The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.
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The following special circuit board types are available from Multi-CB:
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Design | 1 to 10 layers, plated-through | Notes | Layer buildup | |
| Options | Conductor width min. | 100µm | Notes | ||
| Options | Annular ring min. | 100µm | Notes | ||
| Options | Via min. Ø | 150µm | Notes | ||
| Options | Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Notes | Surfaces | |
| Options | Materials | Polyimide, high Tg polyimide | Notes | Materials | |
| Options | Material thickness | starting at 25µm foil plus copper | Notes | ||
| Options | Copper thickness | from 18µm | Notes | ||
| Options | Stiffener | 0,025µm - 3,20mm | Notes | ||
| Options | Max. size | 250mm x 450mm | Notes | larger on request | |
| Options | Cover | Coverlay or flexible solder-stop | Notes | ||
| Options | Cover bridge | Coverlay: ≥ 200µm | Notes | ||
| Options | Flex. solder-stop: ≥ 100µm | Notes | |||
| Options | Impedance control | Yes (10% tolerance) | Notes | ||
| Options | Adhesive tape | 3M 9077 | Notes | Materials |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Layers | 2 to 24 layers, incl. "flying tails" | Notes | Layer buildup | |
| Options | Conductor width min. | 75µm | Notes | ||
| Options | Annular ring min. | 125µm | Notes | ||
| Options | Via min. Ø | 100µm | Notes | ||
| Options | Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Notes | Surfaces | |
| Options | Materials | Polyimide, high Tg polyimide, FR4, FR4 high Tg | Notes | Materials | |
| Options | Material thickness | Polyimide starting at 62µm doublesided, FR4 starting at 100µm | Notes | ||
| Options | Max. size | 250mm x 450mm | Notes | larger on request | |
| Options | Solder-stop | Coverlay or flexible solder-stop | Notes |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Material | Aluminium core, FR4 prepreg | Notes | Data sheets | |
| Options | Max. size | 230mm x 380mm | Notes | ||
| Options | Aluminium thickness | 1.5mm, 2.0mm | Notes | ||
| Options | Initial copper | 35µm (for 1.5mm), 140µm (for 2.0mm) | Notes | ||
| Options | Surface | HAL lead-free, chemical gold, immersion tin | Notes | Surfaces | |
| Options | RoHS compliant | yes | Notes |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Material | Aluminium core, FR4 prepreg | Notes | Data sheets | |
| Options | Max. size | 800mm x 800mm | Notes | ||
| Options | Aluminium thickness | 0.8mm, 1.0mm, 1.5mm | Notes | in stock | |
| Options | 1.2mm, 2.0mm | Notes | On request | ||
| Options | Basis copper | 18µm, 35µm, 70µm | Notes | ||
| Options | Surface | HAL lead-free, Chemical gold, immersion tin | Notes | Surfaces | |
| Options | RoHS compliant | yes | Notes |
| Final thickness* | Min. conductor width | Min. conductor spacing | |||
|---|---|---|---|---|---|
| Final thickness* | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
| Final thickness* | 140µm | Min. conductor width | 350µm | Min. conductor spacing | 350µm |
| Final thickness* | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
| Final thickness* | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
| Copper foil thickness | Min. conductor width | Min. conductor spacing | |||
|---|---|---|---|---|---|
| Copper foil thickness | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
| Copper foil thickness | 140µm | Min. conductor width | 300µm | Min. conductor spacing | 300µm |
| Copper foil thickness | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
| Copper foil thickness | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
* after electroplating
** only on request
