Please note: Multi-CB only optimizes your data for the quick clamping frame, selected in the SMD-Stencil Calculator. The frame itself is not part of the offer. As a complete solution…
NPTH-drills - Metal core
PCB thickness Min. drill diameter
0.5mm Metal core 0.7mm (o.r. 0.5mm)
0.8mm Metal core 0.7mm
1.0mm Metal core 0.8mm
1.5mm Metal core 0.9mm
2.0mm Metal core 1.0mm
1 layer Metal core
35µm Cu 70µm Cu
Min. conductor width 150µm 200µm
Min conductor spacing 150µm 200µm
Min. annular ring 125µm 200µm
Min. drill (NPTH) 0.7mm 0.7mm
Min. drill spacing 250µm 250µm
2 layers Metal core (plated-through)
35µm Cu 70µm Cu
Min. conductor width 150µm 200µm
Min conductor spacing 150µm 200µm
Min. annular ring 125µm 200µm
Min. drill(NPTH) 0.7mm 0.7mm
Min. via (PTH)…
Z-axis milling
To bond components directly to the aluminium with thermal compound, Z-axis milling (depth milling) can be used. The isolation / prepreg is removed in this area.
Isolation / Prepreg
The thinner the insulation layer is chosen, the lower the thermal resistance (= better overall thermal resistance). However, it also reduces the breakdown voltage.
