Special production circuit boards

PCB special production

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

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High-tech options

Special board types

The following special circuit board types are available from Multi-CB:
Flexible circuit boards
Rigid-Flex circuit boards
High frequency circuit boards
High Tg circuit boards (high temperature resistance)
Metal core circuit boards (with plated contacts)
Thick copper circuit boards


Technical options for flexible circuit boards

Flexible circuit boards

Options   Notes
OptionsDesign 1 to 10 layers, plated-throughNotesLayer buildup
OptionsConductor width min. 100µm Notes 
OptionsAnnular ring min. 100µm Notes 
OptionsVia min. Ø 150µm Notes 
OptionsSurfaces Chemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
OptionsMaterials Polyimide, high Tg polyimideNotesMaterials
OptionsMaterial thickness starting at 25µm foil plus copperNotes 
OptionsCopper thickness from 18µmNotes 
OptionsStiffener 0,075mm - 3,20mmNotes 
OptionsMax. size 250mm x 450mmNoteslarger on request
OptionsSolder-stop Coverlay or flexible solder-stopNotes 
OptionsSolder-stop bridge Coverlay: ≥ 200µmNotes 
Options  Flex. solder-stop: ≥ 100µmNotes 
OptionsImpedance control Yes (10% tolerance)Notes 

Technical options for Rigid-Flex circuit boards

Rigid-Flex circuit boards

Options   Notes
OptionsLayers 2 to 24 layers, incl. "flying tails"NotesLayer buildup
OptionsConductor width min. 75µm Notes 
OptionsAnnular ring min. 125µm Notes 
OptionsVia min. Ø 100µm Notes 
OptionsSurfaces Chemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
OptionsMaterials Polyimide, high Tg polyimide, FR4, FR4 high TgNotesMaterials
OptionsMaterial thickness Polyimide starting at 62µm doublesided, FR4 starting at 100µm Notes 
OptionsMax. size 250mm x 450mm Noteslarger on request
OptionsSolder-stop Coverlay or flexible solder-stop Notes 

Technical options for metal core circuit boards

Metal core circuit boards

1 layer

Options   Notes
OptionsMaterial Aluminium core, FR4 prepregNotes Data sheets
OptionsMax. size 230mm x 380mm Notes 
OptionsAluminium thickness 1.5mm, 2.0mm Notes 
OptionsInitial copper 35µm (for 1.5mm), 140µm (for 2.0mm) Notes 
OptionsSurface HAL lead-free, chemical gold, immersion tin NotesSurfaces
OptionsRoHS compliant yes Notes 

Material

Technical properties Unit KL HA50 (type2) TC-Lam 1.3 KL (type3) Test method
Technical propertiesData sheetUnit-KL HA50 (type2)KL HA50TC-Lam 1.3TC-Lam 1.3KL (type3)KL HA50Test method-
Technical propertiesArea of applicationUnit-KL HA50 (type2)StandardTC-Lam 1.3StandardKL (type3)ExtendedTest method-
Technical propertiesThermal conductivity factorUnitW / m*kKL HA50 (type2)1.6TC-Lam 1.31.3KL (type3)2.2Test methodASTM-D 5470
Technical propertiesDielectric constant εrUnit(bei 1 MHz)KL HA50 (type2)5.3TC-Lam 1.3-KL (type3)5.5Test methodIEC-61189
Technical propertiesSurface resistanceUnitKL HA50 (type2)1.0 * 10^6TC-Lam 1.31.0 * 10^7KL (type3)1.0 * 10^6Test methodIEC-61189
Technical propertiesThermal durabilityUnitK / WKL HA50 (type2)-TC-Lam 1.30.77KL (type3)-Test methodASTM-E 1225
Technical propertiesGlass transition dielectric (Tg)Unit°CKL HA50 (type2)122TC-Lam 1.3100KL (type3)122Test methodIPC-TM150
Technical propertiesDielectric breakdown (AC)*UnitkVKL HA50 (type2)4.0 - 6.0TC-Lam 1.35.0KL (type3)4.0 - 6.0Test methodIPC-TM-650
Technical propertiesCTIUnitVKL HA50 (type2)600TC-Lam 1.3600KL (type3)600Test methodUL746A

* Depending on dielectric thickness, in this example 100µm.

2 layers (plated-through)

Options   Notes
OptionsMaterial Aluminium core, FR4 prepregNotesData sheets
OptionsMax. size 800mm x 800mmNotes 
OptionsAluminium thickness 0.8mm, 1.0mm, 1.5mmNotesin stock
Options  1.2mm, 2.0mmNotesOn request
OptionsBasis copper 18µm, 35µm, 70µmNotes 
OptionsSurface HAL lead-free, Chemical gold, immersion tinNotesSurfaces
OptionsRoHS compliant yesNotes 

Material

Technical properties Unit CCAF-04 CCAF-05 Test method
Technical propertiesData sheetUnit-CCAF-04CCAF-04CCAF-05CCAF-05Test method-
Technical propertiesArea of applicationUnit-CCAF-04StandardCCAF-05ExtendedTest method-
Technical propertiesThermal conductivity factorUnitW / m*kCCAF-041.5CCAF-052.2Test methodASTM-D 5470
Technical propertiesDielectric constant εrUnit(bei 1 MHz)CCAF-044.2CCAF-054.24Test methodIEC-61189
Technical propertiesSurface resistanceUnitCCAF-045.0 * 10^7CCAF-053.68 * 10^7Test methodIEC-61189
Technical propertiesThermal durabilityUnitK / WCCAF-040.65CCAF-050.45Test methodASTM-E 1225
Technical propertiesGlass transition dielectric (Tg)Unit°CCCAF-04-CCAF-05-Test methodIPC-TM150
Technical propertiesDielectric breakdown (AC)*UnitkVCCAF-044.0CCAF-056.0Test methodIPC-TM-650
Technical propertiesCTIUnitVCCAF-04600CCAF-05600Test methodUL746A

* Depending on dielectric thickness, in this example 100µm.


Technical options for High Freqency circuit boards

High Freqency circuit boards

Material for high frequency boards Leiterplatte TgTg PCB CTE-zCTE-z PCB dielectric constantεr PCB electric strenghtElectric strenght PCB surface resistivitySurface resistivity PCB thermal conductive factorThermal conductive factor PCB Td260Td260 PCB Td288Td288 PCB Td valueTd value PCB peel strength KupferhaftungPeel strength
Material for high frequency boards Leiterplatte TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantεr PCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityMOPCB thermal conductive factorThermal conductive factorW/m*KPCB Td260Td260minPCB Td288Td288minPCB Td valueTd value°CPCB peel strength KupferhaftungPeel strengthN/mm
Material for high frequency boardsRogers 4350B
HF material
Leiterplatte TgTg280°PCB CTE-zCTE-z50PCB dielectric constantεr3,5@10GHzPCB electric strenghtElectric strenght31PCB surface resistivitySurface resistivity5,7 x 10^9PCB thermal conductive factorThermal conductive factor0,69PCB Td260Td260-PCB Td288Td288390°PCB Td valueTd value0,9PCB peel strength KupferhaftungPeel strength 
Material for high frequency boardsISOLA IS620
E-fibre glas
Leiterplatte TgTg220°PCB CTE-zCTE-z55PCB dielectric constantεr4,5@1MHzPCB electric strenghtElectric strenght37PCB surface resistivitySurface resistivity7,3 x 10^6PCB thermal conductive factorThermal conductive factor-PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsTaconic RF-35
Ceramic
Leiterplatte TgTg315°PCB CTE-zCTE-z64PCB dielectric constantεr3,5@1,9GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1,46 x 10^8PCB thermal conductive factorThermal conductive factor0,24PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,8
Material for high frequency boardsTaconic TLX
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z135PCB dielectric constantεr2,5@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7PCB thermal conductive factorThermal conductive factor0,19PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsTaconic TLC
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z70PCB dielectric constantεr3,2@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7PCB thermal conductive factorThermal conductive factor0,24PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3001
Bonding Film for PTFE
Leiterplatte TgTg160PCB CTE-zCTE-z-PCB dielectric constantεr2,28PCB electric strenghtElectric strenght98PCB surface resistivitySurface resistivity1 x 10^9PCB thermal conductive factorThermal conductive factor0,22PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3003
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z25PCB dielectric constantεr3,0@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7PCB thermal conductive factorThermal conductive factor0,50PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value500PCB peel strength KupferhaftungPeel strength2,2
Material for high frequency boardsRogers RO3006
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z24PCB dielectric constantεr6,2@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5PCB thermal conductive factorThermal conductive factor0,79PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value500PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsRogers RO3010
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z16PCB dielectric constantεr10@10GHzPCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5PCB thermal conductive factorThermal conductive factor0,95PCB Td260Td260-PCB Td288Td288-PCB Td valueTd value500PCB peel strength KupferhaftungPeel strength1,6

Technical options for High-Tg circuit boards

High-Tg circuit boards

Material for High-Tg boards PCB TgTg PCB CTE-zCTE-z PCB dielectric constantεr PCB electric strenghtElectric strenght PCB surface resistivitySurface resistivity PCB tracing resistanceCTI PCB Td260Td260 PCB Td288Td288 PCB Td valueTd value PCB peel strengthPeel strength
Material for High-Tg boards PCB TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantεr@1GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityPCB tracing resistanceCTIVPCB Td260Td260minPCB Td288Td288minPCB Td valueTd value°CPCB peel strengthPeel strengthN/mm
Material for High-Tg boardsISOLA IS410
High-Tg, CAF-Enhanced
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constantεr3,90PCB electric strenghtElectric strenght50PCB surface resistivitySurface resistivity8,0 x 10^6PCB tracing resistanceCTIPLC 3PCB Td260Td26050PCB Td288Td28810PCB Td valueTd value350°PCB peel strengthPeel strength1,2
Material for High-Tg boardsISOLA IS420
High-Tg, CAF-Enhanced
PCB TgTg170°PCB CTE-zCTE-z45PCB dielectric constantεr4,17PCB electric strenghtElectric strenght40PCB surface resistivitySurface resistivity3,0 x 10^6PCB tracing resistanceCTIPLC 3PCB Td260Td26060PCB Td288Td28815PCB Td valueTd value350°PCB peel strengthPeel strength1,3
Material for High-Tg boardsISOLA G200
BT-Epoxy
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constantεr3,70PCB electric strenghtElectric strenght45PCB surface resistivitySurface resistivity2,2 x 10^6PCB tracing resistanceCTIPLC 3PCB Td260Td26060PCB Td288Td28810PCB Td valueTd value325°PCB peel strengthPeel strength1,0
Material for High-Tg boardsShengyi S1000-2
FR4 High-Tg alternative
PCB TgTg180°PCB CTE-zCTE-z45PCB dielectric constantεr4,80*PCB electric strenghtElectric strenght63PCB surface resistivitySurface resistivity7,9 x 10^7PCB tracing resistanceCTIPLC 3PCB Td260Td26060PCB Td288Td28820PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsITEQ IT-180A
FR4 High-Tg alternative
PCB TgTg175°PCB CTE-zCTE-z45PCB dielectric constantεr4,40PCB electric strenghtElectric strenght30PCB surface resistivitySurface resistivity1 x 10^4PCB tracing resistanceCTI-PCB Td260Td26060PCB Td288Td28830PCB Td valueTd value345°PCB peel strengthPeel strength1,0

*CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board


Technical options for thick copper circuit boards

Thick copper circuit boards

Outer layers

Final thickness* Min. conductor width Min. conductor spacing
Final thickness*105µmMin. conductor width250µmMin. conductor spacing250µm
Final thickness*140µmMin. conductor width350µmMin. conductor spacing350µm
Final thickness*210µmMin. conductor width500µmMin. conductor spacing500µm
Final thickness*400µm**Min. conductor width900µmMin. conductor spacing900µm

Inner layers

Copper foil thickness Min. conductor width Min. conductor spacing
Copper foil thickness 105µmMin. conductor width250µmMin. conductor spacing250µm
Copper foil thickness 140µm Min. conductor width300µmMin. conductor spacing300µm
Copper foil thickness 210µm Min. conductor width500µmMin. conductor spacing500µm
Copper foil thickness 400µm** Min. conductor width900µmMin. conductor spacing900µm

* after electroplating
** only on request