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Up to -70% for 4 layers FR4 1.0mm

Due to the significant increase in demand, now available at low cost in our pooling production: 4 layer multilayer with 1.0mm thickness, FR4 Tg150, surface ENIG (chemical gold).

Benefit from -42% weight and space savings for compact assemblies in ever smaller and lighter devices. This also reduces FR4 resource usage by -42%.

The low-cost pooling FR4 1.0mm fabrication is available for 2 and 4 layers. In addition, FR4 thicknesses from 0.3 to 7mm can be manufactured.

Multi-CB's comprehensive pooling offer is unparalleled in Europe. Here you can find: an overview of all pooling options.

4 layer 1.0mm pool production - always inclusive:

  • Material FR4 1.0mm Tg150, 35µm Cu
  • ENIG surface
  • Conductor width / spacing, annular ring: 0.1mm
  • Drill holes: 0.2mm, unlimited drilling
  • Standard production time from 7 working days
  • Milling, PTH slits
  • E-Test, Design-Rule-Check
  • Solder-stop green, 2x
  • Legend print white, 1x
  • Set-up costs, photo-plot
  • Defined layer buildup 4L-02 (optional)

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Free& Optional: Defined layer buildup (type 4L-02)

including impedance examples

Estimated final thickness (+/- 10%): 1.0mm

4 layers 1.0mm: Type 4L-02 - impedance examples

Loss Tangent / Dissipation factor (Df): ca. 0.02
Dielectric constant Ԑr for 1x Prepreg 2116: 4.20

Download: Multi-CB Defined layer buildup (4, 6, 8 layers) and layout examples for impedance

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