The economical solution for printed circuit boards with high-tech options, e.g. 1 to 48 layers, lasered vias, via plugging, impedance control, etc.
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The following special circuit board types are available from Multi-CB:
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Design | 1 to 10 layers, plated-through | Notes | Layer buildup | |
| Options | Conductor width min. | 100µm | Notes | ||
| Options | Annular ring min. | 100µm | Notes | ||
| Options | Via min. Ø | 150µm | Notes | ||
| Options | Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Notes | Surfaces | |
| Options | Materials | Polyimide, high Tg polyimide | Notes | Materials | |
| Options | Material thickness | starting at 25µm foil plus copper | Notes | ||
| Options | Copper thickness | from 18µm | Notes | ||
| Options | Stiffener | 0,025µm - 3,20mm | Notes | ||
| Options | Max. size | 250mm x 450mm | Notes | larger on request | |
| Options | Cover | Coverlay or flexible solder-stop | Notes | ||
| Options | Cover bridge | Coverlay: ≥ 200µm | Notes | ||
| Options | Flex. solder-stop: ≥ 100µm | Notes | |||
| Options | Impedance control | Yes (10% tolerance) | Notes | ||
| Options | Adhesive tape | 3M 9077 | Notes | Materials |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Layers | 2 to 24 layers, incl. "flying tails" | Notes | Layer buildup | |
| Options | Conductor width min. | 75µm | Notes | ||
| Options | Annular ring min. | 125µm | Notes | ||
| Options | Via min. Ø | 100µm | Notes | ||
| Options | Surfaces | Chemical gold (recommended), immersion tin, HAL lead-free | Notes | Surfaces | |
| Options | Materials | Polyimide, high Tg polyimide, FR4, FR4 high Tg | Notes | Materials | |
| Options | Material thickness | Polyimide starting at 62µm doublesided, FR4 starting at 100µm | Notes | ||
| Options | Max. size | 250mm x 450mm | Notes | larger on request | |
| Options | Solder-stop | Coverlay or flexible solder-stop | Notes |
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Material | Aluminium core, FR4 prepreg | Notes | Data sheets | |
| Options | Max. size | 230mm x 380mm | Notes | ||
| Options | Aluminium thickness | 1.5mm, 2.0mm | Notes | ||
| Options | Initial copper | 35µm (for 1.5mm), 140µm (for 2.0mm) | Notes | ||
| Options | Surface | HAL lead-free, chemical gold, immersion tin | Notes | Surfaces | |
| Options | RoHS compliant | yes | Notes |
| Technical properties | Unit | KL HA50 (type2) | TC-Lam 1.3 | KL (type3) | Test method | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Technical properties | Data sheet | Unit | - | KL HA50 (type2) | KL HA50 | TC-Lam 1.3 | TC-Lam 1.3 | KL (type3) | KL HA50 | Test method | - |
| Technical properties | Area of application | Unit | - | KL HA50 (type2) | Standard | TC-Lam 1.3 | Standard | KL (type3) | Extended | Test method | - |
| Technical properties | Thermal conductivity factor | Unit | W / m*k | KL HA50 (type2) | 1.6 | TC-Lam 1.3 | 1.3 | KL (type3) | 2.2 | Test method | ASTM-D 5470 |
| Technical properties | Dielectric constant εr | Unit | (bei 1 MHz) | KL HA50 (type2) | 5.3 | TC-Lam 1.3 | - | KL (type3) | 5.5 | Test method | IEC-61189 |
| Technical properties | Surface resistance | Unit | MΩ | KL HA50 (type2) | 1.0 * 10^6 | TC-Lam 1.3 | 1.0 * 10^7 | KL (type3) | 1.0 * 10^6 | Test method | IEC-61189 |
| Technical properties | Thermal durability | Unit | K / W | KL HA50 (type2) | - | TC-Lam 1.3 | 0.77 | KL (type3) | - | Test method | ASTM-E 1225 |
| Technical properties | Glass transition dielectric (Tg) | Unit | °C | KL HA50 (type2) | 122 | TC-Lam 1.3 | 100 | KL (type3) | 122 | Test method | IPC-TM150 |
| Technical properties | Dielectric breakdown (AC)* | Unit | kV | KL HA50 (type2) | 4.0 - 6.0 | TC-Lam 1.3 | 5.0 | KL (type3) | 4.0 - 6.0 | Test method | IPC-TM-650 |
| Technical properties | CTI | Unit | V | KL HA50 (type2) | 600 | TC-Lam 1.3 | 600 | KL (type3) | 600 | Test method | UL746A |
* Depending ondielectric thickness,in this example100µm.
| Options | Notes | ||||
|---|---|---|---|---|---|
| Options | Material | Aluminium core, FR4 prepreg | Notes | Data sheets | |
| Options | Max. size | 800mm x 800mm | Notes | ||
| Options | Aluminium thickness | 0.8mm, 1.0mm, 1.5mm | Notes | in stock | |
| Options | 1.2mm, 2.0mm | Notes | On request | ||
| Options | Basis copper | 18µm, 35µm, 70µm | Notes | ||
| Options | Surface | HAL lead-free, Chemical gold, immersion tin | Notes | Surfaces | |
| Options | RoHS compliant | yes | Notes |
| Technical properties | Unit | CCAF-04 | CCAF-05 | Test method | |||||
|---|---|---|---|---|---|---|---|---|---|
| Technical properties | Data sheet | Unit | - | CCAF-04 | CCAF-04 | CCAF-05 | CCAF-05 | Test method | - |
| Technical properties | Area of application | Unit | - | CCAF-04 | Standard | CCAF-05 | Extended | Test method | - |
| Technical properties | Thermal conductivity factor | Unit | W / m*k | CCAF-04 | 1.5 | CCAF-05 | 2.2 | Test method | ASTM-D 5470 |
| Technical properties | Dielectric constant εr | Unit | (bei 1 MHz) | CCAF-04 | 4.2 | CCAF-05 | 4.24 | Test method | IEC-61189 |
| Technical properties | Surface resistance | Unit | MΩ | CCAF-04 | 5.0 * 10^7 | CCAF-05 | 3.68 * 10^7 | Test method | IEC-61189 |
| Technical properties | Thermal durability | Unit | K / W | CCAF-04 | 0.65 | CCAF-05 | 0.45 | Test method | ASTM-E 1225 |
| Technical properties | Glass transition dielectric (Tg) | Unit | °C | CCAF-04 | - | CCAF-05 | - | Test method | IPC-TM150 |
| Technical properties | Dielectric breakdown (AC)* | Unit | kV | CCAF-04 | 4.0 | CCAF-05 | 6.0 | Test method | IPC-TM-650 |
| Technical properties | CTI | Unit | V | CCAF-04 | 600 | CCAF-05 | 600 | Test method | UL746A |
* Depending ondielectric thickness,in this example100µm.
| Material for High-Tg boards |  Tg |  CTE-z |  εr |  Electric strenght |  Surface resistivity |  CTI |  Td260 |  Td288 |  Td value |  Peel strength | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Material for High-Tg boards | Tg | °C | CTE-z | ppm/°C | εr | @1GHz | Electric strenght | KV/mm | Surface resistivity | MΩ | CTI | PLC | Td260 | min | Td288 | min | Td value | °C | Peel strength | N/mm | |
| Material for High-Tg boards | ISOLA IS410 HTg, CAF-Enhanced | Tg | 180° | CTE-z | 55 | εr | 3,90 | Electric strenght | 50 | Surface resistivity | 8,0 x 10^6 | CTI | PLC 3 | Td260 | 50 | Td288 | 10 | Td value | 350° | Peel strength | 1,2 |
| Material for High-Tg boards | ISOLA IS420 HTg, CAF-Enhanced | Tg | 170° | CTE-z | 45 | εr | 4,17 | Electric strenght | 40 | Surface resistivity | 3,0 x 10^6 | CTI | PLC 3 | Td260 | 60 | Td288 | 15 | Td value | 350° | Peel strength | 1,3 |
| Material for High-Tg boards | ISOLA G200 BT-Epoxy | Tg | 180° | CTE-z | 55 | εr | 3,70 | Electric strenght | 45 | Surface resistivity | 2,2 x 10^6 | CTI | PLC 3 | Td260 | 60 | Td288 | 10 | Td value | 325° | Peel strength | 1,0 |
| Material for High-Tg boards | Shengyi S1000-2 FR4 HTg | Tg | 180° | CTE-z | 45 | εr | 4,80* | Electric strenght | 63 | Surface resistivity | 7,9 x 10^7 | CTI | PLC 3 | Td260 | 60 | Td288 | 20 | Td value | 345° | Peel strength | 1,4 |
| Material for High-Tg boards | ITEQ IT-180A FR4 HTg | Tg | 175° | CTE-z | 45 | εr | 4,40 | Electric strenght | 30 | Surface resistivity | 1 x 10^4 | CTI | - | Td260 | 60 | Td288 | 30 | Td value | 345° | Peel strength | 1,0 |
| Material for High-Tg boards | ARLON 85N Polyimide HTg | Tg | 250° | CTE-z | 55 | εr | - | Electric strenght | 57 | Surface resistivity | 1,6 x 10^9 | CTI | - | Td260 | 60 | Td288 | 60 | Td value | 387° | Peel strength | 1,2 |
*CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board
| Final thickness* | Min. conductor width | Min. conductor spacing | |||
|---|---|---|---|---|---|
| Final thickness* | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
| Final thickness* | 140µm | Min. conductor width | 350µm | Min. conductor spacing | 350µm |
| Final thickness* | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
| Final thickness* | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
| Copper foil thickness | Min. conductor width | Min. conductor spacing | |||
|---|---|---|---|---|---|
| Copper foil thickness | 105µm | Min. conductor width | 250µm | Min. conductor spacing | 250µm |
| Copper foil thickness | 140µm | Min. conductor width | 300µm | Min. conductor spacing | 300µm |
| Copper foil thickness | 210µm | Min. conductor width | 500µm | Min. conductor spacing | 500µm |
| Copper foil thickness | 400µm** | Min. conductor width | 900µm | Min. conductor spacing | 900µm |
* after electroplating
** only on request
