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1231. Conductor / Ampacity - conductor temperature - Formulas for calculating the maximum current

Formulas for calculating the maximum current The formulas we use are based on the results of Oliver Betz (www.oliverbetz.de) and are an approximation from the formulas of the IPC, Design News and…

1232. Ball Grid Array - Additional Information:

Additional Information: Via-in-Pad (see Via Filling) Design Parameters Basic Design Rules as PDF

1233. Ball Grid Array - BGA 0.4mm Pitch - Production example

BGA 0.4mm Pitch - Production example

1234. Ball Grid Array - BGA Dogbone - Detail

BGA Dogbone - Detail

1235. Panel Creation - Additional information

Additional information Scoring Milling Basic Design Rules download

1236. Blind Vias & Buried Vias

Due to the increasing complexity of design structures blind vias and buried vias are increasingly used in high-density circuit boards (HDI-PCB). A blind Via connects exactly one outer layer with…

1237. Imprint - EORI number

EORI number EORI: DE270485253839295

1238. Imprint - Banking account

Banking account Banking account for EUR Commerzbank, Munich Promenadeplatz 7 80333 Muenchen Bavaria, Germany Account no.: 763340700 Sort code: 70040048 IBAN: DE31 700400480763340700 …

1239. Imprint - DUNS

DUNS DUNS-No.: 218183967 (Great Britain)

1240. Imprint - Multi-CB company group

Multi-CB company group