High frequency circuit boards

High frequency PCB with Rogers material

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (εr) of the materials used.

Multi-CB provides you with know-how, all popular materials and qualified manufacturing processes - reliably even for complex requirements.

Design of HF circuit boards

Multi CB supports you starting immediately in the design phase. We help you to find appropriate substrates, dimensioning the conductor width and spacing, as well as with calculating the impedances.

Our offer for HF circuit boards:

  • HF-material (low-loss), e.g. PTFE substrate
  • Impedance controlled multilayers
  • Sandwich buildup for material combinations
  • Microvias strating from 75µm
  • Controlled production line / with comprehensive test certificate, as needed
  • Backdrill

Materials used for HF circuit boards

High-frequency boards, e.g. for wireless applications and data rates in the upper GHz range have  special demands on the material used:

  • Adapted permittivity
  • Low attenuation for efficient signal transmission
  • Homogeneous construction with low tolerances in insulation thickness and dielectric constant

For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

Material for high frequency boards Leiterplatte TgTg PCB CTE-zCTE-z PCB dielectric constantεr PCB electric strenghtElectric strenght PCB surface resistivitySurface resistivity PCB thermal conductive factorThermal conductive factor PCB Td260Td260 PCB Td288Td288 PCB Td valueTd value PCB peel strength KupferhaftungPeel strength
Material for high frequency boards Leiterplatte TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantεr PCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityMOPCB thermal conductive factorThermal conductive factorW/m*KPCB Td260Td260minPCB Td288Td288minPCB Td valueTd value°CPCB peel strength KupferhaftungPeel strengthN/mm
Material for high frequency boardsRogers 4350B
HF material
Leiterplatte TgTg280°PCB CTE-zCTE-z50PCB dielectric constantεr3,5@10GHzPCB electric strenghtElectric strenght31PCB surface resistivitySurface resistivity5,7 x 10^9PCB thermal conductive factorThermal conductive factor0,69PCB Td260Td260-PCB Td288Td288390°PCB Td valueTd value0,9PCB peel strength KupferhaftungPeel strength 
Material for high frequency boardsISOLA IS620
E-fibre glas
Leiterplatte TgTg220°PCB CTE-zCTE-z55PCB dielectric constantεr4,5@1MHzPCB electric strenghtElectric strenght37PCB surface resistivitySurface resistivity7,3 x 10^6PCB thermal conductive factorThermal conductive factor-PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsTaconic RF-35
Ceramic
Leiterplatte TgTg315°PCB CTE-zCTE-z64PCB dielectric constantεr3,5@1,9GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1,46 x 10^8PCB thermal conductive factorThermal conductive factor0,24PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,8
Material for high frequency boardsTaconic TLX
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z135PCB dielectric constantεr2,5@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7PCB thermal conductive factorThermal conductive factor0,19PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsTaconic TLC
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z70PCB dielectric constantεr3,2@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7PCB thermal conductive factorThermal conductive factor0,24PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3001
Bonding Film for PTFE
Leiterplatte TgTg160PCB CTE-zCTE-z-PCB dielectric constantεr2,28PCB electric strenghtElectric strenght98PCB surface resistivitySurface resistivity1 x 10^9PCB thermal conductive factorThermal conductive factor0,22PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3003
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z25PCB dielectric constantεr3,0@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7PCB thermal conductive factorThermal conductive factor0,50PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value500PCB peel strength KupferhaftungPeel strength2,2
Material for high frequency boardsRogers RO3006
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z24PCB dielectric constantεr6,2@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5PCB thermal conductive factorThermal conductive factor0,79PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value500PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsRogers RO3010
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z16PCB dielectric constantεr10@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5PCB thermal conductive factorThermal conductive factor0,95PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value500PCB peel strength KupferhaftungPeel strength1,6

Complete overview of available circuit board materials

Depending on the stock on hand, the materials listed may be replaced by technically equivalent or similar products. For critical tolerances, please discuss your requirements with our engineers.


Impedance Check

The impedance defined by the customer is tested by our CAM station engineers on manufacturability. Depending on the layer buildup, the PCB layout and the customer's requested impedances a calculation model is chosen. The result is any required modification of the layer builduo and the necessary adjustments to the relevant conductor geometries.

Please also refer to our pages for impedance control of printed circuit boards.

After the manufacture of high frequency circuit boards, the impedances are checked (with a precision of up to 5%), and the detailed results are recorded exactly in a test protocol.