Special production circuit boards

Name: Special production circuit boards
Brand: Multi-CB
Rating: 4.7499415387014 (12829 reviews)

The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.

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High-tech options

Circuit boards up to 48 layers
Finest line starting from 75µm
Film-free laser direct imaging (LDI)
Micro vias starting at 75µm
Blind and buried vias
Laser vias
Via tenting, plugging, filling
Plated half-holes
Thin laminates starting at 50µm core
Custom layer buildup

Sandwich buildup
Plated slots
Thick copper up to 450µm
Circuit board thicknesses up to 7mm
Depth milling (Z axis) and backdrill
Impedance control
Solder-stop: special colours and coatings
Aluminium core, with plated contacts
Peelable solder-stop
...

Design Parameters

Special board types

The following special circuit board types are available from Multi-CB:

Flexible circuit boards (also plated-through)
Rigid-Flex circuit boards
High frequency circuit boards

High Tg circuit boards (high temperature resistance)
Metal core circuit boards (also plated-through)
Thick copper circuit boards

Technical options for flexible circuit boards

Flexible circuit boards

Options	Inclusive	Notes
Design	Options	1 to 10 layers, plated-through	Inclusive	-	Notes	Layer buildup
Conductor width min.	Options	100µm	Inclusive	100µm	Notes
Annular ring min.	Options	100µm	Inclusive	100µm	Notes
Via min. Ø	Options	0.15mm	Inclusive	0.2mm	Notes
Surfaces	Options	Chemical gold (recommended), ENEPIG, chem silver	Inclusive	Chemical gold	Notes	Surfaces
Materials	Options	Polyimide, high Tg polyimide	Inclusive	Polyimide	Notes	Materials
Material thickness	Options	starting at 25µm foil plus copper	Inclusive	25µm, 50µm	Notes
Copper thickness	Options	from 18µm	Inclusive	18µm, 35µm	Notes
Stiffener	Options	0.025µm - 3.20mm	Inclusive	0.2mm, 0.3mm	Notes
Max. size	Options	250mm x 450mm	Inclusive	-	Notes	larger on request
Cover	Options	Coverlay or flexible solder-stop	Inclusive	-	Notes
Cover bridge min.	Options	Coverlay: ≥ 350µm Flex. solder-stop: ≥ 100µm	Inclusive	-	Notes	Design-Aid
Impedance control	Options	Yes (10% tolerance)	Inclusive	-	Notes
Adhesive tape	Options	3M 9077	Inclusive	-	Notes	Materials

Technical options for Rigid-Flex circuit boards

Rigid-Flex circuit boards

Options	Notes
Layers	Options	2 to 24 layers, incl. "flying tails"	Notes	Layer buildup
Conductor width min.	Options	75µm	Notes
Annular ring min.	Options	125µm	Notes
Via min. Ø	Options	0.1mm	Notes
Surfaces	Options	Chemical gold (recommended), immersion tin, HAL lead-free	Notes	Surfaces
Materials	Options	Polyimide, high Tg polyimide, FR4, FR4 high Tg	Notes	Materials
Material thickness	Options	Polyimide starting at 62µm doublesided, FR4 starting at 100µm	Notes
Max. size	Options	250mm x 450mm	Notes	larger on request
Solder-stop	Options	Coverlay or flexible solder-stop	Notes

Technical options for metal core circuit boards

Metal core circuit boards

Options	Inklusive	Notes
Material	Options	Aluminium core	Inklusive	-	Notes	Data sheets
Max. size	Options	420mm x 570mm	Inklusive	-	Notes
Design	Options	1 layer, 2 layers plated-through	Inklusive		Notes
Aluminium thickness	Options	0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm	Inklusive	1.5mm	Notes
Copper	Options	35µm, 70µm, 105µm, 140µm	Inklusive	35µm	Notes
Insulation thickness	Options	75µm, 100µm, 125µm, 150µm	Inklusive	100µm	Notes
Thermal conductivity	Options	2.0W/mK - 7.0W/mK	Inklusive	2.0W/mK	Notes
Conductor width min.	Options	150µm	Inklusive	150µm	Notes
Annular ring min.	Options	125µm	Inklusive	150µm	Notes
Drill (NPTH) min. Ø	Options	0.5mm	Inklusive	0.9mm	Notes	Design-Aid
Via min. Ø	Options	0.2mm	Inklusive	0.2mm	Notes
Surface	Options	HAL lead-free, chemical gold	Inklusive	HAL lead-free	Notes	Surfaces
Solder-stop	Options	white, black, green, red, blue	Inklusive	white, black	Notes
Legend print	Options	black, white	Inklusive	-	Notes
Milling	Options	yes	Inklusive	yes	Notes
V-Scoring	Options	yes	Inklusive	yes	Notes	clean & simple
Z-Axis milling	Options	yes	Inklusive	-	Notes
RoHS compliant	Options	yes	Inklusive	yes	Notes
UL-certified	Options	yes	Inklusive	yes	Notes	UL certificate

Material metal core 1 layer

Material for metal core boards 1 Layer	Thermal conductivity	Thermal resistance	Surface resistivity	Dielectric glass transition	Dielectric Breakdown (AC)*	CTI
Material for metal core boards 1 Layer		Thermal conductivity	W/mK	Thermal resistance	K/W	Surface resistivity	MΩ	Dielectric glass transition	°C	Dielectric Breakdown (AC)*	kV	CTI	PLC
Material for metal core boards 1 Layer	TC-Lam 2.0	Thermal conductivity	2.0	Thermal resistance	0.50	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	5.0	CTI	0
Material for metal core boards 1 Layer	HA50 (3)	Thermal conductivity	2.2	Thermal resistance	0.41	Surface resistivity	10^6	Dielectric glass transition	120	Dielectric Breakdown (AC)*	4.3	CTI	0
Material for metal core boards 1 Layer	AL-200	Thermal conductivity	2.0	Thermal resistance	0.35	Surface resistivity	10^8	Dielectric glass transition	-	Dielectric Breakdown (AC)*	3.5	CTI	0
Material for metal core boards 1 Layer	AL-300	Thermal conductivity	3.0	Thermal resistance	0.30	Surface resistivity	10^8	Dielectric glass transition	-	Dielectric Breakdown (AC)*	3.5	CTI	0
Material for metal core boards 1 Layer	Ventek VT-4B1 flexible	Thermal conductivity	1.0	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 1 Layer	Ventek VT-4B3 limited flexible	Thermal conductivity	3.0	Thermal resistance	-	Surface resistivity	10^8	Dielectric glass transition	130	Dielectric Breakdown (AC)*	9.0	CTI	0

* Examples for 100μm dielectric or 80μm for CCAF material

Material metal core 2 layers

Material for metal core boards 2 Layers (plated-through)	Thermal conductivity	Thermal resistance	Surface resistivity	Dielectric glass transition	Dielectric Breakdown (AC)*	CTI
Material for metal core boards 2 Layers (plated-through)		Thermal conductivity	W/mK	Thermal resistance	K/W	Surface resistivity	MΩ	Dielectric glass transition	°C	Dielectric Breakdown (AC)*	kV	CTI	PLC
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4A2	Thermal conductivity	2.2	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	130	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4B1 flexible	Thermal conductivity	1.0	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4B3 limited flexible	Thermal conductivity	3.0	Thermal resistance	-	Surface resistivity	10^8	Dielectric glass transition	130	Dielectric Breakdown (AC)*	9.0	CTI	0

* Examples for 100μm dielectric or 80μm for CCAF material

Technical options for High Freqency circuit boards

High Freqency circuit boards

Material for high frequency boards	Tg	CTE-z	Ԑr	Electric strenght	Surface resistivity	Thermal conductivity	Dk Loss Tangent	Td value	Peel strength
Material for high frequency boards		Tg	°C	CTE-z	ppm/°C	Ԑr	@10GHz	Electric strenght	KV/mm	Surface resistivity	MΩ	Thermal conductivity	W/m*K	Dk Loss Tangent	@10GHz	Td value	°C	Peel strength	N/mm
Material for high frequency boards	Rogers 4350B HF material	Tg	280°	CTE-z	32	Ԑr	3,5	Electric strenght	31	Surface resistivity	5,7 x 10^9	Thermal conductivity	0,69	Dk Loss Tangent	0,0037	Td value	390°	Peel strength	0,9
Material for high frequency boards	ISOLA IS620 E-fibre glas	Tg	220°	CTE-z	55	Ԑr	4,5*	Electric strenght	-	Surface resistivity	2,8 x 10^6	Thermal conductivity	-	Dk Loss Tangent	0,0080*	Td value	-	Peel strength	1,2
Material for high frequency boards	Taconic RF-35 Ceramic	Tg	315°	CTE-z	64	Ԑr	3,5**	Electric strenght	-	Surface resistivity	1,5 x 10^8	Thermal conductivity	0,24	Dk Loss Tangent	0,0018**	Td value	-	Peel strength	1,8
Material for high frequency boards	Taconic TLX PTFE	Tg	-	CTE-z	135	Ԑr	2,5	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,19	Dk Loss Tangent	0,0019	Td value	-	Peel strength	2,1
Material for high frequency boards	Taconic TLC PTFE	Tg	-	CTE-z	70	Ԑr	3,2	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,24	Dk Loss Tangent	-	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3001 Bonding Film for PTFE	Tg	160°	CTE-z	-	Ԑr	2,3	Electric strenght	98	Surface resistivity	1 x 10^9	Thermal conductivity	0,22	Dk Loss Tangent	0,0030	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3003 PTFE ceramic-filled	Tg	-	CTE-z	25	Ԑr	3,0	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,50	Dk Loss Tangent	0,0013	Td value	500°	Peel strength	2,2
Material for high frequency boards	Rogers RO3006 PTFE ceramic-filled	Tg	-	CTE-z	24	Ԑr	6,2	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductivity	0,79	Dk Loss Tangent	0,0020	Td value	500°	Peel strength	1,2
Material for high frequency boards	Rogers RO3010 PTFE ceramic-filled	Tg	-	CTE-z	16	Ԑr	10	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductivity	0,95	Dk Loss Tangent	0,0022	Td value	500°	Peel strength	1,6
Material for high frequency boards	ARLON 85N Polyimide HTg	Tg	250°	CTE-z	55	Ԑr	4,2*	Electric strenght	57	Surface resistivity	1,6 x 10^9	Thermal conductivity	0,20	Dk Loss Tangent	0,0100*	Td value	387°	Peel strength	1,2

Technical options for High-Tg circuit boards

High-Tg circuit boards

Material for High-Tg boards	Tg	CTE-z	?r	Electric strenght	Surface resistivity	CTI	Thermal conductivity	Td value	Peel strength
Material for High-Tg boards		Tg	°C	CTE-z	ppm/°C	?r	@1GHz	Electric strenght	KV/mm	Surface resistivity	MO	CTI	PLC	Thermal conductivity	W/m*K	Td value	°C	Peel strength	N/mm
Material for High-Tg boards	ISOLA IS410 FR4 HTg, CAF-Enhanced	Tg	180°	CTE-z	55	?r	4,0	Electric strenght	44	Surface resistivity	8,0 x 10^6	CTI	3	Thermal conductivity	0,5	Td value	350°	Peel strength	1,2
Material for High-Tg boards	ISOLA IS420 FR4 HTg, CAF-Enhanced	Tg	170°	CTE-z	45	?r	4,0	Electric strenght	54	Surface resistivity	3,0 x 10^6	CTI	3	Thermal conductivity	0,4	Td value	350°	Peel strength	1,3
Material for High-Tg boards	ITEQ IT-180A FR4 HTg	Tg	175°	CTE-z	45	?r	4,4	Electric strenght	45	Surface resistivity	3,0 x 10^10	CTI	-	Thermal conductivity	-	Td value	345°	Peel strength	1,4
Material for High-Tg boards	Shengyi S1000-2 FR4 HTg	Tg	180°	CTE-z	45	?r	4,8*	Electric strenght	63	Surface resistivity	7,9 x 10^7	CTI	3	Thermal conductivity	-	Td value	345°	Peel strength	1,4
Material for High-Tg boards	ARLON 85N Polyimid HTg	Tg	250°	CTE-z	55	?r	4,20*	Electric strenght	57	Surface resistivity	1,6 x 10^9	CTI	-	Thermal conductivity	0,2	Td value	387°	Peel strength	1,2

* at 1MHz

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board

Technical options for thick copper circuit boards

Thick copper circuit boards

Outer layers

Final thickness*	Min. conductor width	Min. conductor spacing
Final thickness*	105µm	Min. conductor width	250µm	Min. conductor spacing	250µm
Final thickness*	140µm	Min. conductor width	350µm	Min. conductor spacing	350µm
Final thickness*	210µm	Min. conductor width	500µm	Min. conductor spacing	500µm
Final thickness*	400µm**	Min. conductor width	900µm	Min. conductor spacing	900µm

Inner layers

Copper foil thickness	Min. conductor width	Min. conductor spacing
Copper foil thickness	105µm	Min. conductor width	250µm	Min. conductor spacing	250µm
Copper foil thickness	140µm	Min. conductor width	300µm	Min. conductor spacing	300µm
Copper foil thickness	210µm	Min. conductor width	500µm	Min. conductor spacing	500µm
Copper foil thickness	400µm**	Min. conductor width	900µm	Min. conductor spacing	900µm