Special production circuit boards

PCB special production

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

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Here you can find: All information about our printed circuit board quality control.

High-tech options

Circuit boards up to 48 layers
Finest line starting from 75µm
Film-free laser direct imaging (LDI)
Micro vias starting at 75µm
Blind and buried vias
Laser vias
Via tenting, plugging, filling
Plated half-holes
Thin laminates starting at 50µm core
Custom layer buildup

Sandwich buildup
Plated slots
Thick copper up to 450µm
Circuit board thicknesses up to 7mm
Depth milling (Z axis) and Backdrill
Impedance control
Solder-stop: special colours and coatings
Peelable solder-stop
...

Design Parameters

Find layout tips and all design parameters in our comprehensive Design-Aid.

Special board types

The following special circuit board types are available from Multi-CB:

Flexible circuit boards (also plated-through)
Rigid-Flex circuit boards
High frequency circuit boards

High Tg circuit boards (high temperature resistance)
Metal core circuit boards (also plated-through)
Thick copper circuit boards

Special production

Flexible circuit boards

Rigid-Flex circuit boards

	Options	Notes
Layers	2 to 24 layers, incl. "flying tails"	Layer buildup
Conductor width min.	75µm
Annular ring min.	125µm
Via min. Ø	0.1mm
Surfaces	Chemical gold (recommended), immersion tin, HAL lead-free	Surfaces
Materials	Polyimide, high Tg polyimide, FR4, FR4 high Tg	Materials
Material thickness	Polyimide starting at 62µm doublesided, FR4 starting at 100µm
Max. size	250mm x 450mm	larger on request
Solder-stop	Coverlay or flexible solder-stop

Metal core circuit boards

	Options	Inklusive	Notes
Material	Aluminium core	-	Datasheets
Max. size	420mm x 570mm	-
Design	1 layer, 2 layers plated-through
Aluminium thickness	0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm	1.5mm
Copper	35µm, 70µm, 105µm, 140µm	35µm
Insulation thickness	75µm, 100µm, 125µm, 150µm	100µm
Thermal conductivity	2.0W/mK - 7.0W/mK	2.0W/mK
Conductor width min.	150µm	150µm
Annular ring min.	125µm	150µm
Drill (NPTH) min. Ø	0.5mm	0.9mm	Design-Aid
Via min. Ø	0.2mm	0.2mm
Surface	HAL lead-free, chemical gold	HAL lead-free	Surfaces
Solder-stop	white, black, green, red, blue	white, black
Legend print	black, white	-
Milling	yes	yes
V-Scoring	yes	yes	clean & simple
Z-Axis milling	yes	-
RoHS compliant	yes	yes
UL-certified	yes	yes	UL certificate

1 layer

* Examples for 100μm dielectric or 80μm for CCAF material
Material for metal core boards 1 Layer	Thermal conductivity	Thermal resistance	Surface Resistivity	Dielectric glass transition (Tg)	Dielectric Breakdown (AC)*	Tracking resistance CTI
	W/mK	K/W	MΩ	°C	kV	PLC
TC-Lam 2.0	2.0	0.50	10^7	100	5.0	0
HA50 (3)	2.2	0.41	10^6	120	4.3	0
AL-200	2.0	0.35	10^8	-	3.5	0
AL-300	3.0	0.30	10^8	-	3.5	0
Ventec VT-4B3 Ceramic Filled	3.0	-	5 x 10^8	130	8.0	0
Ventec VT-4B4 Ceramic Filled	4.2	-	2 x 10^7	120	8.0	0
Ventec VT-4B7 Ceramic Filled	7.0	-	2 x 10^7	100	8.0	0

2 layers (plated-through)

* Examples for 100μm dielectric or 80μm for CCAF material
Material for metal core boards 2 Layers (plated-through)	Thermal conductivity	Thermal resistance	Surface Resistivity	Dielectric glass transition (Tg)	Dielectric Breakdown (AC)*	Tracking resistance CTI
	W/mK	K/W	MΩ	°C	kV	PLC
Ventec VT-4A2	2.2	-	2 x 10^7	130	7.5	0
Ventec VT-4B3 Ceramic Filled	3.0	-	5 x 10^8	130	8.0	0

High Freqency circuit boards

Material for high frequency boards	Order Share	εr, Dk- Permittivity	Dk Loss Tangent	Tg	Td Value	Thermal Conductivity	CTE-z (T<TG)	Electric Strength	Surface Resistivity	Peel Strength
		@10GHz	@10GHz	°C	°C	W/m*K	ppm/°C	KV/mm	MΩ	N/mm
Rogers 4350B HF Material	+++	3,5	0,0037	280°	390°	0,69	32	31	5,7 x 10^9	0,9
Rogers 4003C PTFE HF Material	++	3,4	0,0027	280°	425°	0,71	46	31	4,2 x 10^9	1,1
Panasonic Megtron6 HF Material	+	3,6	0,004	185°	410°	-	45	-	1 x 10^8	0,8
Rogers RO3003 PTFE ceramic-filled	+	3,0	0,0013	-	500°	0,50	25	-	1 x 10^7	2,2
Rogers RO3006 PTFE ceramic-filled	o	6,2	0,002	-	500°	0,79	24	-	1 x 10^5	1,2
Rogers RO3010 PTFE ceramic-filled	o	10	0,0022	-	500°	0,95	16	-	1 x 10^5	1,6
Taconic RF-35 Ceramic	o	3,5**	0,0018*	315°	-	0,24	64	-	1,5 x 10^8	1,8
Taconic TLX PTFE	o	2,5	0,0019	-	-	0,19	135	-	1 x 10^7	2,1
Rogers RO3001 Bonding Film for PTFE	-	2,3	0,003	160°	-	0,22	-	98	1 x 10^9	2,1
Taconic TLC PTFE	-	3,2	-	-	-	0,24	70	-	1 x 10^7	2,1

High-Tg circuit boards

* at 1MHz
Material for High-Tg boards	Tg	CTE-z	εr, Dk- Permittivity	Electric strength	Surface resistivity	CTI	Thermal conductivity	Td value	Peel strength
	°C	ppm/°C	@1GHz	KV/mm	MO	PLC	W/m*K	°C	N/mm
ISOLA IS410 FR4 HTg, CAF-Enhanced	180°	55	4,0	44	8,0 x 10^6	3	0,5	350°	1,2
ISOLA IS420 FR4 HTg, CAF-Enhanced	170°	45	4,0	54	3,0 x 10^6	3	0,4	350°	1,3
ITEQ IT-180A FR4 HTg	175°	45	4,4	45	3,0 x 10^10	-	-	345°	1,4
Shengyi S1000-2 FR4 HTg	180°	45	4,8*	63	7,9 x 10^7	3	-	345°	1,4
ARLON 85N Polyimid HTg	250°	55	4,20*	57	1,6 x 10^9	-	0,2	387°	1,2

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board

Technical options for thick copper circuit boards

Thick copper circuit boards

Final thickness*	Min. conductor width	Min. conductor spacing
105µm	250µm	250µm
140µm	350µm	350µm
210µm	500µm	500µm
400µm**	900µm	900µm

* after electroplating
** only on request
Copper foil thickness	Min. conductor width	Min. conductor spacing
105µm	250µm	250µm
140µm	300µm	300µm
210µm	500µm	500µm
400µm**	900µm	900µm

Additional information