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When using our free Defined layer buildup 4L-01, you will reach the desired impedances e.g. with the following layout parameters (width|space|width):

352. Layout examples for impedance

Estimated final thickness (+/- 10%): 1.0mm Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers. Loss Tangent / Dissipation factor (Df): ca. 0.02 Dielectric…

353. Layout examples for impedance

Estimated final thickness (+/- 10%): 1.6mm Prepreg thicknesses after pressing, at approx. 80% copper utilization on the inner layers. Loss Tangent / Dissipation factor (Df): ca. 0.02 Dielectric…

354. Layout examples for impedance

On request, we can manufacture your PCB with impedance control (+/- 10% bzw. +/- 5%) and custom layer buildup. For assistance, we provide our impedance calculator.

355. Standard layer buildup - Custom layer buildup

Custom layer buildup

356. Hybrid layer buildup Rogers / FR4

Type Typical thickness Copper thickness RO4350B 168µm 18µm/18µm; 35µm/35µm RO4350B 254µm 18µm/18µm; 35µm/35µm RO4350B 508µm 18µm/18µm; 35µm/35µm RO4350B 1524µm 18µm/18µm; 35µm/35µm

357. Hybrid layer buildup Rogers / FR4

Type Typical thickness After pressing* RO4450F approx. 100µm approx. 100µm

358. Hybrid layer buildup Rogers / FR4 - Custom layer buildup

Custom layer buildup The custom layer buildup is special production. You can choose from the following cores and prepregs for a Rogers only layer construction. For hybrid buildups or FR4-only…

359. Backdrill, Controlled Depth Drilling - Stubs in Detail

Stubs in Detail As already mentioned, stubs interfere with the signal integrity of high-frequency circuit boards. Stubs cause unwanted resonant frequency nulls which appear in the insertion loss…

360. Backdrill, Controlled Depth Drilling

min. thickness F (target layer);250µm;300µm;400µm;500µm min thickness G (stub remainder);125µm;150µm;200µm;250µm Tolerance* standard o.r.;± 100µm ± 50µm;± 100µm ± 50µm;± 100µm ± 50µm;±…