PTH Component holes
For manufacturing reasons, PTH component holes are drilled larger than the final diameter defined by you. The final diameter is only achieved after plating.
You should design…
Attention:
You should design the annular rings as large as possible (annular ring ≥ 125µm). Please specify component holes ≤ 0.5mm with your order! Component holes ≤ 0.6mm must be…
;Aspect Ratio;Ø min.;Ø max.;Via Pad;Annular ring min.*
Blind Via - mechanical;1:1;200µm;300µm;400µm;100µm
⇒ as Special production;1:1.2;150µm;150µm;350µm;100µm
Blind Via -…
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or…
Correct layer orientation
In your layout program, the label should appear in the copper as shown in the diagram. As seen from above, the word “TOP” should be legible, the label “BOT” for the bottom…
Problems with layer orientation
Even when your data uniquely defines which layer the top or bottom layer is, the layer orientation cannot be determined without an inscription in the copper, since…
Layer definitions for multilayer
For multilayers, we recommend a continuous label for the layers, as shown in the diagram. Once again, here it is important that the label for the bottom layer…
