Material for radar circuit boards
Millimetre-wave radar systems place special demands on the PCB material: it is crucial to use ultra-low-loss substrates that both minimise circuit losses and…
Why radar PCBs from Multi-CB
The complexity and variety of technical parameters for high-frequency circuit carriers is enormous. Every application requires customised solutions - whether through…
Technical possibilities for radar circuit boards
The following specifications guarantee optimum performance of your radar systems - from material selection to manufacturing technologies
Frequency…
Radar circuit boards from Multi-CB
With specialised materials, high-precision manufacturing and stringent quality tests, our PCBs meet the critical requirements of modern radar applications - from…
HDI-Printed Circuit Boards definition of terms
Blind Via: Contacting of an outer layer ending on an inner layer Buried Via: Through-hole in the core layers Microvia: Blind Via (coll. also via) with…
State-of-the-art production equipment and over 30 years of experience in printed circuit board technology enable Multi-CB to offer process-reliable, cost-effective solutions for HDI circuit boards!…
Finishing treatment
Inclusive: Finish treatment by double-sided brushing (deburring) of the surface in all four directions, giving reduction of the surface roughness Rz to about 1µm. On request we…
