Layer buildups for series

For layer buildups of circuit board series you may use any combination of available prepregs and cores with a moderate surcharge. Please observe rules for layer buildups.

We have following versions of prepregs and cores in stock, therefore making use of those should not extend the production time. Differing layer buildups for circuit board series are possible; please note that nonstandard buildups as well as multiple pressing processes lead to a price adjustment.

We would be happy to advise you on the most economical alternatives.

Standard prepregs

The use of the following prepregs permits a standard layer buildup:

Type Typical thickness
Type1080Typical thickness78µm
Type2116Typical thickness120µm
Type7628Typical thickness180µm

Standard cores

The use of the following cores permits a standard layer buildup:

Thickness Copper thickness
Thickness100µmCopper thickness35µm/35µm
Thickness150µmCopper thickness35µm/35µm
Thickness200µmCopper thickness35µm/35µm
Thickness300µmCopper thickness35µm/35µm
Thickness350µmCopper thickness35µm/35µm
Thickness500µmCopper thickness35µm/35µm
Thickness700µmCopper thickness35µm/35µm
Thickness1000µmCopper thickness35µm/35µm
Thickness1200µmCopper thickness35µm/35µm

Sample layer buildups

The following are sample layer buildups for circuit boards series. Since we always manufacture depending on customer specifications, please always consult with our technicians about critical layer buildups (impedances).

Sample layer buildup for 4 layers

4 layer printed circuit layer buildup

Sample layer buildup for 6 layers

6 layer printed circuit layer buildup

Sample layer buildup for 8 layers

8 layer printed circuit layer buildup