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1789 results:
961. SMD Stencils - Hightech makes it possible  
Hightech makes it possible Thanks to the carbon fiber axis setup, the cutting speed per system is a realistic 20.000 pads per hour. The innovative Real-Time Process Control-System checks each pad…  
962. SMD Stencils  
Please note: Multi-CB only optimizes your data for the quick clamping frame, selected in the SMD-Stencil  Calculator. The frame itself is not part of the offer. As a complete solution…  
963. Metal core - Design parameters  
Design parameters  
964. Metal core - NPTH-drills - Metal core  
NPTH-drills - Metal core PCB thickness Min. drill diameter 0.5mm Metal core 0.7mm (o.r. 0.5mm) 0.8mm Metal core 0.7mm 1.0mm Metal core 0.8mm 1.5mm Metal core 0.9mm 2.0mm Metal core 1.0mm  
965. Metal core - 1 layer Metal core  
1 layer Metal core 35µm Cu 70µm Cu Min. conductor width 150µm 200µm Min conductor spacing 150µm 200µm Min. annular ring 125µm 200µm Min. drill (NPTH) 0.7mm 0.7mm Min. drill spacing 250µm 250µm  
966. Metal core - 2 layers Metal core (plated-through)  
2 layers Metal core (plated-through) 35µm Cu 70µm Cu Min. conductor width 150µm 200µm Min conductor spacing 150µm 200µm Min. annular ring 125µm 200µm Min. drill(NPTH) 0.7mm 0.7mm Min. via (PTH)…  
967. Metal core - Z-axis milling  
Z-axis milling To bond components directly to the aluminium with thermal compound, Z-axis milling (depth milling) can be used. The isolation / prepreg is removed in this area.  
968. Metal core - Thermal conductivity  
Thermal conductivity The given thermal conductivity W/mK always refers to the insulation layer (prepreg) between copper and aluminium.  
969. Metal core - Typical Thermal conductivity figures  
Typical Thermal conductivity figures Material Thermal conductivity Copper 380 W/mK Aluminium 140 – 220 W/mK Prepreg 1 – 8 W/mK  
970. Metal core - Isolation / Prepreg  
Isolation / Prepreg The thinner the insulation layer is chosen, the lower the thermal resistance (= better overall thermal resistance). However, it also reduces the breakdown voltage.  
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