Design Parameters

Here you can download the  Basic Design Rules incl. Design Parameters.

The following parameters are exemplary for 35μm copper thickness.
For other thicknesses / special production, please contact our technical hotline: +49 (0)8104 628 210.

Index  Standard (min.)Special production(min.)
IndexA, B, C Via, buried via



Component hole:
Annular ring circular + 25µm
 aspect ratio
diameter
via pad
annular ring
Standard (min.)1:10
200µm
400µm
100µm circular
Special production(min.)1:12
150µm
330µm
90µm circular
IndexD Blind Via, mechanical
max. Ø 300µm
 aspect ratio
diameter
via pad
annular ring
Standard (min.)1:1
200µm
400µm
100µm circular
Special production(min.)1:1.2
150µm
350µm
100µm circular
IndexE Blind Via, laser aspect ratio
diameter
via pad
annular ring
Standard (min.)-
-
-
-
Special production(min.)1:1
100µm
280µm
90µm circular*
IndexF Stacked Vias
Disproportional high effort. Please contact our CAM department for alternatives.
 aspect ratio
diameter
via pad
annular ring
Standard (min.)-
-
-
-
Special production(min.)-
-
-
-
IndexG Staggered Vias aspect ratio
diameter
via pad
annular ring
Standard (min.)1:1 - 1:12 **
200µm
400µm
100µm circular
Special production(min.)1:1 - 1:12 **
100µm
300µm
90µm circular
IndexH, I Condutors outer / inner
(see Conductor/copper thickness )
 width
space
Standard (min.)100µm / 100µm
100µm / 100µm
Special production(min.)75µm / 90µm
105µm / 90µm
IndexJ Conductor/pad to milling edge
Conductor/pad to scoring edge
 spaceStandard (min.)200µm
500µm
Special production(min.)200µm
500µm
IndexK Conductor/pad to hole (PTH, NPTH) spaceStandard (min.)200µmSpecial production(min.)200µm
IndexL Solder-stop, green clearance
bridge
Standard (min.)50µm circular
100µm
Special production(min.)25µm circ. (BGA)
80µm
Index  Solder-stop, other colors clearance
bridge
Standard (min.)-
-
Special production(min.)50µm circular
125µm

* Prior data check necessary. ** see Buried Via, Blind Via