The following parameters are exemplary for 35μm copper thickness.
For other thicknesses / special production, please contact our technical hotline: +49 (0)8104 628 210.
| Index | Standard (min.) | Special production(min.) | ||
|---|---|---|---|---|
| A, B, C | Via, buried via Component hole: Annular ring circular + 25µm | aspect ratio diameter via pad annular ring | 1:10 200µm 400µm 100µm circular | 1:12 150µm 330µm 90µm circular |
| D | Blind Via, mechanical max. Ø 300µm | aspect ratio diameter via pad annular ring | 1:1 200µm 400µm 100µm circular | 1:1.2 150µm 350µm 100µm circular |
| E | Blind Via, laser | aspect ratio diameter via pad annular ring | - - - - | 1:1 100µm 280µm 90µm circular* |
| F | Stacked Vias Disproportional high effort. Please contact our CAM department for alternatives. | aspect ratio diameter via pad annular ring | - - - - | - - - - |
| G | Staggered Vias | aspect ratio diameter via pad annular ring | 1:1 - 1:12 ** 200µm 400µm 100µm circular | 1:1 - 1:12 ** 100µm 300µm 90µm circular |
| H, I | Conductors (see Conductor/copper thickness) | width space | 100µm 100µm | 75µm | 90µm 100µm | 90µm |
| J | Conductor/pad to milling edge Conductor/pad to scoring edge | space | 200µm 500µm | 200µm 500µm |
| K | Conductor/pad to hole (PTH, NPTH) | space | 200µm | 200µm |
| L | Solder-stop, green | clearance bridge | 50µm circular 100µm | 25µm circ. (BGA) 80µm |
| Solder-stop, other colors | clearance bridge | - - | 50µm circular 125µm |