Manufacturing
Through setting back the copper shell from the conture, the plating is protected from mechanical damaging. Therefore the plated half-holes can be milled precisely what…
With sideplating of printed circuit boards, the PCB edge is used for technical features of the later assembly. Portions of the printed circuit`s contour but also partial areas within the circuit…
Design Parameters
To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout.
Minimum…
PTH Component holes
For manufacturing reasons, PTH component holes are drilled larger than the final diameter defined by you. The final diameter is only achieved after plating.
You should design…
Attention:
You should design the annular rings as large as possible (annular ring ≥ 125µm). Please specify component holes ≤ 0.5mm with your order! Component holes ≤ 0.6mm must be…
;Aspect Ratio;Ø min.;Ø max.;Via Pad;Annular ring min.*
Blind Via - mechanical;1:1;200µm;300µm;400µm;100µm
⇒ as Special production;1:1.2;150µm;150µm;350µm;100µm
Blind Via -…
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or…
