HDI

High-density circuits place special demands on production. Even the use of SMD components and fine structures with conductor track widths <125µm and via diameters<=0.2mm significantly increases the integration density.

You can achieve a further increase with HDI, High Density Interconnect PCBs. Conductor track widths <=100µm, buried vias and blind vias are possible. The characteristic blind vias, sometimes called micro vias, connect the outer layer with the first inner layer. We combine hole diameters <=150µm, pads <=350µm and drills (usually by laser) with an aspect ratio of just under 1:1.

Depending on the arrangement of the vias, the layers are built up in several pressing processes (see Sequential Build Up). Please always clarify the layer structure for micro vias with our technical department; the low aspect ratio requires very thin prepregs or RCC film.