SMD stencils are used for the assembly of printed circuit boards. They usually consist of stainless steel in the typical thickness of 80µm to 250µm. Openings (pads) are cut out by laser, through which solder paste or adhesive is applied onto the circuit board using a squeegee. Depending on the application, it is also called solder paste stencil or adhesive stencil.
The pads of the laser-cut stencils have a slightly tapered opening to the PCB side, thus ensuring an optimal release behavior of the solder paste / adhesive.
SMD-Stencils from Multi-CB