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1361. Prepregs, cores, foils - Prepregs

Prepregs

1362. Backdrill, Controlled Depth Drilling - Additional information:

Additional information: Blind & Buried Vias Impedance Control Layer buildup

1363. V-Scoring - Additional information

Additional information Milling Backdrill Design Parameters

1364. Milling of Printed Circuit Boards - Additional information

Additional information Plated Half-holes Scoring Backdrill Design Parameters

1365. Press-Fit technology for Printed Circuits - Additional information:

Additional information: Manufacturing tolerances Drills & Throughplating Milling Surface finish

1366. Sideplating - Additional information:

Additional information: Plated Half-holes PCB as panel Milling

1367. Drills & Throughplating - Additional information

Additional information Press-fit technology Blind & Buried Vias Via Covering Manufacturing tolerances Design Parameters

1368. Drying / tempering - Notes

Notes The drying process must be qualified by the assembly company. The recommendations for drying can only be used as a reference or rough guideline. Both the circuit board design as well as

1369. Drying / tempering - Drying of Flex- / Rigid-flex Circuit Boards

Drying of Flex- / Rigid-flex Circuit Boards Flex and Rigid-flex circuit boards (polyimide materials) have increased moisture absorption compared to rigid circuit boards. Drying is therfore absolutely

1370. HAL vs. chemical gold - Additional information

Additional information Possible surface finishes for PCBs Solder-stop parameters Design parameters