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Special production circuit boards

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High-tech options

Design Parameters

 
Design-Aid

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Special board types

The following special circuit board types are available from Multi-CB:

Special production

OptionsInclusiveNotes
Design1 to 10 layers, plated-through-Layer buildup
Conductor width min.100µm100µm
Annular ring min.100µm100µm
Via min. Ø0.15mm0.2mm
SurfacesChemical gold (recommended),
ENEPIG, chem silver
Chemical goldSurfaces
MaterialsPolyimide, high Tg polyimidePolyimideMaterials
Material thicknessstarting at 25µm foil plus copper25µm, 50µm
Copper thicknessfrom 18µm18µm, 35µm
Stiffener0.025µm - 3.20mm0.2mm, 0.3mm
Max. size250mm x 450mm-larger on request
CoverCoverlay or flexible solder-stop-
Cover bridge min.Coverlay: ≥ 350µm
Flex. solder-stop: ≥ 100µm
-Design-Aid
Impedance controlYes (10% tolerance)-
Adhesive tape3M 9077-Materials

Materials for flexible circuit boards

Material for flexible PCBsRecommended max.
operating temperature
Copper typeTgεr, Dk-
Permittivity
CTE-z (T<Tg)Electric
Strenght
Surface
Resistivity
Peel strength
 °C*°C@1MHzppm/°CKV/mmN/mm
Polyimide + Adhesive
Shengyi SF305105°RA-3,6-211 x 10^51,1
Polyimide Adhesiveless
DuPont Pyralux AP180°RA2203,4252561 x 10^101,8
Panasonic RF775130°ED3433,2-2761 x 10^81,7
Thinflex W-05050105°ED3503,3242161 x 10^50,6
PI Coverlay
Shengyi SF305C105°-----3 x 10^6-
DuPont Pyralux FR180°--3,5-1381 x 10^7-
Adhesive tape
3M 9077150°-------

OptionsNotes
Layers2 to 24 layers, incl. "flying tails"Layer buildup
Conductor width min.75µm
Annular ring min.125µm
Via min. Ø0.1mm
SurfacesChemical gold (recommended), immersion tin, HAL lead-freeSurfaces
MaterialsPolyimide, high Tg polyimide, FR4, FR4 high TgMaterials
Material thicknessPolyimide starting at 62µm doublesided, FR4 starting at 100µm
Max. size250mm x 450mm larger on request
Solder-stopCoverlay or flexible solder-stop

OptionsInklusiveNotes
MaterialAluminium core-Datasheets
Max. size420mm x 570mm-
Design1 layer, 2 layers plated-through
Aluminium thickness0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm1.5mm
Copper35µm, 70µm, 105µm, 140µm35µm
Insulation thickness75µm, 100µm, 125µm, 150µm100µm
Thermal conductivity2.0W/mK - 7.0W/mK2.0W/mK
Conductor width min.150µm150µm
Annular ring min.125µm150µm
Drill (NPTH) min. Ø0.5mm0.9mmDesign-Aid
Via min. Ø0.2mm0.2mm
SurfaceHAL lead-free, chemical goldHAL lead-freeSurfaces
Solder-stopwhite, black, green, red, bluewhite, black
Legend printblack, white-
Millingyesyes
V-Scoringyesyesclean & simple
Z-Axis millingyes-
RoHS compliantyesyes
UL-certifiedyesyesUL certificate

* Examples for 100μm dielectric or 80μm for CCAF material
Material for metal core boards
1 Layer
Thermal
conductivity
Thermal
resistance
Surface
Resistivity
Dielectric glass
transition (Tg)
Dielectric
Breakdown (AC)*
Tracking
resistance CTI
 W/mKK/W°CkVPLC
TC-Lam 2.02.00.5010^71005.00
HA50 (3)2.20.4110^61204.30
AL-2002.00.3510^8-3.50
AL-3003.00.3010^8-3.50
Ventec VT-4B3
Ceramic Filled
3.0-5 x 10^81308.00
Ventec VT-4B4
Ceramic Filled
4.2-2 x 10^71208.00
Ventec VT-4B7
Ceramic Filled
7.0-2 x 10^71008.00

* Examples for 100µm dielectric
Material for metal core boards
2 Layers (plated-through)
Thermal
conductivity
Thermal
resistance
Surface
Resistivity
Dielectric glass
transition (Tg)
Dielectric
Breakdown (AC)*
Tracking
resistance CTI
 W/mKK/W°CkVPLC
Ventec VT-4A22.2-2 x 10^71307.50
Ventec VT-4B3
Ceramic Filled
3.0-5 x 10^81308.00

* @1,9GHz
Material for high frequency boardsOrder Shareεr, Dk-
Permittivity
Dk Loss TangentTgTd ValueThermal
Conductivity
CTE-z (T<TG)Electric
Strength
Surface
Resistivity
Peel
Strength
 @10GHz@10GHz°C°CW/m*Kppm/°CKV/mmN/mm
Rogers 4350B
HF Material
+++3,50,0037280°390°0,6932315,7 x 10^90,9
Rogers 4003C
PTFE HF Material
++3,40,0027280°425°0,7146314,2 x 10^91,1
Panasonic Megtron6
HF Material
+3,60,004185°410°-45-1 x 10^80,8
Rogers RO3003
PTFE ceramic-filled
+3,00,0013-500°0,5025-1 x 10^72,2
Rogers RO3006
PTFE ceramic-filled
o6,20,002-500°0,7924-1 x 10^51,2
Rogers RO3010
PTFE ceramic-filled
o100,0022-500°0,9516-1 x 10^51,6
Taconic RF-35
Ceramic
o3,5**0,0018*315°-0,2464-1,5 x 10^81,8
Taconic TLX
PTFE
o2,50,0019--0,19135-1 x 10^72,1
Rogers RO3001
Bonding Film for PTFE
-2,30,003160°-0,22-981 x 10^92,1
Taconic TLC
PTFE
-3,2---0,2470-1 x 10^72,1

High Tg circuit boards (high temperature resistance)

* at 1MHz
Material for High-Tg boardsTgCTE-z (T<Tg)εr, Dk-
Permittivity
Electric
Strenght
Surface
Resistivity
Tracking
Resistance CTI
Thermal
Conductivity
Td valuePeel
Strength
°Cppm/°C@1GHzKV/mmMOPLCW/m*K°CN/mm
ISOLA IS410
FR4 HTg, CAF-Enhanced
180°554,0448,0 x 10^630,5350°1,2
ISOLA IS420
FR4 HTg, CAF-Enhanced
170°454,0543,0 x 10^630,4350°1,3
ITEQ IT-180A
FR4 HTg
175°454,4453,0 x 10^10--345°1,4
Shengyi S1000-2
FR4 HTg
180°454,8*637,9 x 10^73-345°1,4
ARLON 85N
Polyimid HTg
250°554,20*571,6 x 10^9-0,2387°1,2

* Copper thickness after electroplating
Copper thickness
Outer* and Inner layers
Standard
Min. conductor trace width | -space | annular ring
Special production
Min. conductor trace width | -space | annular ring
18µm100µm | 100µm | 100µm75µm | 75µm | 75µm
35µm100µm | 100µm | 100µm90µm | 90µm | 100µm
70µm150µm | 150µm | 150µm150µm | 150µm | 130µm
105µm225µm | 225µm | 225µm200µm | 200µm | 170µm
140µm300µm | 300µm | 300µm250µm | 250µm | 200µm
175µm400µm | 400µm | 400µm280µm | 280µm | 240µm
210µm450µm | 450µm | 450µm300µm | 300µm | 280µm
245µm475µm | 475µm | 475µm350µm | 350µm | 320µm
280µm500µm | 500µm | 500µm380µm | 380µm | 350µm
315µm525µm | 525µm | 525µm380µm | 380µm | 350µm
350µm550µm | 550µm | 550µm380µm | 380µm | 350µm
385µm575µm | 575µm | 575µm380µm | 380µm | 350µm
400µm600µm | 600µm | 600µm380µm | 380µm | 350µm
455µm700µm | 700µm | 700µm380µm | 380µm | 350µm
490µm700µm | 700µm | 700µm380µm | 380µm | 350µm
525µm700µm | 700µm | 700µm380µm | 380µm | 350µm
560µm800µm | 800µm | 800µm380µm | 380µm | 350µm