Design Parameters

The following parameters are exemplary for 35μm copper thickness. For other thicknesses / critical designs, please contact our technical hotline: +44 (0)1425 489 111.

Marking     Min. dimensions
MarkingA, B, C Via, buried via aspect ratio
final diameter
via pad
annular ring
Min. dimensions1:12
75µm
225µm
75µm circular
MarkingD Blind via, mechanical
max. Ø 400µm
 aspect ratio
final diameter
via pad
annular ring
Min. dimensions1:1
100µm
400µm
150µm circular
MarkingE Blind via, laser
max. Ø 400µm
 aspect ratio
final diameter
via pad
annular ring
Min. dimensions1:1
75µm
225µm
75µm circular*
MarkingF Stacked vias
Should be avoided, due to it`s disproportionately high use of time and effort. Please contact always our CAM department for alternatives.
 aspect ratio
final diameter
via pad
annular ring
Min. dimensions1:1 - 1:12**
100µm
300µm
100µm
MarkingG Staggered vias aspect ratio
final diameter
via pad
annular ring
Min. dimensions1:1 - 1:12**
100µm
300µm
100µm
MarkingH, I Conductors (outer, inner), see Conductor / copper thickness width
space
Min. dimensions75µm
75µm
MarkingJ Conductor / pad to milling edge
Conductor / pad to scoring edge
 spaceMin. dimensions200µm
500µm
MarkingK Conductor / pad to via spaceMin. dimensions200µm
MarkingL Solder-stop clearance
bridge
Min. dimensions50µm circular

* Min. annular ring depends on copper thickness! Please ask for critical designs.
** Aspect ratio depends on Ø. 100µm 1:1, >100µm 1:4, >150µm 1:10, >200µm 1:12