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1381. Milling of Printed Circuit Boards - Additional information

Additional information Plated Half-holes Scoring Backdrill Design Parameters

1382. Press-Fit technology for Printed Circuits - Additional information:

Additional information: Manufacturing tolerances Drills & Throughplating Milling Surface finish

1383. Sideplating - Additional information:

Additional information: Plated Half-holes PCB as panel Milling

1384. Drills & Throughplating - Additional information

Additional information Press-fit technology Blind & Buried Vias Via Covering Manufacturing tolerances Design Parameters

1385. Drying / tempering - Notes

Notes The drying process must be qualified by the assembly company. The recommendations for drying can only be used as a reference or rough guideline. Both the circuit board design as well as…

1386. Drying / tempering - Drying of Flex- / Rigid-flex Circuit Boards

Drying of Flex- / Rigid-flex Circuit Boards Flex and Rigid-flex circuit boards (polyimide materials) have increased moisture absorption compared to rigid circuit boards. Drying is therfore…

1387. HAL vs. chemical gold - Additional information

Additional information Possible surface finishes for PCBs Solder-stop parameters Design parameters

1388. Conductor / Ampacity - conductor temperature - Tools and Software

Tools and Software Dr. Johannes Adam (formerly Flomerics) provides an easy to use 3D simulation software for printed circuit boards (TRM), further calculations and services in electronics cooling…

1389. Conductor / Ampacity - conductor temperature - History

History The design guideline IPC-2221 (predecessor document: MILSTD 275) is the default data source for the DC temperature resistance of conductors. The measurements thereto come from the National…

1390. Conductor / Ampacity - conductor temperature - Current carrying capacity of conductors acc. to IPC-2221

Current carrying capacity of conductors acc. to IPC-2221 Maximum current [A] subject to the temperature increase in degrees [°]