UHDI or ultra-HDI PCBs are the key to the next level of miniaturisation: they enable maximum functional density on a minimum surface area. In direct comparison to conventional HDI PCBs - the multi-CB standard is already at 0.1mm track width, spacing and annular ring - UHDI designs achieve an even higher density of electrical connections.
With conductor tracks and component spacings of less than 50µm and extremely thin dielectrics of less than 70µm, the space requirement is radically reduced. The result: maximum integration density for the most compact electronics applications.
Ultra HDI with Multi-CB
You can rely on our decades of manufacturing experience, state-of-the-art system technology and AI-supported process optimisation to give you a decisive technological edge.
With our special production, we meet the most demanding miniaturisation requirements that go beyond conventional HDI PCBs and address classic UHDI applications.
Even if the most extreme UHDI designs (structure ≤ 50µm) are reserved for specialised niches, we offer you a high-performance and economically attractive solution for your high-density design:
- Ultra-fine conductor tracks: Realise structures with 75µm width at 105µm spacing or with a particularly balanced ratio of 90µm/90µm. This almost doubles the possible track density compared to our 100µm standard.
- Micro-vias by laser: With a minimum drilling diameter of 0.1mm , we enable controlled vertical connection in the smallest of spaces.
- Precise solder stop: For reliable placement of the finest components (e.g. 01005 or fine-pitch BGAs), we offer a minimum solder stop clearance of 30µm with a land width of just 75µm. This prevents soldering errors and ensures the long-term reliability of your assembly.
- Better routing options: Filled & capped vias (IPC 4761 type VII) for via-in-pad solutions as well as stacked and staggered (micro) vias.
What characterises our high-density technology?
In our special production, we realise the most compact designs for you with a wiring density that is far above the industry standard - and at our proven, calculable conditions.
This is achieved by:
- State-of-the-art machines: Use of high-precision laser drilling and imaging processes.
- Consistent automation: For maximum repeat accuracy and process reliability, even with complex multilayers with up to 48 layers.
- Specially developed AI software: Optimum utilisation of the production lines and perfect consideration of your technical parameters - just like our pooling services, only even more precise.
- Comprehensive, seamless quality control: from receipt of the base materials to dispatch.
Technology highlights and processed materials
We use advanced processes to reliably realise the highest wiring densities:
- Ultra-fine conductor technology: structures with conductor tracks and spacings far below 100µm, manufactured using high-resolution processes.
- Special base materials: We process laminate systems with extremely smooth surfaces for maximum signal integrity and thermal stability (Tg150 and higher), customised to your design.
These technologies are the logical addition to our existing service for high-frequency PCBs, for example based on Rogers RO4350B or with hybrid layer construction, and enable reliable high-density solutions even for demanding applications.
Your benefits with Multi-CB as a partner for maximum integration density / UHDI
- High-tech at low cost: Our claim to offer the highest quality at calculable prices also applies to conductor tracks below 100µm. Benefit from our efficient, digitalised process chain.
- Everything from a single source: From high-density prototypes to series production, supplemented by custom-fit SMD stencils - for a smooth assembly process.
- Tested quality: 100% E-test and a thorough design rule check are included with every PCB - for the guaranteed functionality of your complex circuits.
This is possible with us - our specifications for maximum density
With our customised production, we offer you the following technical options that go far beyond our already demanding 100µm standard:
- Conductor width/spacing: 75µm/105µm or 90µm/90µm
- Smallest laser drill diameter: 0.1mm
- Minimum solder-stop clearance: 30µm
- Minimum solder stop web width: 75µm
Do you really need UHDI? - An honest categorisation
The term "ultra-HDI" is currently very popular, but for the vast majority of applications, the extreme level of ≤ 50 µm conductor tracks is simply oversized - and above all uneconomical. Often, even highly complex designs can be reliably realised with our track widths of 75-90 µm and 0.1mm laser vias without having to accept the considerable additional costs and longer delivery times of UHDI custom production. Our approach is not to sell more technology than necessary, but to provide the exact solution that will optimise your project both technically and economically. In a brief comparison of your design requirements with our specialists, we will find out whether our advanced HDI production - with the best price-performance ratio - already offers everything you need. This will save you money and still give you a PCB at the cutting edge of miniaturisation.
Talk to us before you invest too much.
Send us your layout data or a sketch of your requirements - our technicians will check, without obligation, what level of miniaturisation really makes sense for your project. This way, you avoid unnecessary costs and receive a customised production solution. Enquire now without obligation
Ultra HDI (UHDI) printed circuit boards FAQ
UHDI (Ultra High Density Interconnect) refers to PCBs with conductor track widths and spacings of typically ≤ 50µm. The boundary is fluid - the decisive factor is the extremely high wiring density, which is higher than conventional HDI.
We offer advanced high-density PCBs with structures up to 75 µm track width and 0.1 mm laser drill. These parameters are completely sufficient for the vast majority of highly compact designs. True UHDI with ≤ 50 µm is rarely really necessary and causes disproportionately high costs.
Whenever BGA components with a pitch of less than 0.5mm need to be unbraided or several signals need to be routed between the pads. Our technicians will be happy to check which structure size your design actually requires without obligation.
It depends. The next smallest structure class (75-90 µm) is often perfectly adequate and significantly more economical. We don't sell you the most expensive technology, but the right one - and thus save you unnecessary costs.
Send us your layout data or a sketch by email. Our specialists will check free of charge whether our advanced HDI production covers your requirements and create a customised offer - with no detours and no hidden costs.