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1789 results:
321. PC & PCI cards - PC card  
PC card Chamfering of the gold fingers must be avoided; therefore they must have a spacing of min. 0.7mm from the circuit board contour.  
322. Data sheets - Solder-stop  
Solder-stop Data sheet Notes COATES Imagecure XV501T PETERS Elpemer GL 2467 TAIYO PSR-2000 ECLiPSE PETERS SD2955 Peelable solder-stop  
324. Solder-stop peelable - Peelable solder-stop parameters  
Peelable solder-stop parameters Index Blue Mask standard Blue Mask special production Min. width A 0.6mm 0.4mm Min. overlap of copper B 0.6mm 0.4mm Min. distance to copper C 0.6mm 0.4mm Min.…  
325. Our services - Online-Calculator  
Online-Calculator Automatic import of the main PCB parameters from your CAD file Gerber-, ODB++, EAGLE, KiCad and Target files are currently supported In addition, all other common data formats…  
326. Finishing treatment - Finishing treatment machined deburring  
Finishing treatment machined deburring Even for state-of-the-art laser technology, the laser cutting of steel inevitably leads to the smallest burrs, which must be removed before professional…  
327. Blind Vias & Buried Vias - Buried Via  
Buried Via Buried vias are used to create connections of the inner layers, which have no contact with the outer layers. The holes for each connection level must be defined as a separate drill file.…  
328. Blind Vias & Buried Vias - Blind Via  
Blind Via Blind vias are used to connect one outer layer with at least one inner layer. The holes for each connection level must be defined as a separate drill file. The ratio of drill diameter…  
329. Milling of Printed Circuit Boards - Z-axis milling (level milling)  
Z-axis milling (level milling)  
330. Printed circuit board materials  
Various requirements for printed circuit boards make the use of different circuit board substrates necessary.  Whereas for many standard applications the classical FR4 material is sufficient,…  
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