Index Type Value min.
A Backdrill Ø 400µm
B Plated-through via Ø 200µm
C Copper clearance 150µm
D Ø-Difference circumf. 100µm
E Backdrill depth 200µm
F D
Multilayer circuit boards comprise outer and inner layers (copper layers) and help to achieve more complex, denser wiring structures. Multilayer circuit boards are pressed from the following compo
In the following you can see the defined layer buildups for PCB prototypes with 4, 6 and 8 layers. These can be selected free of charge in our PCB calculator.
If you wish to have different layer st
For layer buildups of circuit board series you may use any combination of available prepregs and cores with a moderate surcharge. Please observe rules for layer buildups. We would be happy to&nb
The following is an example of the layer buildup of Flexible circuit boards. Usually, these requirements are met. If a special layer buildup is required, please contact us: We will be happy to advise
Possible variants
The standard layer buildups for Rigid-Flex circuit boards are as follows. Variations from these defaults are of course also possible, please contact us. We would be happy to provi
The standard layer buildups for metal core circuit boards are as follows. Please also observe the technical options for metal core circuit boards.
Additional information:
Design-Rules for layer bui
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matri
Printed circuit boards are connected directly to a motherboard (mainboard) using PC / PCI slot connectors. There exist the PC-AT Standard (also called “ISA”) with a pitch of 2.54mm (0.1 inch) and the
SMD-Stencils are precision tools which have to comply with high requirements, as they take a key role in the SMT (surface mount technology) process. We offer following SMD-Stencils: Solder paste s
