For layer buildups of circuit board series you may use any combination of available prepregs and cores with a moderate surcharge. Please observe rules for layer buildups. We would be happy to advise you.
We have following versions of prepregs and cores in stock, therefore making use of those should not extend the production time.Please note that nonstandard buildups, as well as multiple pressing processes lead to a price adjustment.
For 4, 6 and 8 layers, we recommend defined layer buildups as the most favorable solution.
Standard prepregs
The use of the following prepregs permits a standard layer buildup:
| Type | Typical thickness |
|---|---|
| 1080 | 78µm |
| 2116 | 120µm |
| 7628 | 180µm |
Standard cores
The use of the following cores permits a standard layer buildup:
| Thickness | Copper thickness |
|---|---|
| 100µm | 35µm/35µm |
| 150µm | 35µm/35µm |
| 200µm | 35µm/35µm |
| 300µm | 35µm/35µm |
| 350µm | 35µm/35µm |
| 500µm | 35µm/35µm |
| 700µm | 35µm/35µm |
| 1000µm | 35µm/35µm |
| 1200µm | 35µm/35µm |
Additional information:
- Design-Rules for layer buildups
- Available prepregs, cores, and foils
- Standard layer buildup
- Flex, Rigid-Flex, Metal Core sample layer buildups
- Prototypes, Series available technology