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Testing the layer offset with X-ray technology is very important in the manufacture of multilayer circuit boards. X-ray images are the best (and only) way to identify and correct layer displacements in the pressing process.

Drill holes in multilayer circuit boards are also optimized using X-ray images. Any minor deviations in the geometry of the circuit board image compared to the geometry of the drill hole coordinates will be identified. By changing a correction factor within a clearly defined tolerance range, it can be ensured that the optimum drill reference point will be determined for each axis, with an optimal interpolation for all layers. These corrections take place in the µm range!

Your advantage with Multi-CB is that X-ray is always included for multilayer boards!

For HDI multilayers, the latest CCD-OIR technique is used.