Special production circuit boards

PCB special production

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

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High-tech options

  • Sandwich buildup
  • Plated slots
  • Thick copper up to 450µm
  • Circuit board thicknesses up to 7mm
  • Depth milling (Z axis) and backdrill
  • Impedance control
  • Solder-stop: special colours and coatings
  • Aluminium core, with plated contacts
  • Peelable solder-stop
  • ...

Special board types

The following special circuit board types are available from Multi-CB:

Technical options for flexible circuit boards

Flexible circuit boards

Options Notes
OptionsDesign 1 to 10 layers, plated-throughNotesLayer buildup
OptionsConductor width min. 100µm Notes 
OptionsAnnular ring min. 100µm Notes 
OptionsVia min. Ø 150µm Notes 
OptionsSurfaces Chemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
OptionsMaterials Polyimide, high Tg polyimideNotesMaterials
OptionsMaterial thickness starting at 25µm foil plus copperNotes 
OptionsCopper thickness from 18µmNotes 
OptionsStiffener 0,025µm - 3,20mmNotes 
OptionsMax. size 250mm x 450mmNoteslarger on request
OptionsCover Coverlay or flexible solder-stopNotes 
OptionsCover bridge Coverlay: ≥ 200µmNotes 
Options  Flex. solder-stop: ≥ 100µmNotes 
OptionsImpedance control Yes (10% tolerance)Notes 
OptionsAdhesive tape 3M 9077NotesMaterials

Technical options for Rigid-Flex circuit boards

Rigid-Flex circuit boards

Options Notes
OptionsLayers 2 to 24 layers, incl. "flying tails"NotesLayer buildup
OptionsConductor width min. 75µm Notes 
OptionsAnnular ring min. 125µm Notes 
OptionsVia min. Ø 100µm Notes 
OptionsSurfaces Chemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
OptionsMaterials Polyimide, high Tg polyimide, FR4, FR4 high TgNotesMaterials
OptionsMaterial thickness Polyimide starting at 62µm doublesided, FR4 starting at 100µm Notes 
OptionsMax. size 250mm x 450mm Noteslarger on request
OptionsSolder-stop Coverlay or flexible solder-stop Notes 

Technical options for metal core circuit boards

Metal core circuit boards

1 layer

Options Notes
OptionsMaterial Aluminium core, FR4 prepregNotes Data sheets
OptionsMax. size 230mm x 380mm Notes 
OptionsAluminium thickness 1.5mm, 2.0mm Notes 
OptionsInitial copper 35µm (for 1.5mm), 140µm (for 2.0mm) Notes 
OptionsSurface HAL lead-free, chemical gold, immersion tin NotesSurfaces
OptionsRoHS compliant yes Notes 


2 layers (plated-through)

Options Notes
OptionsMaterial Aluminium core, FR4 prepregNotesData sheets
OptionsMax. size 800mm x 800mmNotes 
OptionsAluminium thickness 0.8mm, 1.0mm, 1.5mmNotesin stock
Options  1.2mm, 2.0mmNotesOn request
OptionsBasis copper 18µm, 35µm, 70µmNotes 
OptionsSurface HAL lead-free, Chemical gold, immersion tinNotesSurfaces
OptionsRoHS compliant yesNotes 


Technical options for High Freqency circuit boards

High Freqency circuit boards

Technical options for High-Tg circuit boards

High-Tg circuit boards

Technical options for thick copper circuit boards

Thick copper circuit boards

Outer layers

Final thickness*Min. conductor widthMin. conductor spacing
Final thickness*105µmMin. conductor width250µmMin. conductor spacing250µm
Final thickness*140µmMin. conductor width350µmMin. conductor spacing350µm
Final thickness*210µmMin. conductor width500µmMin. conductor spacing500µm
Final thickness*400µm**Min. conductor width900µmMin. conductor spacing900µm

Inner layers

Copper foil thickness Min. conductor widthMin. conductor spacing
Copper foil thickness 105µmMin. conductor width250µmMin. conductor spacing250µm
Copper foil thickness 140µm Min. conductor width300µmMin. conductor spacing300µm
Copper foil thickness 210µm Min. conductor width500µmMin. conductor spacing500µm
Copper foil thickness 400µm** Min. conductor width900µmMin. conductor spacing900µm

* after electroplating
** only on request