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Layout examples for impedance

Printed Circuit Board impedance examples

With our cost-free defined layer buildups and the following layout examples for impedances, you can approximately achieve your desired values for impedances.

All values given are average values based on our many years of experience and serve as a basic orientation. The actual values depend on the individual PCB layout and the chosen manufacturing technology.

Below you will also find impedance examples for Rogers / FR4 hybrid layer buildup. Due to the material mix, you have Rogers quality in the high-frequency layers and at the same time a favourable price due to the FR4 core.

Download: Multi-CB Defined layer buildup (4, 6, 8 layers) and layout examples for impedance

Download: Multi-CB Hybrid layer buildup Rogers/FR4 (4 layers) and layout examples for impedance

On request, we can manufacture your PCB with impedance control (+/- 10% bzw. +/- 5%) and custom layer buildup. For assistance, we provide our impedance calculator.

Impedance examples 4 layers 1.6mm (4L-01)

When using our free Defined layer buildup 4L-01, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

 OhmSignal layerReference layerwidthspacewidth
Single ended50 ΩTOPIN2245µm - -
Differential pairs90 ΩTOPIN2180µm 120µm 180µm
Differential pairs100 ΩTOPIN2120µm 115µm 120µm
Single ended50 ΩBOTIN3245µm - -
Differential pairs90 ΩBOTIN3180µm 120µm 180µm
Differential pairs90 ΩBOTIN3120µm 115µm 120µm

Defined layer buildup 4L-01

4 layer PCB layer buildup impedance 1.6mm
  • Estimated final thickness (+/- 10%): 1,6mm
  • Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.
  • Loss Tangent / Dissipation factor (Df): ca. 0,02
  • Dielectric constant Ԑr for 1x Prepreg 1080: 3,95 

Impedance examples 4 layers 1.0mm (4L-02)

When using our free Defined layer buildup 4L-02, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

OhmSignal layerReference layerwidth|space|width
Single ended50 ΩTOPIN2395µm | - | -
Differential pairs90 ΩTOPIN2230µm | 120µm | 230µm
Differential pairs100 ΩTOPIN2180µm | 130µm | 180µm
Single ended50 ΩBOTIN3395µm | - | -
Differential pairs90 ΩBOTIN3230µm | 120µm | 230µm
Differential pairs100 ΩBOTIN3180µm | 130µm | 180µm

Defined layer buildup 4L-02

4 layer PCB layer buildup impedance 1.0mm
  • Estimated final thickness (+/- 10%): 1,0mm
  • Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.
  • Loss Tangent / Dissipation factor (Df): ca. 0,02
  • Dielectric constant Ԑr for 1x Prepreg 2116: 4,20 

Impedance examples 6 layers 1.6mm (6L-01)

When using our free Defined layer buildup 6L-01, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

OhmSignal layerReference layerwidth|space|width
Single ended50 ΩTOPIN2395µm | - | -
Differential pairs90 ΩTOPIN2230µm | 120µm | 230µm
Differential pairs100 ΩTOPIN2180µm | 130µm | 180µm
Single ended50 ΩIN3IN2/IN4255µm | - | -
Differential pairs90 ΩIN3IN2/IN4160µm | 145µm | 160µm
Differential pairs100 ΩIN3IN2/IN4135µm | 170µm | 135µm
Single ended50 ΩIN3IN2/IN5320µm | - | -
Differential pairs90 ΩIN3IN2/IN5180µm | 145µm | 180µm
Differential pairs100 ΩIN3IN2/IN5165µm | 195µm | 165µm
Single ended50 ΩIN4IN5/IN2320µm | - | -
Differential pairs90 ΩIN4IN5/IN2180µm | 145µm | 180µm
Differential pairs100 ΩIN4IN5/IN2165µm | 195µm | 165µm
Single ended50 ΩIN4IN5/IN3255µm | - | -
Differential pairs90 ΩIN4IN5/IN3160µm | 145µm | 160µm
Differential pairs100 ΩIN4IN5/IN3135µm | 170µm | 135µm
Single ended50 ΩBOTIN5395µm | - | -
Differential pairs90 ΩBOTIN5230µm | 120µm | 230µm
Differential pairs100 ΩBOTIN5180µm | 130µm | 180µm

Defined layer buildup 6L-01

6 layer PCB layer buildup impedance 1.6mm
  • Estimated final thickness (+/- 10%): 1,6mm
  • Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.
  • Loss Tangent / Dissipation factor (Df): ca. 0,02
  • Dielectric constant Ԑr for 1x Prepreg 2116: 4,20 

Impedance examples 8 layers 1.7mm (8L-01)

When using our free Defined layer buildup 8L-01, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

 OhmSignal LayerReference Layerwidthspacewidth
Single ended50 ΩTOPIN2245µm - -
Differential pairs90 ΩTOPIN2180µm 120µm 180µm
Differential pairs100 ΩTOPIN2120µm 115µm 120µm
     
Single ended50 ΩIN3IN2/IN4175µm - -
Differential pairs90 ΩIN3IN2/IN4110µm 110µm 110µm
     
Single ended50 ΩIN3IN2/IN5210µm - -
Differential pairs90 ΩIN3IN2/IN5125µm 115µm 125µm
     
Single ended90 ΩIN4IN3/IN6160µm 130µm 160µm
Differential pairs100 ΩIN4IN3/IN6115µm 135µm 115µm
     
Single ended50 ΩIN4IN3/IN6270µm - -
Differential pairs50 ΩIN5IN3/IN6270µm - -
     
Single ended50 ΩIN6IN7/IN4210µm - -
Differential pairs90 ΩIN6IN7/IN4125µm 115µm 125µm
     
Single ended50 ΩIN6IN7/IN5175µm - -
Differential pairs90 ΩIN6IN7/IN5110µm 110µm 110µm
     
Single ended50 ΩBOTIN7245µm - -
Differential pairs90 ΩBOTIN7180µm 120µm 180µm
Differential pairs100 ΩBOTIN7120µm 115µm 120µm

Defined layer buildup 8L-01

8 layer PCB layer buildup impedance 1.7mm
  • Estimated final thickness (+/- 10%): 1,7mm
  • Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.
  • Loss Tangent / Dissipation factor (Df): ca. 0,02
  • Dielectric constant Ԑr for 1x Prepreg 2116: 4,20
  • Dielectric constant Ԑr for 1x Prepreg 1080: 3,95

Impedance examples 4 layers hybrid 1.55mm (4L-H01)

Rogers 4350B - 168µm core / FR4

When using our free Defined hybrid layer buildup 4L-H01, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

OhmSignal layerReference layerwidth|space|width
Single ended (SE)50 ΩTOPIN2350µm | - | -
SE Coplanar50 ΩTOPIN2315µm | gap = 185µm
Differential pairs90 ΩTOPIN2315µm | 265µm | 315µm
Differential pairs100 ΩTOPIN2230µm | 210µm | 230µm
Single ended (SE)50 ΩBOTIN3350µm | - | -
SE Coplanar50 ΩBOTIN3315µm | gap = 185µm
Differential pairs90 ΩBOTIN3315µm | 265µm | 315µm
Differential pairs100 ΩBOTIN3230µm | 210µm | 230µm

Defined layer buildup 4L-H01 (Rogers 4350B - 168µm core / FR4)

Hybrid layer stackup Rogers FR4 168mm core
  • Estimated final thickness (+/- 10%): 1.55mm
  • Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.
  • Loss Tangent / Dissipation factor (Df): ca. 0.0037

Impedance examples 4 layers hybrid 1.55mm (4L-H02)

Rogers 4350B - 254µm core / FR4

When using our free Defined hybrid layer buildup 4L-H01, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

OhmSignal layerReference layerwidth|space|width
Single ended (SE)50 ΩTOPIN2550µm | - | -
SE Coplanar50 ΩTOPIN2510µm | gap = 320µm
Differential pairs90 ΩTOPIN2520µm | 440µm | 520µm
Differential pairs100 ΩTOPIN2410µm | 370µm | 410µm
Single ended (SE)50 ΩBOTIN3550µm | - | -
SE Coplanar50 ΩBOTIN3510µm | gap = 320µm
Differential pairs90 ΩBOTIN3520µm | 440µm | 520µm
Differential pairs100 ΩBOTIN3410µm | 370µm | 410µm

Defined layer buildup 4L-H02 (Rogers 4350B - 254µm core / FR4)

4 layer hybrid PCB stackup Rogers 4350B - FR4
  • Estimated final thickness (+/- 10%): 1,6mm
  • Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.
  • Loss Tangent / Dissipation factor (Df): ca. 0,02
  • Dielectric constant Ԑr for 1x Prepreg 1080: 3,95 

Additional information: