Thick-Copper technology offers the possibility to implement complex switches in limited space in combination with circuitry for high current levels.
Multi-CB has reliable processes to produce copper layer thicknesses up to 400µm (also for multilayers).
Thick-Copper circuit boards
Application
End-Dicke* | Leiterbahnbreite min. | Leiterbahnabst. min. | |||
---|---|---|---|---|---|
End-Dicke* | 105µm | Leiterbahnbreite min. | 250µm | Leiterbahnabst. min. | 250µm |
End-Dicke* | 140µm | Leiterbahnbreite min. | 350µm | Leiterbahnabst. min. | 350µm |
End-Dicke* | 210µm | Leiterbahnbreite min. | 500µm | Leiterbahnabst. min. | 500µm |
End-Dicke* | 400µm** | Leiterbahnbreite min. | 900µm | Leiterbahnabst. min. | 900µm |
- High current applications
- Thermal distribution for good thermal management
- Heat dissipation of components with large power loss
Außenlagen
Innenlagen
Kupferfolie-Dicke | Leiterbahnbreite min. | Leiterbahnabst. min. | |||
---|---|---|---|---|---|
Kupferfolie-Dicke | 105µm | Leiterbahnbreite min. | 250µm | Leiterbahnabst. min. | 250µm |
Kupferfolie-Dicke | 140µm | Leiterbahnbreite min. | 300µm | Leiterbahnabst. min. | 300µm |
Kupferfolie-Dicke | 210µm | Leiterbahnbreite min. | 500µm | Leiterbahnabst. min. | 500µm |
Kupferfolie-Dicke | 400µm** | Leiterbahnbreite min. | 900µm | Leiterbahnabst. min. | 900µm |
Technical options for thick copper circuit boards
Outer layers
Final thickness* | Min. conductor width | Min. conductor spacing | |||
---|---|---|---|---|---|
Final thickness* | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
Final thickness* | 140µm | Min. conductor width | 350µm | Min. conductor spacing | 350µm |
Final thickness* | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
Final thickness* | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
Inner layers
Copper foil thickness | Min. conductor width | Min. conductor spacing | |||
---|---|---|---|---|---|
Copper foil thickness | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
Copper foil thickness | 140µm | Min. conductor width | 300µm | Min. conductor spacing | 300µm |
Copper foil thickness | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
Copper foil thickness | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
* after electroplating
** only on request