Special production circuit boards

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

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High-tech options

Circuit boards up to 48 layers
Finest line starting from 75µm
Film-free laser direct imaging (LDI)
Micro vias starting at 75µm
Blind and buried vias
Laser vias
Via tenting, plugging, filling
Plated half-holes
Thin laminates starting at 50µm core
Custom layer buildup

Sandwich buildup
Plated slots
Thick copper up to 450µm
Circuit board thicknesses up to 7mm
Depth milling (Z axis) and backdrill
Impedance control
Solder-stop: special colours and coatings
Aluminium core, with plated contacts
Peelable solder-stop
...

Design Parameters

Special board types

The following special circuit board types are available from Multi-CB:

Flexible circuit boards (also plated-through)
Rigid-Flex circuit boards
High frequency circuit boards

High Tg circuit boards (high temperature resistance)
Metal core circuit boards (also plated-through)
Thick copper circuit boards

Technical options for flexible circuit boards

Flexible circuit boards

Options
Options	Design	1 to 10 layers, plated-through	Notes	Layer buildup
Options	Conductor width min.	0.1mm	Notes
Options	Annular ring min.	0.1mm	Notes
Options	Via min. Ø	0.15mm	Notes
Options	Surfaces	Chemical gold (recommended), immersion tin, HAL lead-free	Notes	Surfaces
Options	Materials	Polyimide, high Tg polyimide	Notes	Materials
Options	Material thickness	starting at 25µm foil plus copper	Notes
Options	Copper thickness	from 18µm	Notes
Options	Stiffener	0,025µm - 3,20mm	Notes
Options	Max. size	250mm x 450mm	Notes	larger on request
Options	Cover	Coverlay or flexible solder-stop	Notes
Options	Cover bridge	Coverlay: ≥ 200µm	Notes
Options		Flex. solder-stop: ≥ 100µm	Notes
Options	Impedance control	Yes (10% tolerance)	Notes
Options	Adhesive tape	3M 9077	Notes	Materials

Technical options for Rigid-Flex circuit boards

Rigid-Flex circuit boards

Options
Options	Layers	2 to 24 layers, incl. "flying tails"	Notes	Layer buildup
Options	Conductor width min.	0.075mm	Notes
Options	Annular ring min.	0.125mm	Notes
Options	Via min. Ø	0.1mm	Notes
Options	Surfaces	Chemical gold (recommended), immersion tin, HAL lead-free	Notes	Surfaces
Options	Materials	Polyimide, high Tg polyimide, FR4, FR4 high Tg	Notes	Materials
Options	Material thickness	Polyimide starting at 62µm doublesided, FR4 starting at 100µm	Notes
Options	Max. size	250mm x 450mm	Notes	larger on request
Options	Solder-stop	Coverlay or flexible solder-stop	Notes

Technical options for metal core circuit boards

Metal core circuit boards

Options
Options	Material	Aluminium core	Notes	Data sheets
Options	Max. size	420mm x 570mm	Notes
Options	Aluminium thickness	0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm	Notes	Standard: 1.5mm
Options	Copper	35µm, 70µm, 105µm only2.0mm)	Notes	Standard: 35µm
Options	Insulation thickness	75µm, 100µm, 125µm, 150µm	Notes	Standard: 100µm
Options	Thermal conductivity	1.0W/mK - 8.0W/mK	Notes	Standard: 2.0W/mK
Options	Surface	HAL lead-free, chemical gold	Notes	Surfaces
Options	Solder-stop	white, black, green, red, blue	Notes	Standard: white
Options	Legend print	black, white	Notes
Options	Milling	yes	Notes
Options	V-Scoring	yes	Notes	clean & simple
Options	Z-Axis milling	yes	Notes
Options	RoHS compliant	yes	Notes
Options	UL-certified	yes	Notes

Material metal core 1 layer

Material for metal core boards 1 Layer	Thermal conductivity	Thermal resistance	Surface resistivity	Dielectric glass transition	Dielectric Breakdown (AC)*	CTI
Material for metal core boards 1 Layer		Thermal conductivity	W/mK	Thermal resistance	K/W	Surface resistivity	MΩ	Dielectric glass transition	°C	Dielectric Breakdown (AC)*	kV	CTI	PLC
Material for metal core boards 1 Layer	TC-Lam 2.0	Thermal conductivity	2.0	Thermal resistance	0.50	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	5.0	CTI	0
Material for metal core boards 1 Layer	HA50 (3)	Thermal conductivity	2.2	Thermal resistance	0.41	Surface resistivity	10^6	Dielectric glass transition	120	Dielectric Breakdown (AC)*	4.3	CTI	0
Material for metal core boards 1 Layer	AL-200	Thermal conductivity	2.0	Thermal resistance	0.35	Surface resistivity	10^8	Dielectric glass transition	-	Dielectric Breakdown (AC)*	3.5	CTI	0
Material for metal core boards 1 Layer	AL-300	Thermal conductivity	3.0	Thermal resistance	0.30	Surface resistivity	10^8	Dielectric glass transition	-	Dielectric Breakdown (AC)*	3.5	CTI	0
Material for metal core boards 1 Layer	Ventek VT-4B1 flexible	Thermal conductivity	1.0	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 1 Layer	Ventek VT-4B3 limited flexible	Thermal conductivity	3.0	Thermal resistance	-	Surface resistivity	10^8	Dielectric glass transition	130	Dielectric Breakdown (AC)*	9.0	CTI	0

* Examples for 100μm dielectric or 80μm for CCAF material

Material metal core 2 layers

Material for metal core boards 2 Layers (plated-through)	Thermal conductivity	Thermal resistance	Surface resistivity	Dielectric glass transition	Dielectric Breakdown (AC)*	CTI
Material for metal core boards 2 Layers (plated-through)		Thermal conductivity	W/mK	Thermal resistance	K/W	Surface resistivity	MΩ	Dielectric glass transition	°C	Dielectric Breakdown (AC)*	kV	CTI	PLC
Material for metal core boards 2 Layers (plated-through)	CCAF-05	Thermal conductivity	2.2	Thermal resistance	0.45	Surface resistivity	10^6	Dielectric glass transition	-	Dielectric Breakdown (AC)*	6.0	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4A2	Thermal conductivity	2.2	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	130	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4B1 flexible	Thermal conductivity	1.0	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4B3 limited flexible	Thermal conductivity	3.0	Thermal resistance	-	Surface resistivity	10^8	Dielectric glass transition	130	Dielectric Breakdown (AC)*	9.0	CTI	0

* Examples for 100μm dielectric or 80μm for CCAF material

Technical options for High Freqency circuit boards

High Freqency circuit boards

Material for high frequency boards	Tg	CTE-z	Ԑr	Electric strenght	Surface resistivity	Thermal conductivity	Dk Loss Tangent	Td value	Peel strength
Material for high frequency boards		Tg	°C	CTE-z	ppm/°C	Ԑr	@10GHz	Electric strenght	KV/mm	Surface resistivity	MΩ	Thermal conductivity	W/m*K	Dk Loss Tangent	@10GHz	Td value	°C	Peel strength	N/mm
Material for high frequency boards	Rogers 4350B HF material	Tg	280°	CTE-z	32	Ԑr	3,5	Electric strenght	31	Surface resistivity	5,7 x 10^9	Thermal conductivity	0,69	Dk Loss Tangent	0,0037	Td value	390°	Peel strength	0,9
Material for high frequency boards	ISOLA IS620 E-fibre glas	Tg	220°	CTE-z	55	Ԑr	4,5*	Electric strenght	-	Surface resistivity	2,8 x 10^6	Thermal conductivity	-	Dk Loss Tangent	0,0080*	Td value	-	Peel strength	1,2
Material for high frequency boards	Taconic RF-35 Ceramic	Tg	315°	CTE-z	64	Ԑr	3,5**	Electric strenght	-	Surface resistivity	1,5 x 10^8	Thermal conductivity	0,24	Dk Loss Tangent	0,0018**	Td value	-	Peel strength	1,8
Material for high frequency boards	Taconic TLX PTFE	Tg	-	CTE-z	135	Ԑr	2,5	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,19	Dk Loss Tangent	0,0019	Td value	-	Peel strength	2,1
Material for high frequency boards	Taconic TLC PTFE	Tg	-	CTE-z	70	Ԑr	3,2	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,24	Dk Loss Tangent	-	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3001 Bonding Film for PTFE	Tg	160°	CTE-z	-	Ԑr	2,3	Electric strenght	98	Surface resistivity	1 x 10^9	Thermal conductivity	0,22	Dk Loss Tangent	0,0030	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3003 PTFE ceramic-filled	Tg	-	CTE-z	25	Ԑr	3,0	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,50	Dk Loss Tangent	0,0013	Td value	500°	Peel strength	2,2
Material for high frequency boards	Rogers RO3006 PTFE ceramic-filled	Tg	-	CTE-z	24	Ԑr	6,2	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductivity	0,79	Dk Loss Tangent	0,0020	Td value	500°	Peel strength	1,2
Material for high frequency boards	Rogers RO3010 PTFE ceramic-filled	Tg	-	CTE-z	16	Ԑr	10	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductivity	0,95	Dk Loss Tangent	0,0022	Td value	500°	Peel strength	1,6
Material for high frequency boards	ARLON 85N Polyimide HTg	Tg	250°	CTE-z	55	Ԑr	4,2*	Electric strenght	57	Surface resistivity	1,6 x 10^9	Thermal conductivity	0,20	Dk Loss Tangent	0,0100*	Td value	387°	Peel strength	1,2

Technical options for High-Tg circuit boards

High-Tg circuit boards

Material for High-Tg boards	Tg	CTE-z	?r	Electric strenght	Surface resistivity	CTI	Thermal conductivity	Td value	Peel strength
Material for High-Tg boards		Tg	°C	CTE-z	ppm/°C	?r	@1GHz	Electric strenght	KV/mm	Surface resistivity	MO	CTI	PLC	Thermal conductivity	W/m*K	Td value	°C	Peel strength	N/mm
Material for High-Tg boards	ISOLA IS410 FR4 HTg, CAF-Enhanced	Tg	180°	CTE-z	55	?r	4,0	Electric strenght	44	Surface resistivity	8,0 x 10^6	CTI	3	Thermal conductivity	0,5	Td value	350°	Peel strength	1,2
Material for High-Tg boards	ISOLA IS420 FR4 HTg, CAF-Enhanced	Tg	170°	CTE-z	45	?r	4,0	Electric strenght	54	Surface resistivity	3,0 x 10^6	CTI	3	Thermal conductivity	0,4	Td value	350°	Peel strength	1,3
Material for High-Tg boards	ITEQ IT-180A FR4 HTg	Tg	175°	CTE-z	45	?r	4,4	Electric strenght	45	Surface resistivity	3,0 x 10^10	CTI	-	Thermal conductivity	-	Td value	345°	Peel strength	1,4
Material for High-Tg boards	Shengyi S1000-2 FR4 HTg	Tg	180°	CTE-z	45	?r	4,8*	Electric strenght	63	Surface resistivity	7,9 x 10^7	CTI	3	Thermal conductivity	-	Td value	345°	Peel strength	1,4
Material for High-Tg boards	ARLON 85N Polyimid HTg	Tg	250°	CTE-z	55	?r	4,20*	Electric strenght	57	Surface resistivity	1,6 x 10^9	CTI	-	Thermal conductivity	0,2	Td value	387°	Peel strength	1,2

* at 1MHz

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board

Technical options for thick copper circuit boards

Thick copper circuit boards

Outer layers

Final thickness*	Min. conductor width	Min. conductor spacing
Final thickness*	105µm	Min. conductor width	250µm	Min. conductor spacing	250µm
Final thickness*	140µm	Min. conductor width	350µm	Min. conductor spacing	350µm
Final thickness*	210µm	Min. conductor width	500µm	Min. conductor spacing	500µm
Final thickness*	400µm**	Min. conductor width	900µm	Min. conductor spacing	900µm

Inner layers

Copper foil thickness	Min. conductor width	Min. conductor spacing
Copper foil thickness	105µm	Min. conductor width	250µm	Min. conductor spacing	250µm
Copper foil thickness	140µm	Min. conductor width	300µm	Min. conductor spacing	300µm
Copper foil thickness	210µm	Min. conductor width	500µm	Min. conductor spacing	500µm
Copper foil thickness	400µm**	Min. conductor width	900µm	Min. conductor spacing	900µm