The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.
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The following special circuit board types are available from Multi-CB:
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Design | 1 to 10 layers, plated-through | Notes | Layer buildup | |
| Options | Conductor width min. | 100µm | Notes | ||
| Options | Annular ring min. | 100µm | Notes | ||
| Options | Via min. Ø | 150µm | Notes | ||
| Options | Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Notes | Surfaces | |
| Options | Materials | Polyimide, high Tg polyimide | Notes | Materials | |
| Options | Material thickness | starting at 25µm foil plus copper | Notes | ||
| Options | Copper thickness | from 18µm | Notes | ||
| Options | Stiffener | 0,025µm - 3,20mm | Notes | ||
| Options | Max. size | 250mm x 450mm | Notes | larger on request | |
| Options | Cover | Coverlay or flexible solder-stop | Notes | ||
| Options | Cover bridge | Coverlay: ≥ 200µm | Notes | ||
| Options | Flex. solder-stop: ≥ 100µm | Notes | |||
| Options | Impedance control | Yes (10% tolerance) | Notes | ||
| Options | Adhesive tape | 3M 9077 | Notes | Materials |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Layers | 2 to 24 layers, incl. "flying tails" | Notes | Layer buildup | |
| Options | Conductor width min. | 75µm | Notes | ||
| Options | Annular ring min. | 125µm | Notes | ||
| Options | Via min. Ø | 100µm | Notes | ||
| Options | Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Notes | Surfaces | |
| Options | Materials | Polyimide, high Tg polyimide, FR4, FR4 high Tg | Notes | Materials | |
| Options | Material thickness | Polyimide starting at 62µm doublesided, FR4 starting at 100µm | Notes | ||
| Options | Max. size | 250mm x 450mm | Notes | larger on request | |
| Options | Solder-stop | Coverlay or flexible solder-stop | Notes |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Material | Aluminium core | Notes | Data sheets | |
| Options | Max. size | 420mm x 570mm | Notes | ||
| Options | Aluminium thickness | 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm | Notes | Standard: 1.5mm | |
| Options | Copper | 35µm, 70µm, 105µm only2.0mm) | Notes | Standard: 35µm | |
| Options | Insulation thickness | 75µm, 100µm, 125µm, 150µm | Notes | Standard: 100µm | |
| Options | Thermal conductivity | 1.0W/mK - 8.0W/mK | Notes | Standard: 2.0W/mK | |
| Options | Surface | HAL lead-free, chemical gold | Notes | Surfaces | |
| Options | Solder-stop | white, black, green, red, blue | Notes | Standard: white | |
| Options | Legend print | black, white | Notes | ||
| Options | Milling | yes | Notes | ||
| Options | V-Scoring | yes | Notes | clean & simple | |
| Options | Z-Axis milling | yes | Notes | ||
| Options | RoHS compliant | yes | Notes | ||
| Options | UL-certified | yes | Notes |
| Material for metal core boards 1 Layer |  Thermal conductivity |  Thermal resistance |  Surface resistivity |  Dielectric glass transition |  Dielectric Breakdown (AC)* |  CTI | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Material for metal core boards 1 Layer | Thermal conductivity | W/mK | Thermal resistance | K/W | Surface resistivity | MΩ | Dielectric glass transition | °C | Dielectric Breakdown (AC)* | kV | CTI | PLC | |
| Material for metal core boards 1 Layer | TC-Lam 2.0 | Thermal conductivity | 2.0 | Thermal resistance | 0.50 | Surface resistivity | 10^7 | Dielectric glass transition | 100 | Dielectric Breakdown (AC)* | 5.0 | CTI | 0 |
| Material for metal core boards 1 Layer | HA50 (3) | Thermal conductivity | 2.2 | Thermal resistance | 0.41 | Surface resistivity | 10^6 | Dielectric glass transition | 120 | Dielectric Breakdown (AC)* | 4.3 | CTI | 0 |
| Material for metal core boards 1 Layer | AL-200 | Thermal conductivity | 2.0 | Thermal resistance | 0.35 | Surface resistivity | 10^8 | Dielectric glass transition | - | Dielectric Breakdown (AC)* | 3.5 | CTI | 0 |
| Material for metal core boards 1 Layer | AL-300 | Thermal conductivity | 3.0 | Thermal resistance | 0.30 | Surface resistivity | 10^8 | Dielectric glass transition | - | Dielectric Breakdown (AC)* | 3.5 | CTI | 0 |
| Material for metal core boards 1 Layer | Ventek VT-4B1 flexible | Thermal conductivity | 1.0 | Thermal resistance | - | Surface resistivity | 10^7 | Dielectric glass transition | 100 | Dielectric Breakdown (AC)* | 7.5 | CTI | 0 |
| Material for metal core boards 1 Layer | Ventek VT-4B3 limited flexible | Thermal conductivity | 3.0 | Thermal resistance | - | Surface resistivity | 10^8 | Dielectric glass transition | 130 | Dielectric Breakdown (AC)* | 9.0 | CTI | 0 |
* Examples for 100μm dielectric or 80μm for CCAF material
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Material | Aluminium core, FR4 prepreg | Notes | Data sheets | |
| Options | Max. size | 800mm x 800mm | Notes | ||
| Options | Aluminium thickness | 0.8mm, 1.0mm, 1.5mm | Notes | in stock | |
| Options | 1.2mm, 2.0mm | Notes | On request | ||
| Options | Basis copper | 18µm, 35µm, 70µm | Notes | ||
| Options | Surface | HAL lead-free, Chemical gold, immersion tin | Notes | Surfaces | |
| Options | RoHS compliant | yes | Notes |
| Material for metal core boards 2 Layers (plated-through) | Thermal conductivity | Thermal resistance | Surface resistivity | Dielectric glass transition | Dielectric Breakdown (AC)* | CTI | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Material for metal core boards 2 Layers (plated-through) | Thermal conductivity | W/mK | Thermal resistance | K/W | Surface resistivity | MΩ | Dielectric glass transition | °C | Dielectric Breakdown (AC)* | kV | CTI | PLC | |
| Material for metal core boards 2 Layers (plated-through) | CCAF-05 | Thermal conductivity | 2.2 | Thermal resistance | 0.45 | Surface resistivity | 10^6 | Dielectric glass transition | - | Dielectric Breakdown (AC)* | 6.0 | CTI | 0 |
| Material for metal core boards 2 Layers (plated-through) | Ventek VT-4A2 | Thermal conductivity | 2.2 | Thermal resistance | - | Surface resistivity | 10^7 | Dielectric glass transition | 130 | Dielectric Breakdown (AC)* | 7.5 | CTI | 0 |
| Material for metal core boards 2 Layers (plated-through) | Ventek VT-4B1 flexible | Thermal conductivity | 1.0 | Thermal resistance | - | Surface resistivity | 10^7 | Dielectric glass transition | 100 | Dielectric Breakdown (AC)* | 7.5 | CTI | 0 |
| Material for metal core boards 2 Layers (plated-through) | Ventek VT-4B3 limited flexible | Thermal conductivity | 3.0 | Thermal resistance | - | Surface resistivity | 10^8 | Dielectric glass transition | 130 | Dielectric Breakdown (AC)* | 9.0 | CTI | 0 |
* Examples for 100μm dielectric or 80μm for CCAF material
| Material for high frequency boards |  Tg |  CTE-z |  Ԑr |  Electric strenght | Surface resistivity | Thermal conductivity |  Dk Loss Tangent |  Td value |  Peel strength | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Material for high frequency boards | Tg | °C | CTE-z | ppm/°C | Ԑr | @10GHz | Electric strenght | KV/mm | Surface resistivity | MΩ | Thermal conductivity | W/m*K | Dk Loss Tangent | @10GHz | Td value | °C | Peel strength | N/mm | |
| Material for high frequency boards | Rogers 4350B HF material | Tg | 280° | CTE-z | 32 | Ԑr | 3,48 | Electric strenght | 31 | Surface resistivity | 5,7 x 10^9 | Thermal conductivity | 0,69 | Dk Loss Tangent | 0,0037 | Td value | 390° | Peel strength | 0,9 |
| Material for high frequency boards | ISOLA IS620 E-fibre glas | Tg | 220° | CTE-z | 55 | Ԑr | 4,45* | Electric strenght | - | Surface resistivity | 2,8 x 10^6 | Thermal conductivity | - | Dk Loss Tangent | 0,0080* | Td value | - | Peel strength | 1,2 |
| Material for high frequency boards | Taconic RF-35 Ceramic | Tg | 315° | CTE-z | 64 | Ԑr | 3,50** | Electric strenght | - | Surface resistivity | 1,5 x 10^8 | Thermal conductivity | 0,24 | Dk Loss Tangent | 0,0018** | Td value | - | Peel strength | 1,8 |
| Material for high frequency boards | Taconic TLX PTFE | Tg | - | CTE-z | 135 | Ԑr | 2,50 | Electric strenght | - | Surface resistivity | 1 x 10^7 | Thermal conductivity | 0,19 | Dk Loss Tangent | 0,0019 | Td value | - | Peel strength | 2,1 |
| Material for high frequency boards | Taconic TLC PTFE | Tg | - | CTE-z | 70 | Ԑr | 3,20 | Electric strenght | - | Surface resistivity | 1 x 10^7 | Thermal conductivity | 0,24 | Dk Loss Tangent | - | Td value | - | Peel strength | 2,1 |
| Material for high frequency boards | Rogers RO3001 Bonding Film for PTFE | Tg | 160° | CTE-z | - | Ԑr | 2,28 | Electric strenght | 98 | Surface resistivity | 1 x 10^9 | Thermal conductivity | 0,22 | Dk Loss Tangent | 0,0030 | Td value | - | Peel strength | 2,1 |
| Material for high frequency boards | Rogers RO3003 PTFE ceramic-filled | Tg | - | CTE-z | 25 | Ԑr | 3,00 | Electric strenght | - | Surface resistivity | 1 x 10^7 | Thermal conductivity | 0,50 | Dk Loss Tangent | 0,0013 | Td value | 500° | Peel strength | 2,2 |
| Material for high frequency boards | Rogers RO3006 PTFE ceramic-filled | Tg | - | CTE-z | 24 | Ԑr | 6,15 | Electric strenght | - | Surface resistivity | 1 x 10^5 | Thermal conductivity | 0,79 | Dk Loss Tangent | 0,0020 | Td value | 500° | Peel strength | 1,2 |
| Material for high frequency boards | Rogers RO3010 PTFE ceramic-filled | Tg | - | CTE-z | 16 | Ԑr | 10,20 | Electric strenght | - | Surface resistivity | 1 x 10^5 | Thermal conductivity | 0,95 | Dk Loss Tangent | 0,0022 | Td value | 500° | Peel strength | 1,6 |
| Material for high frequency boards | ARLON 85N Polyimide HTg | Tg | 250° | CTE-z | 55 | Ԑr | 4,20* | Electric strenght | 57 | Surface resistivity | 1,6 x 10^9 | Thermal conductivity | 0,20 | Dk Loss Tangent | 0,0100* | Td value | 387° | Peel strength | 1,2 |
| Material for High-Tg boards | Tg | CTE-z | Ԑr | Electric strenght | Surface resistivity | CTI | Thermal conductivity | Td value | Peel strength | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Material for High-Tg boards | Tg | °C | CTE-z | ppm/°C | Ԑr | @1GHz | Electric strenght | KV/mm | Surface resistivity | MΩ | CTI | PLC | Thermal conductivity | W/m*K | Td value | °C | Peel strength | N/mm | |
| Material for High-Tg boards | ISOLA IS410 HTg, CAF-Enhanced | Tg | 180° | CTE-z | 55 | Ԑr | 3,97 | Electric strenght | 44 | Surface resistivity | 8,0 x 10^6 | CTI | 3 | Thermal conductivity | 0,50 | Td value | 315° | Peel strength | 1,6 |
| Material for High-Tg boards | ISOLA IS420 HTg, CAF-Enhanced | Tg | 170° | CTE-z | 45 | Ԑr | 4,04 | Electric strenght | 54 | Surface resistivity | 3,0 x 10^6 | CTI | 3 | Thermal conductivity | 0,40 | Td value | 350° | Peel strength | 1,3 |
| Material for High-Tg boards | Shengyi S1000-2 FR4 HTg alternative | Tg | 180° | CTE-z | 45 | Ԑr | 4,80* | Electric strenght | - | Surface resistivity | 7,9 x 10^7 | CTI | 3 | Thermal conductivity | - | Td value | 345° | Peel strength | 1,4 |
| Material for High-Tg boards | ITEQ IT-180A FR4 HTg alternative | Tg | 175° | CTE-z | 45 | Ԑr | 4,40 | Electric strenght | 45 | Surface resistivity | 3,0 x 10^10 | CTI | - | Thermal conductivity | - | Td value | 345° | Peel strength | 1,4 |
| Material for High-Tg boards | ARLON 85N Polyimide HTg | Tg | 250° | CTE-z | 55 | Ԑr | 4,20* | Electric strenght | 57 | Surface resistivity | 1,6 x 10^9 | CTI | - | Thermal conductivity | 0,20 | Td value | 387° | Peel strength | 1,2 |
* at 1MHz
CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board
| Final thickness* | Min. conductor width | Min. conductor spacing | |||
|---|---|---|---|---|---|
| Final thickness* | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
| Final thickness* | 140µm | Min. conductor width | 350µm | Min. conductor spacing | 350µm |
| Final thickness* | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
| Final thickness* | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
| Copper foil thickness | Min. conductor width | Min. conductor spacing | |||
|---|---|---|---|---|---|
| Copper foil thickness | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
| Copper foil thickness | 140µm | Min. conductor width | 300µm | Min. conductor spacing | 300µm |
| Copper foil thickness | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
| Copper foil thickness | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
* after electroplating
** only on request
