Special production circuit boards

PCB special production

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

Benefit from our experience and contact us, or start an instant pricing calculation:

Our PCB Calculator will show you the most economical price at any time or directly create a PCB inquiry.

High-tech options

  • Sandwich buildup
  • Plated slots
  • Thick copper up to 450µm
  • Circuit board thicknesses up to 7mm
  • Depth milling (Z axis) and backdrill
  • Impedance control
  • Solder-stop: special colours and coatings
  • Aluminium core, with plated contacts
  • Peelable solder-stop
  • ...

Special board types

The following special circuit board types are available from Multi-CB:


Technical options for flexible circuit boards

Flexible circuit boards

 OptionsInclusiveNotes
 DesignOptions1 to 10 layers, plated-throughInclusive-NotesLayer buildup
 Conductor width min.Options100µmInclusive100µmNotes 
 Annular ring min.Options100µmInclusive100µmNotes 
 Via min. ØOptions0.15mmInclusive0.2mmNotes 
 SurfacesOptionsChemical gold (recommended),
ENEPIG, chem silver
InclusiveChemical goldNotesSurfaces
 MaterialsOptionsPolyimide, high Tg polyimideInclusivePolyimideNotesMaterials
 Material thicknessOptionsstarting at 25µm foil plus copperInclusive25µm, 50µmNotes 
 Copper thicknessOptionsfrom 18µmInclusive18µm, 35µmNotes 
 StiffenerOptions0.025µm - 3.20mmInclusive0.2mm, 0.3mmNotes 
 Max. sizeOptions250mm x 450mmInclusive-Noteslarger on request
 CoverOptionsCoverlay or flexible solder-stopInclusive-Notes 
 Cover bridge min.OptionsCoverlay: ≥ 350µm
Flex. solder-stop: ≥ 100µm
Inclusive-NotesDesign-Aid
 Impedance controlOptionsYes (10% tolerance)Inclusive-Notes 
 Adhesive tapeOptions3M 9077Inclusive-NotesMaterials

Technical options for Rigid-Flex circuit boards

Rigid-Flex circuit boards

 OptionsNotes
 LayersOptions2 to 24 layers, incl. "flying tails"NotesLayer buildup
 Conductor width min.Options75µm Notes 
 Annular ring min.Options125µm Notes 
 Via min. ØOptions0.1mm Notes 
 SurfacesOptionsChemical gold (recommended), immersion tin, HAL lead-freeNotesSurfaces
 MaterialsOptionsPolyimide, high Tg polyimide, FR4, FR4 high TgNotesMaterials
 Material thicknessOptionsPolyimide starting at 62µm doublesided, FR4 starting at 100µm Notes 
 Max. sizeOptions250mm x 450mm Noteslarger on request
 Solder-stopOptionsCoverlay or flexible solder-stop Notes 

Technical options for metal core circuit boards

Metal core circuit boards

 OptionsInklusiveNotes
 MaterialOptionsAluminium coreInklusive-NotesData sheets
 Max. sizeOptions420mm x 570mmInklusive-Notes 
 DesignOptions1 layer, 2 layers plated-throughInklusive Notes 
 Aluminium thicknessOptions0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mmInklusive1.5mmNotes 
 CopperOptions35µm, 70µm, 105µm, 140µmInklusive35µmNotes 
 Insulation thicknessOptions75µm, 100µm, 125µm, 150µmInklusive100µmNotes 
 Thermal conductivityOptions2.0W/mK - 7.0W/mKInklusive2.0W/mKNotes 
 Conductor width min.Options150µmInklusive150µmNotes 
 Annular ring min.Options125µmInklusive150µmNotes 
 Drill (NPTH) min. ØOptions0.5mmInklusive0.9mmNotesDesign-Aid
 Via min. ØOptions0.2mmInklusive0.2mmNotes 
 SurfaceOptionsHAL lead-free, chemical goldInklusiveHAL lead-freeNotesSurfaces
 Solder-stopOptionswhite, black, green, red, blueInklusivewhite, blackNotes 
 Legend printOptionsblack, whiteInklusive-Notes 
 MillingOptionsyesInklusiveyesNotes 
 V-ScoringOptionsyesInklusiveyesNotesclean & simple
 Z-Axis millingOptionsyesInklusive-Notes 
 RoHS compliantOptionsyesInklusiveyesNotes 
 UL-certifiedOptionsyesInklusiveyesNotesUL certificate

Material metal core 1 layer

Material for metal core boards 1 LayerIMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 1 Layer IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 1 LayerTC-Lam 2.0IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.50PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*5.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerHA50 (3)IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.41PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*4.3PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-200IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.35PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-300IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance0.30PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B3
Ceramic Filled
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity5 x 10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B4
Ceramic Filled
IMS Thermal conductivityThermal conductivity4.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B7
Ceramic Filled
IMS Thermal conductivityThermal conductivity7.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material

Material metal core 2 layers

Material for metal core boards 2 Layers (plated-through)IMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 2 Layers (plated-through) IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 2 Layers (plated-through)Ventec VT-4A2IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventec VT-4B3
Ceramic Filled
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity5 x 10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material


Technical options for High Freqency circuit boards

High Freqency circuit boards

Material for high frequency boardsLeiterplatte TgTgPCB CTE-zCTE-zPCB dielectric constantԐrPCB electric strenghtElectric strenghtPCB surface resistivitySurface resistivityIMS Thermal conductivityThermal conductivityPCB Dk Loss TangentDk Loss TangentPCB Td valueTd valuePCB peel strength KupferhaftungPeel strength
Material for high frequency boards Leiterplatte TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantԐr@10GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityIMS Thermal conductivityThermal conductivityW/m*KPCB Dk Loss TangentDk Loss Tangent@10GHzPCB Td valueTd value°CPCB peel strength KupferhaftungPeel strengthN/mm
Material for high frequency boardsRogers 4350B
HF material
Leiterplatte TgTg280°PCB CTE-zCTE-z32PCB dielectric constantԐr3,5PCB electric strenghtElectric strenght31PCB surface resistivitySurface resistivity5,7 x 10^9IMS Thermal conductivityThermal conductivity0,69PCB Dk Loss TangentDk Loss Tangent0,0037PCB Td valueTd value390°PCB peel strength KupferhaftungPeel strength0,9
Material for high frequency boardsPanasonic Megtron6
HF Material
Leiterplatte TgTg185°PCB CTE-zCTE-z45PCB dielectric constantԐr3,6PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^8IMS Thermal conductivityThermal conductivity-PCB Dk Loss TangentDk Loss Tangent0,004PCB Td valueTd value410°PCB peel strength KupferhaftungPeel strength0,8
Material for high frequency boardsTaconic RF-35
Ceramic
Leiterplatte TgTg315°PCB CTE-zCTE-z64PCB dielectric constantԐr3,5**PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1,5 x 10^8IMS Thermal conductivityThermal conductivity0,24PCB Dk Loss TangentDk Loss Tangent0,0018**PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,8
Material for high frequency boardsTaconic TLX
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z135PCB dielectric constantԐr2,5PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,19PCB Dk Loss TangentDk Loss Tangent0,0019PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsTaconic TLC
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z70PCB dielectric constantԐr3,2PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,24PCB Dk Loss TangentDk Loss Tangent-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3001
Bonding Film for PTFE
Leiterplatte TgTg160°PCB CTE-zCTE-z-PCB dielectric constantԐr2,3PCB electric strenghtElectric strenght98PCB surface resistivitySurface resistivity1 x 10^9IMS Thermal conductivityThermal conductivity0,22PCB Dk Loss TangentDk Loss Tangent0,0030PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3003
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z25PCB dielectric constantԐr3,0PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,50PCB Dk Loss TangentDk Loss Tangent0,0013PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength2,2
Material for high frequency boardsRogers RO3006
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z24PCB dielectric constantԐr6,2PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5IMS Thermal conductivityThermal conductivity0,79PCB Dk Loss TangentDk Loss Tangent0,0020PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsRogers RO3010
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z16PCB dielectric constantԐr10PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5IMS Thermal conductivityThermal conductivity0,95PCB Dk Loss TangentDk Loss Tangent0,0022PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength1,6
Material for high frequency boardsARLON 85N
Polyimide HTg
Leiterplatte TgTg250°PCB CTE-zCTE-z55PCB dielectric constantԐr4,2*PCB electric strenghtElectric strenght57PCB surface resistivitySurface resistivity1,6 x 10^9IMS Thermal conductivityThermal conductivity0,20PCB Dk Loss TangentDk Loss Tangent0,0100*PCB Td valueTd value387°PCB peel strength KupferhaftungPeel strength1,2

Technical options for High-Tg circuit boards

High-Tg circuit boards

Material for High-Tg boardsPCB TgTgPCB CTE-zCTE-zPCB dielectric constant?rPCB electric strenghtElectric strenghtPCB surface resistivitySurface resistivityPCB tracing resistanceCTIIMS Thermal conductivityThermal conductivityPCB Td valueTd valuePCB peel strengthPeel strength
Material for High-Tg boards PCB TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constant?r@1GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityMOPCB tracing resistanceCTIPLCIMS Thermal conductivityThermal conductivityW/m*KPCB Td valueTd value°CPCB peel strengthPeel strengthN/mm
Material for High-Tg boardsISOLA IS410
FR4 HTg, CAF-Enhanced
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constant?r4,0PCB electric strenghtElectric strenght44PCB surface resistivitySurface resistivity8,0 x 10^6PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity0,5PCB Td valueTd value350°PCB peel strengthPeel strength1,2
Material for High-Tg boardsISOLA IS420
FR4 HTg, CAF-Enhanced
PCB TgTg170°PCB CTE-zCTE-z45PCB dielectric constant?r4,0PCB electric strenghtElectric strenght54PCB surface resistivitySurface resistivity3,0 x 10^6PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity0,4PCB Td valueTd value350°PCB peel strengthPeel strength1,3
Material for High-Tg boardsITEQ IT-180A
FR4 HTg
PCB TgTg175°PCB CTE-zCTE-z45PCB dielectric constant?r4,4PCB electric strenghtElectric strenght45PCB surface resistivitySurface resistivity3,0 x 10^10PCB tracing resistanceCTI-IMS Thermal conductivityThermal conductivity-PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsShengyi S1000-2
FR4 HTg
PCB TgTg180°PCB CTE-zCTE-z45PCB dielectric constant?r4,8*PCB electric strenghtElectric strenght63PCB surface resistivitySurface resistivity7,9 x 10^7PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity-PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsARLON 85N
Polyimid HTg
PCB TgTg250°PCB CTE-zCTE-z55PCB dielectric constant?r4,20*PCB electric strenghtElectric strenght57PCB surface resistivitySurface resistivity1,6 x 10^9PCB tracing resistanceCTI-IMS Thermal conductivityThermal conductivity0,2PCB Td valueTd value387°PCB peel strengthPeel strength1,2

* at 1MHz

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board


Technical options for thick copper circuit boards

Thick copper circuit boards

Outer layers

Final thickness*Min. conductor widthMin. conductor spacing
Final thickness*105µmMin. conductor width250µmMin. conductor spacing250µm
Final thickness*140µmMin. conductor width350µmMin. conductor spacing350µm
Final thickness*210µmMin. conductor width500µmMin. conductor spacing500µm
Final thickness*400µm**Min. conductor width900µmMin. conductor spacing900µm

Inner layers

Copper foil thickness Min. conductor widthMin. conductor spacing
Copper foil thickness 105µmMin. conductor width250µmMin. conductor spacing250µm
Copper foil thickness 140µm Min. conductor width300µmMin. conductor spacing300µm
Copper foil thickness 210µm Min. conductor width500µmMin. conductor spacing500µm
Copper foil thickness 400µm** Min. conductor width900µmMin. conductor spacing900µm

* after electroplating
** only on request

Folgende speziellen Leiterplatten-Typen sind bei Multi-CB verfügbar:


Technische Optionen - Flexible-Leiterplatten

Flexible Leiterplatten

 OptionInklusiveHinweise
 AusführungOption1-10 Lagen durchkontaktiertInklusive-HinweiseLagenaufbau
 Leiterbahn min.Option100µmInklusive100µmHinweise 
 Restring min.Option100µmInklusive100µmHinweise 
 Via min. ØOption0.15mmInklusive0.2mmHinweise 
 OberflächenOptionchemisch Gold (empfohlen),
ENEPIG, chem. Silber
Inklusivechemisch GoldHinweiseOberflächen
 MaterialienOptionPolyimid, Polyimid Hoch-TGInklusivePolyimidHinweiseMaterialien
 MaterialdickeOptionab 25µm Folie zzgl. KupferInklusive25µm, 50µmHinweise 
 KupferdickeOptionab 18µmInklusive18µm, 35µmHinweise 
 StiffenerOption0.025mm - 3.2mmInklusive0.2mm, 0.3mmHinweise 
 Max. GrößeOption250mm x 450mmInklusive-Hinweisegrößer a.A.
 AbdeckungOptionPI Coverlay (z.B. mehrere Biegezyklen) oder
flexibler Lötstopp (z.B. stabile Biegung)
InklusivePI coverlay 25µmHinweise 
 Stegbreite min.OptionCoverlay: ≥ 350µm
flexibler Lötstopp: ≥ 100µm
Inklusive-HinweiseDesign-Hilfe
 ImpedanzkontrolleOptionja (10% Toleranz)Inklusive-Hinweise 
 KlebetapeOption3M 9077Inklusive-HinweiseMaterialien

Technische Optionen - Starrflex-Leiterplatten

Starrflex-Leiterplatten

 OptionHinweise
 AusführungOption2-24 Lagen Multilayer, auch "Flying tails"Hinweise Lagenaufbau
 Leiterbahn min.Option75µm Hinweise  
 Restring min.Option125µm Hinweise  
 Via min. ØOption0.1mm Hinweise  
 OberflächenOptionchemisch Gold (empfohlen), chem. Zinn, HAL bleifreiHinweise Oberflächen
 MaterialienOptionPolyimid, Polyimid Hoch-TG, FR4, FR4 Hoch-TGHinweise Materialien
 MaterialdickeOptionPolyimid ab 62µm doppelseitig, FR4 ab 100µm Hinweise  
 Max. GrößeOption250mm x 450mm Hinweise größer a.A.
 AbdeckungOptionCoverlay oder flexibler Lötstopp Hinweise  

Technische Optionen - Metallkern-Leiterplatten

Metallkern-Leiterplatten

 OptionInklusiveHinweise
 MaterialOptionAluminium KernInklusive-HinweiseDatenblätter
 Max. GrößeOption420mm x 570mmInklusive-Hinweise 
 AusführungOption1Lage, 2 Lagen durchkontaktiertInklusive-Hinweise 
 Aluminium DickeOption0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mmInklusive1.5mmHinweise 
 KupferdickeOption35µm, 70µm, 105µm, 140µmInklusive35µmHinweise 
 IsolationsdickeOption75µm, 100µm, 125µm, 150µmInklusive100µmHinweise 
 WärmeleitwertOption2.0W/mK - 7.0W/mKInklusive2.0W/mKHinweise 
 Leiterbahn min.Option150µmInklusive150µmHinweise 
 Restring min.Option125µmInklusive150µmHinweise 
 Bohrung (NDK) min. ØOption0.5mmInklusive0.9mmHinweiseDesign-Hilfe
 Via min. ØOption0.2mmInklusive0.3mmHinweise 
 OberflächeOptionHAL bleifrei, chem. GoldInklusiveHAL bleifreiHinweiseOberflächen
 LötstoppOptionweiß, schwarz, grün, rot, blauInklusiveweiß, schwarzHinweise 
 PositionsdruckOptionschwarz, weißInklusive-Hinweise 
 FräsenOptionjaInklusivejaHinweise 
 RitzenOptionjaInklusivejaHinweiseeinfach & sauber
 Z-Achsen FräsenOptionjaInklusive-Hinweise 
 RoHS-KonformOptionjaInklusivejaHinweise 
 UL-ZertifiziertOptionjaInklusivejaHinweiseUL Zertifikat

Material Metallkern 1 Lage

Material for metal core boards 1 LayerIMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 1 Layer IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 1 LayerTC-Lam 2.0IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.50PCB surface resistivitySurface resistivity10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*5.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerHA50 (3)IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance0.41PCB surface resistivitySurface resistivity10^6PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*4.3PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-200IMS Thermal conductivityThermal conductivity2.0PCB Thermal resistanceThermal resistance0.35PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerAL-300IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance0.30PCB surface resistivitySurface resistivity10^8PCB Dielectric TgDielectric glass transition-Dielectric Breakdown (AC)Dielectric Breakdown (AC)*3.5PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B3
Ceramic Filled
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity5 x 10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B4
Ceramic Filled
IMS Thermal conductivityThermal conductivity4.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition120Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0
Material for metal core boards 1 LayerVentec VT-4B7
Ceramic Filled
IMS Thermal conductivityThermal conductivity7.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition100Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material

Material Metallkern 2 Lagen

Material for metal core boards 2 Layers (plated-through)IMS Thermal conductivityThermal conductivityPCB Thermal resistanceThermal resistancePCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transitionDielectric Breakdown (AC)Dielectric Breakdown (AC)*PCB tracing resistanceCTI
Material for metal core boards 2 Layers (plated-through) IMS Thermal conductivityThermal conductivityW/mKPCB Thermal resistanceThermal resistanceK/WPCB surface resistivitySurface resistivityPCB Dielectric TgDielectric glass transition°CDielectric Breakdown (AC)Dielectric Breakdown (AC)*kVPCB tracing resistanceCTIPLC
Material for metal core boards 2 Layers (plated-through)Ventec VT-4A2IMS Thermal conductivityThermal conductivity2.2PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity2 x 10^7PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*7.5PCB tracing resistanceCTI0
Material for metal core boards 2 Layers (plated-through)Ventec VT-4B3
Ceramic Filled
IMS Thermal conductivityThermal conductivity3.0PCB Thermal resistanceThermal resistance-PCB surface resistivitySurface resistivity5 x 10^8PCB Dielectric TgDielectric glass transition130Dielectric Breakdown (AC)Dielectric Breakdown (AC)*8.0PCB tracing resistanceCTI0

* Examples for 100μm dielectric or 80μm for CCAF material


Technische Optionen - Hochfrequenz-Leiterplatten

Hochfrequenz-Leiterplatten

Material for high frequency boardsLeiterplatte TgTgPCB CTE-zCTE-zPCB dielectric constantԐrPCB electric strenghtElectric strenghtPCB surface resistivitySurface resistivityIMS Thermal conductivityThermal conductivityPCB Dk Loss TangentDk Loss TangentPCB Td valueTd valuePCB peel strength KupferhaftungPeel strength
Material for high frequency boards Leiterplatte TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constantԐr@10GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityIMS Thermal conductivityThermal conductivityW/m*KPCB Dk Loss TangentDk Loss Tangent@10GHzPCB Td valueTd value°CPCB peel strength KupferhaftungPeel strengthN/mm
Material for high frequency boardsRogers 4350B
HF material
Leiterplatte TgTg280°PCB CTE-zCTE-z32PCB dielectric constantԐr3,5PCB electric strenghtElectric strenght31PCB surface resistivitySurface resistivity5,7 x 10^9IMS Thermal conductivityThermal conductivity0,69PCB Dk Loss TangentDk Loss Tangent0,0037PCB Td valueTd value390°PCB peel strength KupferhaftungPeel strength0,9
Material for high frequency boardsPanasonic Megtron6
HF Material
Leiterplatte TgTg185°PCB CTE-zCTE-z45PCB dielectric constantԐr3,6PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^8IMS Thermal conductivityThermal conductivity-PCB Dk Loss TangentDk Loss Tangent0,004PCB Td valueTd value410°PCB peel strength KupferhaftungPeel strength0,8
Material for high frequency boardsTaconic RF-35
Ceramic
Leiterplatte TgTg315°PCB CTE-zCTE-z64PCB dielectric constantԐr3,5**PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1,5 x 10^8IMS Thermal conductivityThermal conductivity0,24PCB Dk Loss TangentDk Loss Tangent0,0018**PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength1,8
Material for high frequency boardsTaconic TLX
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z135PCB dielectric constantԐr2,5PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,19PCB Dk Loss TangentDk Loss Tangent0,0019PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsTaconic TLC
PTFE
Leiterplatte TgTg-PCB CTE-zCTE-z70PCB dielectric constantԐr3,2PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,24PCB Dk Loss TangentDk Loss Tangent-PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3001
Bonding Film for PTFE
Leiterplatte TgTg160°PCB CTE-zCTE-z-PCB dielectric constantԐr2,3PCB electric strenghtElectric strenght98PCB surface resistivitySurface resistivity1 x 10^9IMS Thermal conductivityThermal conductivity0,22PCB Dk Loss TangentDk Loss Tangent0,0030PCB Td valueTd value-PCB peel strength KupferhaftungPeel strength2,1
Material for high frequency boardsRogers RO3003
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z25PCB dielectric constantԐr3,0PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^7IMS Thermal conductivityThermal conductivity0,50PCB Dk Loss TangentDk Loss Tangent0,0013PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength2,2
Material for high frequency boardsRogers RO3006
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z24PCB dielectric constantԐr6,2PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5IMS Thermal conductivityThermal conductivity0,79PCB Dk Loss TangentDk Loss Tangent0,0020PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength1,2
Material for high frequency boardsRogers RO3010
PTFE ceramic-filled
Leiterplatte TgTg-PCB CTE-zCTE-z16PCB dielectric constantԐr10PCB electric strenghtElectric strenght-PCB surface resistivitySurface resistivity1 x 10^5IMS Thermal conductivityThermal conductivity0,95PCB Dk Loss TangentDk Loss Tangent0,0022PCB Td valueTd value500°PCB peel strength KupferhaftungPeel strength1,6
Material for high frequency boardsARLON 85N
Polyimide HTg
Leiterplatte TgTg250°PCB CTE-zCTE-z55PCB dielectric constantԐr4,2*PCB electric strenghtElectric strenght57PCB surface resistivitySurface resistivity1,6 x 10^9IMS Thermal conductivityThermal conductivity0,20PCB Dk Loss TangentDk Loss Tangent0,0100*PCB Td valueTd value387°PCB peel strength KupferhaftungPeel strength1,2

Technische Optionen - Hoch-Tg-Leiterplatten

Hoch-TG-Leiterplatten

Material for High-Tg boardsPCB TgTgPCB CTE-zCTE-zPCB dielectric constant?rPCB electric strenghtElectric strenghtPCB surface resistivitySurface resistivityPCB tracing resistanceCTIIMS Thermal conductivityThermal conductivityPCB Td valueTd valuePCB peel strengthPeel strength
Material for High-Tg boards PCB TgTg°CPCB CTE-zCTE-zppm/°CPCB dielectric constant?r@1GHzPCB electric strenghtElectric strenghtKV/mmPCB surface resistivitySurface resistivityMOPCB tracing resistanceCTIPLCIMS Thermal conductivityThermal conductivityW/m*KPCB Td valueTd value°CPCB peel strengthPeel strengthN/mm
Material for High-Tg boardsISOLA IS410
FR4 HTg, CAF-Enhanced
PCB TgTg180°PCB CTE-zCTE-z55PCB dielectric constant?r4,0PCB electric strenghtElectric strenght44PCB surface resistivitySurface resistivity8,0 x 10^6PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity0,5PCB Td valueTd value350°PCB peel strengthPeel strength1,2
Material for High-Tg boardsISOLA IS420
FR4 HTg, CAF-Enhanced
PCB TgTg170°PCB CTE-zCTE-z45PCB dielectric constant?r4,0PCB electric strenghtElectric strenght54PCB surface resistivitySurface resistivity3,0 x 10^6PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity0,4PCB Td valueTd value350°PCB peel strengthPeel strength1,3
Material for High-Tg boardsITEQ IT-180A
FR4 HTg
PCB TgTg175°PCB CTE-zCTE-z45PCB dielectric constant?r4,4PCB electric strenghtElectric strenght45PCB surface resistivitySurface resistivity3,0 x 10^10PCB tracing resistanceCTI-IMS Thermal conductivityThermal conductivity-PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsShengyi S1000-2
FR4 HTg
PCB TgTg180°PCB CTE-zCTE-z45PCB dielectric constant?r4,8*PCB electric strenghtElectric strenght63PCB surface resistivitySurface resistivity7,9 x 10^7PCB tracing resistanceCTI3IMS Thermal conductivityThermal conductivity-PCB Td valueTd value345°PCB peel strengthPeel strength1,4
Material for High-Tg boardsARLON 85N
Polyimid HTg
PCB TgTg250°PCB CTE-zCTE-z55PCB dielectric constant?r4,20*PCB electric strenghtElectric strenght57PCB surface resistivitySurface resistivity1,6 x 10^9PCB tracing resistanceCTI-IMS Thermal conductivityThermal conductivity0,2PCB Td valueTd value387°PCB peel strengthPeel strength1,2

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board


Technische Optionen - Dickkupfer-Leiterplatten

Dickkupfer-Leiterplatten

Außenlagen

End-Dicke*Leiterbahnbreite min.Leiterbahnabst. min.
End-Dicke*105µmLeiterbahnbreite min.250µmLeiterbahnabst. min.250µm
End-Dicke*140µmLeiterbahnbreite min.350µmLeiterbahnabst. min.350µm
End-Dicke*210µmLeiterbahnbreite min.500µmLeiterbahnabst. min.500µm
End-Dicke*400µm**Leiterbahnbreite min.900µmLeiterbahnabst. min.900µm

Innenlagen

Kupferfolie-DickeLeiterbahnbreite min.Leiterbahnabst. min.
Kupferfolie-Dicke105µmLeiterbahnbreite min.250µmLeiterbahnabst. min.250µm
Kupferfolie-Dicke140µm Leiterbahnbreite min.300µmLeiterbahnabst. min.300µm
Kupferfolie-Dicke210µm Leiterbahnbreite min.500µmLeiterbahnabst. min.500µm
Kupferfolie-Dicke400µm** Leiterbahnbreite min.900µmLeiterbahnabst. min.900µm

* nach Galvanisierung
** nur auf Anfrage