Search result

1111. PCB Prototypes

1112. PCB Prototypes - Defined layer buildup

Defined layer buildup

1113. Prepregs, cores, foils

For customer layer buildup, please always state the desired final thickness, not just the prepreg.

1114. Printed circuit board materials

Please note: The selected materials may be replaced by technically equivalent or similar products, according to available stocks on hand.

1115. Plated Half-holes - Design Parameters

Design Parameters The following table contains the minimum parameters!

1116. Hybrid layer buildup Rogers / FR4

For high-frequency applications, you can also use our range of other PCB materials, such as Panasonic Megtron6. Contact us, we will be happy to advise you!

1117. Hybrid layer buildup Rogers / FR4

1118. HDI-Printed Circuit Boards - Microvias in HDI circuit boards

Microvias in HDI circuit boards A microvia has typical diameters of 0.15mm (6mil) - 0.1mm (4mil) and can be drilled by laser (standard) or mechanically. Due to a small annular ring of only 0.1mm,…

1119. Hybrid layer buildup Rogers / FR4

* Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers.

1120. Sideplating

For sideplating we recommend the surface ENIG (chemical gold).