BGA - Ball Grid Array

BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. Common grids are nowadays: 1.27 mm - 1.00 mm - 0.80 mm - 0.50 mm.

With several hundred component connections, the number of „routable" pins is limited per layer. The inner pins of the BGA can only be connected through a via and routed to another layer > DogBone technology.

If the pitch is even smaller, or if traces between the solder pads are necessary, the via-in-pad technology is recommended: The vias are placed directly into the solder pads of the BGA.

Manufacturer's instructions must be followed carefully. These define the elementary connection distances, solder ball diameters and the housing geometries. Other technical details such as technology of the vias or trace -width and -spacing will be specified by the designer. For possible parameters check the following tables.

BGA: Design proposal

The values given are design proposals, values of component data sheets are always preferable.

Pitch	Ø BGA-Pad*	Ø Via-Pad / Via-Drill	Ø Via-Pad**/ Via-Drill	Track-width / -space	Track-width / -space
Pitch		Ø BGA-Pad*		Ø Via-Pad / Via-Drill	Dog-Bone	Ø Via-Pad**/ Via-Drill	Via-in-Pad	Track-width / -space		Track-width / -space
Pitch	1.27mm	Ø BGA-Pad*	550µm	Ø Via-Pad / Via-Drill	550µm/300µm	Ø Via-Pad**/ Via-Drill	-	Track-width / -space	150µm/285µm	Track-width / -space	150µm/140µm
Pitch	1.00mm	Ø BGA-Pad*	500µm	Ø Via-Pad / Via-Drill	500µm/200µm	Ø Via-Pad**/ Via-Drill	-	Track-width / -space	150µm/175µm	Track-width / -space	100µm/100µm
Pitch	0.80mm	Ø BGA-Pad*	350µm	Ø Via-Pad / Via-Drill	450µm/150µm	Ø Via-Pad**/ Via-Drill	400µm/200µm	Track-width / -space	150µm/100µm	Track-width / -space	70µm/70µm
Pitch	0.50mm	Ø BGA-Pad*	250µm	Ø Via-Pad / Via-Drill	250µm/100µm	Ø Via-Pad**/ Via-Drill	300µm/100µm	Track-width / -space	70µm/90µm	Track-width / -space	-
Pitch	0.40mm	Ø BGA-Pad*	see below	Ø Via-Pad / Via-Drill	see below	Ø Via-Pad**/ Via-Drill	see below	Track-width / -space	see below	Track-width / -space	see below

*plus 50µm circumferential solder-stop clearance
**plus 50µm circumferential solder-stop clearance, please order as IPC 4761 Type VII: Filled & Capped Vias

Die angegebenen Werte sind Design-Vorschläge, Werte aus Bauteil-Datenblättern sind immer vorzuziehen.

Pitch	Ø BGA-Pad*	Ø Via-Pad / Via-Drill	Ø Via-Pad**/ Via-Drill	Leiter-Breite / -Abstand	Leiter-Breite / -Abstand
Pitch		Ø BGA-Pad*		Ø Via-Pad / Via-Drill	Dog-Bone	Ø Via-Pad**/ Via-Drill	Via-in-Pad	Leiter-Breite / -Abstand		Leiter-Breite / -Abstand
Pitch	1.27mm	Ø BGA-Pad*	550µm	Ø Via-Pad / Via-Drill	550µm/300µm	Ø Via-Pad**/ Via-Drill	-	Leiter-Breite / -Abstand	150µm/285µm	Leiter-Breite / -Abstand	150µm/140µm
Pitch	1.00mm	Ø BGA-Pad*	500µm	Ø Via-Pad / Via-Drill	500µm/200µm	Ø Via-Pad**/ Via-Drill	-	Leiter-Breite / -Abstand	150µm/175µm	Leiter-Breite / -Abstand	100µm/100µm
Pitch	0.80mm	Ø BGA-Pad*	350µm	Ø Via-Pad / Via-Drill	450µm/150µm	Ø Via-Pad**/ Via-Drill	400µm/200µm	Leiter-Breite / -Abstand	150µm/100µm	Leiter-Breite / -Abstand	70µm/70µm
Pitch	0.50mm	Ø BGA-Pad*	250µm	Ø Via-Pad / Via-Drill	250µm/100µm	Ø Via-Pad**/ Via-Drill	300µm/100µm	Leiter-Breite / -Abstand	70µm/90µm	Leiter-Breite / -Abstand	-
Pitch	0.40mm	Ø BGA-Pad*	s.u.	Ø Via-Pad / Via-Drill	s.u.	Ø Via-Pad**/ Via-Drill	s.u.	Leiter-Breite / -Abstand	-	Leiter-Breite / -Abstand	-

*zzgl.50µm Lötstopp-Freistellung umlaufend
**zzgl. 50µm Lötstopp-Freistellung umlaufend, sollte als IPC 4761 Typ VII: Filled & Capped Vias bestellt werden

BGA Dogbone - Detail

Outer layers

Außenlagen

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
a	Pitch =	Ø BGA Pad (solder pad)	1.27mm	550µm	1.00mm	500µm	0.80mm	350µm	0.50mm	250µm
b	Pitch =	Solder-stop (SS) clearance, circumferential	1.27mm	75µm	1.00mm	75µm	0.80mm	75µm	0.50mm	75µm
c	Pitch =	Ø Solder-stop clearance	1.27mm	700µm	1.00mm	650µm	0.80mm	500µm	0.50mm	400µm
d	Pitch =	Stringer length (approx.)	1.27mm	348µm	1.00mm	207µm	0.80mm	165µm	0.50mm	103µm
e	Pitch =	Ø Via Pad	1.27mm	550µm	1.00mm	500µm	0.80mm	450µm	0.50mm	250µm
f	Pitch =	Ø Via Pad drill (final)	1.27mm	300µm	1.00mm	200µm	0.80mm	150µm	0.50mm	100µm
g	Pitch =	Via Pad <> BGA Pad	1.27mm	348µm	1.00mm	207µm	0.80mm	165µm	0.50mm	103µm
h	Pitch =	Stringer width	1.27mm	250µm	1.00mm	250µm	0.80mm	200µm	0.50mm	150µm
i	Pitch =	SS clearance <> SS clearance	1.27mm	570µm	1.00mm	350µm	0.80mm	300µm	0.50mm	100µm
j	Pitch =	Via Pad <> Via Pad	1.27mm	720µm	1.00mm	500µm	0.80mm	350µm	0.50mm	250µm

The values given are design proposals, values of component data sheets are always preferable.

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
a	Pitch =	Ø BGA Pad (Löt-Pad)	1.27mm	550µm	1.00mm	500µm	0.80mm	350µm	0.50mm	250µm
b	Pitch =	Lötstopp (LS) Freistellung, umlaufend	1.27mm	75µm	1.00mm	75µm	0.80mm	75µm	0.50mm	75µm
c	Pitch =	Ø Lötstopp Freistellung	1.27mm	700µm	1.00mm	650µm	0.80mm	500µm	0.50mm	400µm
d	Pitch =	Verbinder Länge (ca.)	1.27mm	348µm	1.00mm	207µm	0.80mm	165µm	0.50mm	103µm
e	Pitch =	Ø Via Pad	1.27mm	550µm	1.00mm	500µm	0.80mm	450µm	0.50mm	250µm
f	Pitch =	Ø Via Pad Drill (final)	1.27mm	300µm	1.00mm	200µm	0.80mm	150µm	0.50mm	100µm
g	Pitch =	Via Pad <> BGA Pad	1.27mm	348µm	1.00mm	207µm	0.80mm	165µm	0.50mm	103µm
h	Pitch =	Verbinder Breite	1.27mm	250µm	1.00mm	250µm	0.80mm	200µm	0.50mm	150µm
i	Pitch =	LS Freistellung <> LS Freisstellung	1.27mm	570µm	1.00mm	350µm	0.80mm	300µm	0.50mm	100µm
j	Pitch =	Via Pad <> Via Pad	1.27mm	720µm	1.00mm	500µm	0.80mm	350µm	0.50mm	250µm

Die angegebenen Werte sind Design-Vorschläge, Werte aus Bauteil-Datenblättern sind immer vorzuziehen.

Innenlagen

Fan-Out mit 1 Leiterbahn

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
e	Pitch =	Ø Via Pad	1.27mm	670µm	1.00mm	550µm	0.80mm	425µm	0.50mm	260µm
b	Pitch =	Ø Via Pad Drill	1.27mm	300µm	1.00mm	250µm	0.80mm	150µm	0.50mm	100µm
k	Pitch =	Leiter-Breite	1.27mm	200µm	1.00mm	150µm	0.80mm	125µm	0.50mm	80µm
l	Pitch =	Leiter-Abstand	1.27mm	200µm	1.00mm	150µm	0.80mm	125µm	0.50mm	80µm

Inner layers

Fan-Out with 1 track

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
e	Pitch =	Ø Via Pad	1.27mm	670µm	1.00mm	550µm	0.80mm	425µm	0.50mm	260µm
b	Pitch =	Ø Via Pad Drill	1.27mm	300µm	1.00mm	250µm	0.80mm	150µm	0.50mm	100µm
k	Pitch =	Track Width	1.27mm	200µm	1.00mm	150µm	0.80mm	125µm	0.50mm	80µm
l	Pitch =	Track Space	1.27mm	200µm	1.00mm	150µm	0.80mm	125µm	0.50mm	80µm

Inner layers

Fan-Out with 2 tracks

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
e	Pitch =	Ø Via Pad	1.27mm	620µm	1.00mm	485µm	0.80mm	300µm	0.50mm	-
b	Pitch =	Ø Via Pad Drill	1.27mm	300µm	1.00mm	250µm	0.80mm	150µm	0.50mm	-
k	Pitch =	Track Width	1.27mm	125µm	1.00mm	100µm	0.80mm	100µm	0.50mm	-
l	Pitch =	Track Space	1.27mm	125µm	1.00mm	100µm	0.80mm	100µm	0.50mm	-

Inner layers

Fan-Out with 3 tracks

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
e	Pitch =	Ø Via Pad	1.27mm	550µm	1.00mm	460µm	0.80mm	275µm	0.50mm	-
b	Pitch =	Ø Via Pad Drill	1.27mm	250µm	1.00mm	200µm	0.80mm	100µm	0.50mm	-
k	Pitch =	Track Width	1.27mm	100µm	1.00mm	75µm	0.80mm	75µm	0.50mm	-
l	Pitch =	Track Space	1.27mm	100µm	1.00mm	75µm	0.80mm	75µm	0.50mm	-

Innenlagen

Fan-Out mit 2 Leiterbahnen

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
e	Pitch =	Ø Via Pad	1.27mm	620µm	1.00mm	485µm	0.80mm	300µm	0.50mm	-
b	Pitch =	Ø Via Pad Drill	1.27mm	300µm	1.00mm	250µm	0.80mm	150µm	0.50mm	-
k	Pitch =	Leiter-Breite	1.27mm	125µm	1.00mm	100µm	0.80mm	100µm	0.50mm	-
l	Pitch =	Leiter-Abstand	1.27mm	125µm	1.00mm	100µm	0.80mm	100µm	0.50mm	-

Innenlagen

Fan-Out mit 3 Leiterbahnen

Pitch =	1.27mm	1.00mm	0.80mm	0.50mm
e	Pitch =	Ø Via Pad	1.27mm	550µm	1.00mm	460µm	0.80mm	275µm	0.50mm	-
b	Pitch =	Ø Via Pad Drill	1.27mm	250µm	1.00mm	200µm	0.80mm	100µm	0.50mm	-
k	Pitch =	Leiter-Breite	1.27mm	100µm	1.00mm	75µm	0.80mm	75µm	0.50mm	-
l	Pitch =	Leiter-Abstand	1.27mm	100µm	1.00mm	75µm	0.80mm	75µm	0.50mm	-

BGA 0.4mm Pitch

The PCB design for BGA with 0.4mm pitch is special production and requires the use of HDI-Technology and Via-in-Pad. Please always consult our technical department.