Especially for quick switching parts with signal rise times of 1 to 2ns, the signal integrity must be guaranteed through good impedance characteristics in the conductor trace connections. For…
Testing the layer offset with X-ray technology is very important in the manufacture of multilayer circuit boards. X-ray images are the best (and only) way to identify and correct layer displacements…
The A.O.I. test verifies the finished conductor trace image for deviations from the Gerber data and finds errors that the E-Test may not discover, such as (for example) narrowed, but still unbroken…
The electrical test (E-Test) for circuit boards is performed after manufacture. Your circuit boards are checked with a flying probe, or for larger series using an adapter E-Test.
The layout is…
The DRC is an in-depth review of your production data, which is carried out by our experienced CAM station engineers before production of your circuit boards or SMD-Stencils even begins.
The…
Symmetric copper distribution in layer buildups
The thicknesses of the copper foil in the layer buildup of your circuit board should always be symmetrically distributed. An asymmetric layer buildup…
Ensure copper symmetry
Large copper areas should be counterbalanced with “copper filling” in the opposite layer.
Also try to distribute your conductor traces as uniformly as possible across the…
