Layer buildups for PCB series

For layer buildups of circuit board series you may use any combination of available prepregs and cores with a moderate surcharge. Please observe rules for layer buildups.

We have following versions of prepregs and cores in stock, therefore making use of those should not extend the production time. Differing layer buildups for circuit board series are possible; please note that nonstandard buildups as well as multiple pressing processes lead to a price adjustment.

We would be happy to advise you on the most economical alternatives.

Standard prepregs

The use of the following prepregs permits a standard layer buildup:

Type	Typical thickness
Type	1080	Typical thickness	78µm
Type	2116	Typical thickness	120µm
Type	7628	Typical thickness	180µm

Standard cores

The use of the following cores permits a standard layer buildup:

Thickness	Copper thickness
Thickness	100µm	Copper thickness	35µm/35µm
Thickness	150µm	Copper thickness	35µm/35µm
Thickness	200µm	Copper thickness	35µm/35µm
Thickness	300µm	Copper thickness	35µm/35µm
Thickness	350µm	Copper thickness	35µm/35µm
Thickness	500µm	Copper thickness	35µm/35µm
Thickness	700µm	Copper thickness	35µm/35µm
Thickness	1000µm	Copper thickness	35µm/35µm
Thickness	1200µm	Copper thickness	35µm/35µm

Sample layer buildups

The following are sample layer buildups for circuit boards series. Since we always manufacture depending on customer specifications, please always consult with our technicians about critical layer buildups (impedances).