The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.
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Here you can find: All information about our printed circuit board quality control.
High-tech options
- Circuit boards up to 48 layers
- Finest line starting from 75µm
- Film-free laser direct imaging (LDI)
- Micro vias starting at 75µm
- Blind and buried vias
- Laser vias
- Via tenting, plugging, filling
- Plated half-holes
- Thin laminates starting at 50µm core
- Custom layer buildup
- Sandwich buildup
- Plated slots
- Thick copper up to 450µm
- Circuit board thicknesses up to 7mm
- Depth milling (Z axis) and Backdrill
- Impedance control
- Solder-stop: special colours and coatings
- Peelable solder-stop
- ...
Special board types
The following special circuit board types are available from Multi-CB:
- Flexible circuit boards (also plated-through)
- Rigid-Flex circuit boards
- High frequency circuit boards
- High Tg circuit boards (high temperature resistance)
- Metal core circuit boards (also plated-through)
- Thick copper circuit boards
Special production
Options | Inclusive | Notes | |
---|---|---|---|
Design | 1 to 10 layers, plated-through | - | Layer buildup |
Conductor width min. | 100µm | 100µm | |
Annular ring min. | 100µm | 100µm | |
Via min. Ø | 0.15mm | 0.2mm | |
Surfaces | Chemical gold (recommended), ENEPIG, chem silver | Chemical gold | Surfaces |
Materials | Polyimide, high Tg polyimide | Polyimide | Materials |
Material thickness | starting at 25µm foil plus copper | 25µm, 50µm | |
Copper thickness | from 18µm | 18µm, 35µm | |
Stiffener | 0.025µm - 3.20mm | 0.2mm, 0.3mm | |
Max. size | 250mm x 450mm | - | larger on request |
Cover | Coverlay or flexible solder-stop | - | |
Cover bridge min. | Coverlay: ≥ 350µm Flex. solder-stop: ≥ 100µm | - | Design-Aid |
Impedance control | Yes (10% tolerance) | - | |
Adhesive tape | 3M 9077 | - | Materials |
Materials for flexible circuit boards
Material for flexible PCBs | Recommended max. operating temperature | Copper type | Tg | εr, Dk- Permittivity | CTE-z (T<Tg) | Electric Strenght | Surface Resistivity | Peel strength |
---|---|---|---|---|---|---|---|---|
°C | * | °C | @1MHz | ppm/°C | KV/mm | MΩ | N/mm | |
Polyimide + Adhesive | ||||||||
Shengyi SF305 | 105° | RA | - | 3,6 | - | 21 | 1 x 10^5 | 1,1 |
Polyimide Adhesiveless | ||||||||
DuPont Pyralux AP | 180° | RA | 220 | 3,4 | 25 | 256 | 1 x 10^10 | 1,8 |
Panasonic RF775 | 130° | ED | 343 | 3,2 | - | 276 | 1 x 10^8 | 1,7 |
Thinflex W-05050 | 105° | ED | 350 | 3,3 | 24 | 216 | 1 x 10^5 | 0,6 |
PI Coverlay | ||||||||
Shengyi SF305C | 105° | - | - | - | - | - | 3 x 10^6 | - |
DuPont Pyralux FR | 180° | - | - | 3,5 | - | 138 | 1 x 10^7 | - |
Adhesive tape | ||||||||
3M 9077 | 150° | - | - | - | - | - | - | - |
Options | Notes | |
---|---|---|
Layers | 2 to 24 layers, incl. "flying tails" | Layer buildup |
Conductor width min. | 75µm | |
Annular ring min. | 125µm | |
Via min. Ø | 0.1mm | |
Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Surfaces |
Materials | Polyimide, high Tg polyimide, FR4, FR4 high Tg | Materials |
Material thickness | Polyimide starting at 62µm doublesided, FR4 starting at 100µm | |
Max. size | 250mm x 450mm | larger on request |
Solder-stop | Coverlay or flexible solder-stop |
Options | Inklusive | Notes | |
---|---|---|---|
Material | Aluminium core | - | Datasheets |
Max. size | 420mm x 570mm | - | |
Design | 1 layer, 2 layers plated-through | ||
Aluminium thickness | 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm | 1.5mm | |
Copper | 35µm, 70µm, 105µm, 140µm | 35µm | |
Insulation thickness | 75µm, 100µm, 125µm, 150µm | 100µm | |
Thermal conductivity | 2.0W/mK - 7.0W/mK | 2.0W/mK | |
Conductor width min. | 150µm | 150µm | |
Annular ring min. | 125µm | 150µm | |
Drill (NPTH) min. Ø | 0.5mm | 0.9mm | Design-Aid |
Via min. Ø | 0.2mm | 0.2mm | |
Surface | HAL lead-free, chemical gold | HAL lead-free | Surfaces |
Solder-stop | white, black, green, red, blue | white, black | |
Legend print | black, white | - | |
Milling | yes | yes | |
V-Scoring | yes | yes | clean & simple |
Z-Axis milling | yes | - | |
RoHS compliant | yes | yes | |
UL-certified | yes | yes | UL certificate |
Material for metal core boards 1 Layer | Thermal conductivity | Thermal resistance | Surface Resistivity | Dielectric glass transition (Tg) | Dielectric Breakdown (AC)* | Tracking resistance CTI |
---|---|---|---|---|---|---|
W/mK | K/W | MΩ | °C | kV | PLC | |
TC-Lam 2.0 | 2.0 | 0.50 | 10^7 | 100 | 5.0 | 0 |
HA50 (3) | 2.2 | 0.41 | 10^6 | 120 | 4.3 | 0 |
AL-200 | 2.0 | 0.35 | 10^8 | - | 3.5 | 0 |
AL-300 | 3.0 | 0.30 | 10^8 | - | 3.5 | 0 |
Ventec VT-4B3 Ceramic Filled | 3.0 | - | 5 x 10^8 | 130 | 8.0 | 0 |
Ventec VT-4B4 Ceramic Filled | 4.2 | - | 2 x 10^7 | 120 | 8.0 | 0 |
Ventec VT-4B7 Ceramic Filled | 7.0 | - | 2 x 10^7 | 100 | 8.0 | 0 |
Material for metal core boards 2 Layers (plated-through) | Thermal conductivity | Thermal resistance | Surface Resistivity | Dielectric glass transition (Tg) | Dielectric Breakdown (AC)* | Tracking resistance CTI |
---|---|---|---|---|---|---|
W/mK | K/W | MΩ | °C | kV | PLC | |
Ventec VT-4A2 | 2.2 | - | 2 x 10^7 | 130 | 7.5 | 0 |
Ventec VT-4B3 Ceramic Filled | 3.0 | - | 5 x 10^8 | 130 | 8.0 | 0 |
Material for high frequency boards | Order Share | εr, Dk- Permittivity | Dk Loss Tangent | Tg | Td Value | Thermal Conductivity | CTE-z (T<TG) | Electric Strength | Surface Resistivity | Peel Strength |
---|---|---|---|---|---|---|---|---|---|---|
@10GHz | @10GHz | °C | °C | W/m*K | ppm/°C | KV/mm | MΩ | N/mm | ||
Rogers 4350B HF Material | +++ | 3,5 | 0,0037 | 280° | 390° | 0,69 | 32 | 31 | 5,7 x 10^9 | 0,9 |
Rogers 4003C PTFE HF Material | ++ | 3,4 | 0,0027 | 280° | 425° | 0,71 | 46 | 31 | 4,2 x 10^9 | 1,1 |
Panasonic Megtron6 HF Material | + | 3,6 | 0,004 | 185° | 410° | - | 45 | - | 1 x 10^8 | 0,8 |
Rogers RO3003 PTFE ceramic-filled | + | 3,0 | 0,0013 | - | 500° | 0,50 | 25 | - | 1 x 10^7 | 2,2 |
Rogers RO3006 PTFE ceramic-filled | o | 6,2 | 0,002 | - | 500° | 0,79 | 24 | - | 1 x 10^5 | 1,2 |
Rogers RO3010 PTFE ceramic-filled | o | 10 | 0,0022 | - | 500° | 0,95 | 16 | - | 1 x 10^5 | 1,6 |
Taconic RF-35 Ceramic | o | 3,5** | 0,0018* | 315° | - | 0,24 | 64 | - | 1,5 x 10^8 | 1,8 |
Taconic TLX PTFE | o | 2,5 | 0,0019 | - | - | 0,19 | 135 | - | 1 x 10^7 | 2,1 |
Rogers RO3001 Bonding Film for PTFE | - | 2,3 | 0,003 | 160° | - | 0,22 | - | 98 | 1 x 10^9 | 2,1 |
Taconic TLC PTFE | - | 3,2 | - | - | - | 0,24 | 70 | - | 1 x 10^7 | 2,1 |
High Tg circuit boards (high temperature resistance)
Material for High-Tg boards | Tg | CTE-z (T<Tg) | εr, Dk- Permittivity | Electric Strenght | Surface Resistivity | Tracking Resistance CTI | Thermal Conductivity | Td value | Peel Strength |
---|---|---|---|---|---|---|---|---|---|
°C | ppm/°C | @1GHz | KV/mm | MO | PLC | W/m*K | °C | N/mm | |
ISOLA IS410 FR4 HTg, CAF-Enhanced | 180° | 55 | 4,0 | 44 | 8,0 x 10^6 | 3 | 0,5 | 350° | 1,2 |
ISOLA IS420 FR4 HTg, CAF-Enhanced | 170° | 45 | 4,0 | 54 | 3,0 x 10^6 | 3 | 0,4 | 350° | 1,3 |
ITEQ IT-180A FR4 HTg | 175° | 45 | 4,4 | 45 | 3,0 x 10^10 | - | - | 345° | 1,4 |
Shengyi S1000-2 FR4 HTg | 180° | 45 | 4,8* | 63 | 7,9 x 10^7 | 3 | - | 345° | 1,4 |
ARLON 85N Polyimid HTg | 250° | 55 | 4,20* | 57 | 1,6 x 10^9 | - | 0,2 | 387° | 1,2 |
Copper thickness Outer* and Inner layers | Standard Min. conductor trace width | -space | annular ring | Special production Min. conductor trace width | -space | annular ring |
18µm | 100µm | 100µm | 100µm | 75µm | 75µm | 75µm |
35µm | 100µm | 100µm | 100µm | 90µm | 90µm | 100µm |
70µm | 150µm | 150µm | 150µm | 150µm | 150µm | 130µm |
105µm | 225µm | 225µm | 225µm | 200µm | 200µm | 170µm |
140µm | 300µm | 300µm | 300µm | 250µm | 250µm | 200µm |
175µm | 400µm | 400µm | 400µm | 280µm | 280µm | 240µm |
210µm | 450µm | 450µm | 450µm | 300µm | 300µm | 280µm |
245µm | 475µm | 475µm | 475µm | 350µm | 350µm | 320µm |
280µm | 500µm | 500µm | 500µm | 380µm | 380µm | 350µm |
315µm | 525µm | 525µm | 525µm | 380µm | 380µm | 350µm |
350µm | 550µm | 550µm | 550µm | 380µm | 380µm | 350µm |
385µm | 575µm | 575µm | 575µm | 380µm | 380µm | 350µm |
400µm | 600µm | 600µm | 600µm | 380µm | 380µm | 350µm |
455µm | 700µm | 700µm | 700µm | 380µm | 380µm | 350µm |
490µm | 700µm | 700µm | 700µm | 380µm | 380µm | 350µm |
525µm | 700µm | 700µm | 700µm | 380µm | 380µm | 350µm |
560µm | 800µm | 800µm | 800µm | 380µm | 380µm | 350µm |