Special production circuit boards

PCB special production

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

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High-tech options

  • Sandwich buildup
  • Plated slots
  • Thick copper up to 450µm
  • Circuit board thicknesses up to 7mm
  • Depth milling (Z axis) and backdrill
  • Impedance control
  • Solder-stop: special colours and coatings
  • Aluminium core, with plated contacts
  • Peelable solder-stop
  • ...

Special board types

The following special circuit board types are available from Multi-CB:


Technical options for flexible circuit boards

Flexible circuit boards

Options Notes
OptionsDesign 1 to 10 layers, plated-throughNotesLayer buildup
OptionsConductor width min. 100µm Notes 
OptionsAnnular ring min. 100µm Notes 
OptionsVia min. Ø 150µm Notes 
OptionsSurfaces Chemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
OptionsMaterials Polyimide, high Tg polyimideNotesMaterials
OptionsMaterial thickness starting at 25µm foil plus copperNotes 
OptionsCopper thickness from 18µmNotes 
OptionsStiffener 0,025µm - 3,20mmNotes 
OptionsMax. size 250mm x 450mmNoteslarger on request
OptionsCover Coverlay or flexible solder-stopNotes 
OptionsCover bridge Coverlay: ≥ 200µmNotes 
Options  Flex. solder-stop: ≥ 100µmNotes 
OptionsImpedance control Yes (10% tolerance)Notes 
OptionsAdhesive tape 3M 9077NotesMaterials

Technical options for Rigid-Flex circuit boards

Rigid-Flex circuit boards

Options Notes
OptionsLayers 2 to 24 layers, incl. "flying tails"NotesLayer buildup
OptionsConductor width min. 75µm Notes 
OptionsAnnular ring min. 125µm Notes 
OptionsVia min. Ø 100µm Notes 
OptionsSurfaces Chemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
OptionsMaterials Polyimide, high Tg polyimide, FR4, FR4 high TgNotesMaterials
OptionsMaterial thickness Polyimide starting at 62µm doublesided, FR4 starting at 100µm Notes 
OptionsMax. size 250mm x 450mm Noteslarger on request
OptionsSolder-stop Coverlay or flexible solder-stop Notes 

Technical options for metal core circuit boards

Metal core circuit boards

1 layer

Options Notes
OptionsMaterial Aluminium coreNotes Data sheets
OptionsMax. size 420mm x 570mmNotes 
OptionsAluminium thickness 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mmNotesStandard: 1.5mm
OptionsCopper 35µm, 70µm, 105µm only2.0mm)NotesStandard: 35µm
OptionsInsulation thickness 75µm, 100µm, 125µm, 150µmNotesStandard: 100µm
OptionsThermal conductivity 1.0W/mK - 8.0W/mKNotesStandard: 2.0W/mK
OptionsSurface HAL lead-free, chemical goldNotesSurfaces
OptionsSolder-stop white, black, green, red, blueNotesStandard: white
OptionsLegend print black, whiteNotes 
OptionsMilling yesNotes 
OptionsV-Scoring yesNotesclean & simple
OptionsZ-Axis milling yesNotes 
OptionsRoHS compliant yesNotes 
OptionsUL-certified yesNotes 

Material

Material for metal core boards 1 LayerIMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 1 Layer IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 1 LayerTC-Lam 2.0IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.50PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*5.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerHA50 (3)IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.41PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*4.3PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-200IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.35PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-300IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance0.30PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentek VT-4B1
flexible
IMS Thermal conductivityThermal conductivity1.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentek VT-4B3
limited flexible
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*9.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material

2 layers (plated-through)

Options Notes
OptionsMaterial Aluminium core, FR4 prepregNotesData sheets
OptionsMax. size 800mm x 800mmNotes 
OptionsAluminium thickness 0.8mm, 1.0mm, 1.5mmNotesin stock
Options  1.2mm, 2.0mmNotesOn request
OptionsBasis copper 18µm, 35µm, 70µmNotes 
OptionsSurface HAL lead-free, Chemical gold, immersion tinNotesSurfaces
OptionsRoHS compliant yesNotes 

Material

Material for metal core boards 2 Layers (plated-through)IMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 2 Layers (plated-through) IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 2 Layers (plated-through)CCAF-05IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.45PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*6.0PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventek VT-4A2IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventek VT-4B1
flexible
IMS Thermal conductivityThermal conductivity1.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventek VT-4B3
limited flexible
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*9.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material


Technical options for High Freqency circuit boards

High Freqency circuit boards

Material for high frequency boardsLeiterplatte TgTgPCB CTE-zCTE-zPCB dielectric constantԐrPCB electric strenghtElectric strenghtPCB surface resistivitySurface resistivityIMS Thermal conductivityThermal conductivityPCB Dk Loss TangentDk Loss TangentPCB Td valueTd valuePCB peel strength KupferhaftungPeel strength
Material for high frequency boards Leiterplatte TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantԐr@10GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityIMS Thermal conductivityThermal conductivityW/m*KPCB Dk Loss TangentDk Loss Tangent@10GHzPCB Td valueTd value°CPCB peel strength KupferhaftungPeel strengthN/mm
Material for high frequency boardsRogers 4350B
HF material
Leiterplatte TgTg280°PCB CTE-zCTE-z32PCB dielectric constantԐr3,48PCB electric strenghtElectric strenght31PCB surface resistivitySurface resistivity5,7 x 10^9IMS Thermal conductivityThermal conductivity0,69PCB Dk Loss TangentDk Loss Tangent0,0037PCB Td valueTd value390°PCB peel strength KupferhaftungPeel strength0,9
Material for high frequency boardsISOLA IS620
E-fibre glas
Leiterplatte TgTg220°PCB CTE-zCTE-z55PCB dielectric constantԐr4,45*PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity2,8 x 10^6IMS Thermal conductivityThermal conductivity-PCB Dk Loss TangentDk Loss Tangent0,0080*PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsTaconic RF-35
Ceramic
Leiterplatte TgTg315°PCB CTE-zCTE-z64PCB dielectric constantԐr3,50**PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1,5 x 10^8IMS Thermal conductivityThermal conductivity0,24PCB Dk Loss TangentDk Loss Tangent0,0018**PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,8
Material for high frequency boardsTaconic TLX
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z135PCB dielectric constantԐr2,50PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,19PCB Dk Loss TangentDk Loss Tangent0,0019PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsTaconic TLC
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z70PCB dielectric constantԐr3,20PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,24PCB Dk Loss TangentDk Loss Tangent-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3001
Bonding Film for PTFE
Leiterplatte TgTg160°PCB CTE-zCTE-z-PCB dielectric constantԐr2,28PCB electric strenghtElectric strenght98PCB surface resistivitySurface resistivity1 x 10^9IMS Thermal conductivityThermal conductivity0,22PCB Dk Loss TangentDk Loss Tangent0,0030PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3003
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z25PCB dielectric constantԐr3,00PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,50PCB Dk Loss TangentDk Loss Tangent0,0013PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength2,2
Material for high frequency boardsRogers RO3006
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z24PCB dielectric constantԐr6,15PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5IMS Thermal conductivityThermal conductivity0,79PCB Dk Loss TangentDk Loss Tangent0,0020PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsRogers RO3010
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z16PCB dielectric constantԐr10,20PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5IMS Thermal conductivityThermal conductivity0,95PCB Dk Loss TangentDk Loss Tangent0,0022PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength1,6
Material for high frequency boardsARLON 85N
Polyimide HTg
Leiterplatte TgTg250°PCB CTE-zCTE-z55PCB dielectric constantԐr4,20*PCB electric strenghtElectric strenght57PCB surface resistivitySurface resistivity1,6 x 10^9IMS Thermal conductivityThermal conductivity0,20PCB Dk Loss TangentDk Loss Tangent0,0100*PCB Td valueTd value387°PCB peel strength KupferhaftungPeel strength1,2

Technical options for High-Tg circuit boards

High-Tg circuit boards

Material for High-Tg boardsPCB TgTgPCB CTE-zCTE-zPCB dielectric constantԐrPCB electric strenghtElectric strenghtPCB surface resistivitySurface resistivityPCB tracing resistanceCTIIMS Thermal conductivityThermal conductivityPCB Td valueTd valuePCB peel strengthPeel strength
Material for High-Tg boards PCB TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantԐr@1GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityPCB tracing resistanceCTIPLCIMS Thermal conductivityThermal conductivityW/m*KPCB Td valueTd value°CPCB peel strengthPeel strengthN/mm
Material for High-Tg boardsISOLA IS410
HTg, CAF-Enhanced
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constantԐr3,97PCB electric strenghtElectric strenght44PCB surface resistivitySurface resistivity8,0 x 10^6PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity0,50PCB Td valueTd value315°PCB peel strengthPeel strength1,6
Material for High-Tg boardsISOLA IS420
HTg, CAF-Enhanced
PCB TgTg170°PCB CTE-zCTE-z45PCB dielectric constantԐr4,04PCB electric strenghtElectric strenght54PCB surface resistivitySurface resistivity3,0 x 10^6PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity0,40PCB Td valueTd value350°PCB peel strengthPeel strength1,3
Material for High-Tg boardsShengyi S1000-2
FR4 HTg alternative
PCB TgTg180°PCB CTE-zCTE-z45PCB dielectric constantԐr4,80*PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity7,9 x 10^7PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity-PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsITEQ IT-180A
FR4 HTg alternative
PCB TgTg175°PCB CTE-zCTE-z45PCB dielectric constantԐr4,40PCB electric strenghtElectric strenght45PCB surface resistivitySurface resistivity3,0 x 10^10PCB tracing resistanceCTI-IMS Thermal conductivityThermal conductivity-PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsARLON 85N
Polyimide HTg
PCB TgTg250°PCB CTE-zCTE-z55PCB dielectric constantԐr4,20*PCB electric strenghtElectric strenght57PCB surface resistivitySurface resistivity1,6 x 10^9PCB tracing resistanceCTI-IMS Thermal conductivityThermal conductivity0,20PCB Td valueTd value387°PCB peel strengthPeel strength1,2

* at 1MHz

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board


Technical options for thick copper circuit boards

Thick copper circuit boards

Outer layers

Final thickness*Min. conductor widthMin. conductor spacing
Final thickness*105µmMin. conductor width250µmMin. conductor spacing250µm
Final thickness*140µmMin. conductor width350µmMin. conductor spacing350µm
Final thickness*210µmMin. conductor width500µmMin. conductor spacing500µm
Final thickness*400µm**Min. conductor width900µmMin. conductor spacing900µm

Inner layers

Copper foil thickness Min. conductor widthMin. conductor spacing
Copper foil thickness 105µmMin. conductor width250µmMin. conductor spacing250µm
Copper foil thickness 140µm Min. conductor width300µmMin. conductor spacing300µm
Copper foil thickness 210µm Min. conductor width500µmMin. conductor spacing500µm
Copper foil thickness 400µm** Min. conductor width900µmMin. conductor spacing900µm

* after electroplating
** only on request