Custom layer buildup
The custom layer buildup is special production. You can choose from the following cores and prepregs for a Rogers only layer construction.
For hybrid buildups or FR4-only…
Stubs in Detail
As already mentioned, stubs interfere with the signal integrity of high-frequency circuit boards. Stubs cause unwanted resonant frequency nulls which appear in the insertion loss…
min. thickness F (target layer);250µm;300µm;400µm;500µm
min thickness G (stub remainder);125µm;150µm;200µm;250µm
Tolerance* standard o.r.;± 100µm ± 50µm;± 100µm ± 50µm;± 100µm ± 50µm;±…
Required target layer thickness "F" / stub remainder "G"
If you need a special layer buildup, please keep to the following min. layer thickness of the layer in which the drilling stops (F).
If you do not need a special layer buildup, e.g. you are using our defined layer buildups, we will do all the necessary thickness calculations regarding the thickness of "F" and “G”.
Index Type Value min.
A Plated-through via Ø 200µm
B Backdrill Ø 400µm
C Copper clearance 150µm
D Ø-Difference circumf. 100µm
E Backdrill depth 200µm
F…
The backdrill process removes stubs from plated-through-holes (vias). Stubs are the unnecessary / unused portions of vias, which extend further than the last connected inner layer. Stubs can lead…
