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551. Multi-CB newsletter for printed circuit boards  
Subscribe to the Multi-CB Newsletter and benefit from all advantages:  
552. Milling of Printed Circuit Boards  
To hold exactly rectangular parts, the corresponding milled-out portion should also be drilled at the corners; this permits (for example) a precise framing for seven-segment display units.  
553. Conflict minerals - Additional information  
Additional information Multi-CB Position statement on conflict minerals Wikipedia on conflict minerals Our memberships  
554. Conflict minerals  
Multi Circuit Boards is not directly affected by the mentioned regulations. However, these and other initiatives are still important to us. We carefully check our suppliers and also carry out…  
555. Press-Fit technology for Printed Circuits  
For press-fit technology, please send us the manufacturer's data sheet together with your circuit board data and activate the "press-fit technology" option in our circuit board calculator.…  
556. UL Certification - UL certification for Metal core circuit boards  
UL certification for Metal core circuit boards Single-sided and double-sided plated-through metal core circuit boards are also available with the UL certification of Multi-CB (E198312).  
557. Surface finish - Chemical silver  
Chemical silver Chemical silver (also known as immersion silver) is comparable to the surface finish chemical tin, with better properties concerning oxidation and contact applications. However, also…  
558. Surface finish - Chemical tin  
Chemical tin The surface finish chemical tin (also known as immersion tin) is rarely requested anymore for manufacturing reasons. Due to the comparatively rapid oxidation of the copper, the shelf…  
559. Surface finish - Chemical gold (ENIG)  
Chemical gold (ENIG) Chemical gold is also known as immersion gold or ENIG (Electroless Nickel Immersion Gold). Just as with chemical tin and chemical silver, chemical gold is an extremely flat…  
560. Surface finish - HAL lead-free  
HAL lead-free HAL (Hot Air Leveling, also known as HASL = Hot Air Solder Leveling) lead-free is a well-proven method to apply tin as circuit board surface. Every assembler should be able to process…  
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