Buried Via
Buried vias are used to create connections of the inner layers, which have no contact with the outer layers. The holes for each connection level must be defined as a separate drill file.…
Blind Via
Blind vias are used to connect one outer layer with at least one inner layer. The holes for each connection level must be defined as a separate drill file. The ratio of drill diameter…
Various requirements for printed circuit boards make the use of different circuit board substrates necessary.
Whereas for many standard applications the classical FR4 material is sufficient,…
PCBs are manufactured in a so-called production panel. Circuit boards of different customers with identical specifications can be produced in the same production panel. This grouping of similar…
Multi-CB consistently passes on cost savings to its customers. At the beginning of the year, the price for 4-layer HAL lead-free was already permanently reduced by up to 48.2%.Now, printed circuit…
UL certification of Multi-CB
UL certified circuit boards made by Multi-CB are manufactured using a UL 796 certified process according to ZPMV2 (USA), for FR4-based printed circuit boards we also…
Definitions
1. In these conditions the following terms will have the following meaning: "Company" means Multi Circuit Boards Limited, UK. "Customer" means the customer of the Company. "Contract"…
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