Layer buildups for series
We have following versions of prepregs and cores in stock, therefore making use of those should not extend the production time. Differing layer buildups for circuit board series are possible; please note that nonstandard buildups as well as multiple pressing processes lead to a price adjustment.
We would be happy to advise you on the most economical alternatives.
The use of the following prepregs permits a standard layer buildup:
The use of the following cores permits a standard layer buildup:
Sample layer buildups
The following are sample layer buildups for circuit boards series. Since we always manufacture depending on customer specifications, please always consult with our technicians about critical layer buildups (impedances).