The standard layer buildups for Rigid-Flex circuit boards are as follows. Variations from these defaults are of course also possible, please contact us. We would be happy to provide you with…
A prepreg (from pre-impregnated) is fibreglass impregnated with resin. The resin is pre-dried, but not hardened, so that when it is heated, it flows, sticks, and is completely immersed. Prepregs are…
You can choose between three options for your multilayer buildup:
Variable layer buildup (Standard) - Changing stackup according to availability [free of charge] Defined layer buildup…
Printed Circuit Boards are hygroscopic and can therefore absorb moisture from the air during transport or storage. This moisture can lead to delamination and other damage when soldering the…
The ability of HAL (Hot Air Levelling) circuit board surfaces to fulfil future requirements (such as increased part densities, reduced spacing between pins, etc.) continues to decrease. This is…
In the following the factors influencing the current carrying capacity of circuit boards are named in context with heat development on the conductors, to provide practical guidance for…
In this section of the Design-Aid, we provide all information regarding the PCB surface.
Conductor / Copper thickness informs about the perfect ratio of chosen copper thickness to…
The thermal resistance is a physical quantity and the reciprocal of the thermal conductivity. For heat-critical projects you may possibly need the total thermal resistance of your metal core PCBs.
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A symmetric copper distribution (copper balance) on the circuit board is very important, because asymmetric copper leads to bow and twist effects.
This warping of the form is caused by thermal…
