50PCB surface resistivitySurface resistivity8,0 x 10^6PCB tracing resistanceCTIPLC 3PCB Td260Td26050PCB Td288Td28810PCB Td valueTd value350°PCB peel strengthPeel strength1,2
Material for High-Tg boardsISOLA IS420
High-Tg, CAF-Enhanced
PCB TgTg170°PCB CTE-zCTE-z45PCB dielectric constantεr4,17PCB electric strenghtElectric strenght40PCB surface resistivitySurface resistivity3,0 x 10^6PCB tracing resistanceCTIPLC 3PCB Td260Td26060PCB Td288Td28815PCB Td valueTd value350°PCB peel strengthPeel strength1,3
Material for High-Tg boardsISOLA G200
BT-Epoxy
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constantεr3,70PCB electric strenghtElectric strenght45PCB surface resistivitySurface resistivity2,2 x 10^6PCB tracing resistanceCTIPLC 3PCB Td260Td26060PCB Td288Td28810PCB Td valueTd value325°PCB peel strengthPeel strength1,0
Material for High-Tg boardsShengyi S1000-2
FR4 High-Tg alternative
PCB TgTg180°PCB CTE-zCTE-z45PCB dielectric constantεr4,80*PCB electric strenghtElectric strenght63PCB surface resistivitySurface resistivity7,9 x 10^7PCB tracing resistanceCTIPLC 3PCB Td260Td26060PCB Td288Td28820PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsITEQ IT-180A
FR4 High-Tg alternative
PCB TgTg175°PCB CTE-zCTE-z45PCB dielectric constantεr4,40PCB electric strenghtElectric strenght30PCB surface resistivitySurface resistivity1 x 10^4PCB tracing resistanceCTI-PCB Td260Td26060PCB Td288Td28830PCB Td valueTd value345°PCB peel strengthPeel strength1,0

*CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board

Depending on the stock on hand, the materials listed may be replaced by technically equivalent or similar products. For critical tolerances, please discuss your requirements with our engineers.

Overview of technical options for special production circuit boards.


High-Tg printed circuit board (HTg PWB)

CTE-z

The CTE value shows the thermal expansion of the base material. CTE-z represents the z-axis and is e.g. due to the stability of the vias, of high importance. A higher Tg value favors a low CTE-z value which represents the absolute expansion in the z-axis. Errors like pad lifting, corner cracks and cracks within the via can be prevented through a low CTE-z value.


T260 - T288 value, Td

The decomposition temperature Td of a resin system depends on the binding energies within the polymers, and not on the glass transition temperature Tg. A good indicator for this characteristic is the T260 or T288 value, which specifies the time until delamination at 260°C or 288°C, respectively.

A very important indicator of the heat resistance is the time-to-delamination at a certain temperature. This test is preferably performed at 260 °C or 288 °C. The T260- or T288-value is the time to delamination of the tested material at 260 °C or 288 °C, repectively.

Td: Temperature-of-decomposition indicates the temperature at which the base material has lost 5% by weight and is an important parameter for the thermal stability of a base material. Through exceeding this temperature an irreversible degradation and damage to the material by the decomposition occurs.