The FELDER ISO-Cream® "Active-Clear" differs from the basic version ISO-Cream® "Clear" in the degree of activation. The ISO-Cream® "Active-Clear" has a REL1 flux classification and therefore has a low halogen content (<0.15 %) but is still a genuine NoClean paste. In addition to the properties of the basic version ISO-Cream "Clear", special attention was paid in this further development to an optimized spread, especially on "problematic" surfaces such as chem. Gold (ENIG) or chem. Silver.
ISO-Cream®"Active-Clear" offers the user the possibility to also work with a moderate print image or with more oxidized surfaces of PCB and components and still achieve excellent soldering results. The soldering paste is also low in odor and forms almost colorless flux residues, which spread only to a very limited extent. This is particularly interesting for users who have integrated an automatic optical inspection (AOI) into their process.
In addition, ISO-Cream® "Active-Clear" is also free of any thixotropic agents that could reduce viscosity with increasing shear forces. This guarantees a constant viscosity over a long period of use. In laboratory tests the solder paste showed no bridging, no tendency to tombstoning or solder bead formation on bipolar components.